Abstract: A mask R having a pattern illuminated by exposure light is used in measuring the change in the amount of exposure light, and provides measuring fields 38a and 38b that transit a part of the exposure light. As a result, light exposure control can be carried out accurately and simply while the mask is mounted.

Abstract: A projection exposure method for exposing a substrate through a projection optical system with a predetermined pattern formed on a mask. The method includes the steps of calculating an amount of lateral variation of a pattern image in a direction perpendicular to an optical axis of the projection optical system, determining a distortion produced solely by the projection optical system, obtaining a total expected distortion by a summation of the distortion produced solely by the projection optical system and the calculated variation of the positions at which the image of the pattern of the mask is formed, and exposing the substrate while partially correcting the positions at which the image of the pattern of the mask is formed through the projection optical system based on the total expected distortion.

Abstract: Any deflection of a mask is detected and corrected to ensure a good projection of a mask pattern. When a mask suffers a deflection due to some reasons such as the gravity and/or thermal expansion, the deflection is detected by a mask-deflection detection system and the detection result is supplied to an arithmetic operation unit. The arithmetic operation unit uses the detection result supplied from the mask-deflection detection system so to calculate the magnitude of the deflection, and then calculate a pneumatic-pressure control value for controlling the pneumatic-pressure within a mask-deflection correction unit. The pneumatic-pressure control value is supplied to a pneumatic-pressure control unit, which controls the pneumatic pressure within the air chamber of the mask-deflection correction unit such that the deflection of the mask may be corrected.

Abstract: Transmittances of the optical system are calculated and a predicitive line of time-varying transmittance is calculated. When the exposure is started, the transmittance of the optical system is calculated at the elapsed time of exposure based on the predictive line of time-varying transmittance, and the intensity of exposure light is controlled The illuminance on the wafer can be compensated for depending on the actual variation of the transmittance. The accumulated quantity of exposure light incident to the wafer is regulated to ensure a target exposure dose of the wafer regardless of the variation in the transmittance of an illumination optical system or a projection optical system during exposure.

Abstract: A method and apparatus for exposing an image of a pattern formed in a mask onto a sensitive substrate. The mask is irradiated with an irradiation light. Data is computed relating to the thermal expansion saturation point of the mask due to absorption of the irradiation light. The mask is expanded to the thermal expansion saturation point based on the computed data, and the image of the mask pattern is exposed onto the sensitive substrate.

Abstract: A is a projection exposure apparatus has a light sending optical system exhibiting a high degree of freedom of light sending. The light sending optical system comprises a light introducing system for introducing light beams from a predetermined light source into a substrate stage, and a light irradiating system for irradiating a predetermined area with the light beams introduced into the substrate stage by the light introducing system. The light introducing system and the light irradiating system are mechanically separated but optically connectable only when the substrate stage is in a specified positional relationship with respect to the projection optical system.

Abstract: An exposure apparatus includes a stage, a table mounted on the stage and having a fiduciary mark and a moving mirror, a holder mounted on the stage for holding a substrate, and a temperature control system for regulating heat transfer to the moving mirror and the fiduciary mark and installed in the holder and the table.

Abstract: An exposure apparatus includesan illumination optical system (10, 1, 4) for radiating illumination light (L2) onto a mask (R) so as to expose a mask pattern (5) onto a photosensitive substrate (W),photoelectric detection means (7) for photoelectrically detecting at least some components of the illumination light for illuminating the mask (R) or the photosensitive substrate (W),input means (34) for inputting information associated with an incident angle range of the illumination light incident on a light-receiving surface of the photoelectric detection means (7), andmeasurement means (24) for correcting a level of an output signal from the photoelectric detection means (7) in accordance with the input information, and measuring the intensity of the illumination light incident on the photoelectric detection means (7).