Abstract: A method of manufacturing a wiring substrate of the present invention includes the steps of, preparing a laminated body having such a structure that a peelable metal foil in which a lower metal foil and an upper metal foil are laminated peelably and an opening portion is provided on a peripheral side is pasted onto a supporting body, forming a through hole having a diameter smaller than the opening portion by processing a portion of the supporting body on an inner side of the opening portion to obtain a reference hole having a projection portion in an inside, forming a resin layer on the peelable metal foil and the projection portion in the reference hole to cover a side surface of the opening portion, and then forming a build-up wiring on the resin layer, removing portions of the build-up wiring and the laminated body corresponding to an area containing the opening portion to expose a peeling boundary of the peelable metal foil, peeling the upper metal foil from the lower metal foil at a boundary to separate

Abstract: There are provided the steps of forming, on a substrate 10, a semiconductor layer 12 to be a base of a device, forming each of electrodes 14 to be a source electrode and a drain electrode on a surface of the semiconductor layer 12 provided on the substrate, covering a surface of the substrate 10 having the electrode 14 formed thereon with a resin having an electrical insulating property, thereby forming an insulating layer 16, embossing the insulating layer 16 by using a metal mold, thereby forming an insulating resin film layer 16a on a channel of the semiconductor layer 12, and forming a gate electrode 18 on the insulating resin film layer 16a.

Abstract: A method of manufacturing a wiring substrate of the present invention includes the steps of, preparing a laminated body having such a structure that a peelable metal foil in which a lower metal foil and an upper metal foil are laminated peelably and an opening portion is provided on a peripheral side is pasted onto a supporting body, forming a through hole having a diameter smaller than the opening portion by processing a portion of the supporting body on an inner side of the opening portion to obtain a reference hole having a projection portion in an inside, forming a resin layer on the peelable metal foil and the projection portion in the reference hole to cover a side surface of the opening portion, and then forming a build-up wiring on the resin layer, removing portions of the build-up wiring and the laminated body corresponding to an area containing the opening portion to expose a peeling boundary of the peelable metal foil, peeling the upper metal foil from the lower metal foil at a boundary to separate

Abstract: A semiconductor element having a first external connection terminal is connected to a substrate. The substrate includes a base material and a wiring portion, positioned at the first surface side of the base material. This configuration facilitates the realization of the connection between the first external connection terminal and the wiring portion. The wiring portion is positioned coplanar to the first surface of the base material. The substrate also includes a via portion that is integrally formed with the wiring portion and is arranged to penetrate the base material.

Abstract: There are provided the steps of forming, on a substrate 10, a semiconductor layer 12 to be a base of a device, forming each of electrodes 14 to be a source electrode and a drain electrode on a surface of the semiconductor layer 12 provided on the substrate, covering a surface of the substrate 10 having the electrode 14 formed thereon with a resin having an electrical insulating property, thereby forming an insulating layer 16, embossing the insulating layer 16 by using a metal mold, thereby forming an insulating resin film layer 16a on a channel of the semiconductor layer 12, and forming a gate electrode 18 on the insulating resin film layer 16a.

Abstract: A substrate treating apparatus feeds a treating solution to a substrate while transferring the substrate, and treats the surfaces of the substrate. The substrate treating apparatus includes feed rollers, treating drums, and spray units. The feed rollers transfer the substrate. The treating drums treat the surfaces of the substrate. The spray units feed the treating solution to the substrate. The feed rollers are disposed so as to transfer the substrate with the substrate plane of the substrate being vertically oriented. The treating drums are respectively disposed on the opposite surface sides of the substrate with each outer circumferential surface being in sliding contact with the surface of the substrate. The spray units are disposed on the opposite sides of the direction of transfer of the substrate.

Abstract: A semiconductor device includes a semiconductor element having an electrode formation surface on which an electrode terminal and a re-wiring portion are formed. The re-wiring portion is electrically connected to the electrode terminal. An external terminal made of wire has a base end connected to the re-wiring portion and a distal end extending therefrom. An electrically insulating resin covers the electrode formation surface in such a manner that at least the distal end of the external terminal is exposed outside the insulating resin. During a fabricating process, the electrode formation surface is coated with an electrically insulating resin and then a part of the electrically insulating resin is removed from the distal end of the external connecting terminal to expose the same outside the insulating resin.

Abstract: A semiconductor device includes a semiconductor element having an electrode formation surface on which an electrode terminal and a re-wiring portion are formed. The re-wiring portion is electrically connected to the electrode terminal. An external terminal made of wire has a base end connected to the re-wiring portion and a distal end extending therefrom. An electrically insulating resin covers the electrode formation surface in such a manner that at least the distal end of the external terminal is exposed outside the insulating resin. During a fabricating process, the electrode formation surface is coated with an electrically insulating resin and then a part of the electrically insulating resin is removed from the distal end of the external connecting terminal to expose the same outside the insulating resin.