Abstract: A purpose of the present invention is to make it possible, when diagnosing bone marrow edema, to estimate whether bone marrow edema is present in a body part of a subject without using MRI testing using a high-cost MRI device. The present invention is an estimation device that includes a learner that is trained using X-ray images in which the body part is photographed, and learning data including information about whether the body part photographed in the X-ray image has bone marrow edema, the X-ray image in which the body part of the subject is photographed being inputted into the learner, and an estimation result being outputted that relates to the presence of bone marrow edema in the body part photographed in the inputted X-ray image.

Abstract: A device for determining sound source direction includes an array sensor including a plurality of microphones that measures a sound wave, and a processor for calculating a sound pressure in each direction based on sound pressure information of the sound wave obtained by the array sensor and for determining a direction in which the sound pressure is maximum as a direction of sound wave arrival. The plurality of microphones is provided at vertices of two or more concyclic polygons that are on a same plane and that have a same center and are arranged so as to be non-rotationally symmetric as a whole array sensor.

Abstract: A diagnostic imaging support device includes: a learning unit that calculates a feature quantity about each of infectiousness condition and non-infectiousness condition for determining a condition in a determination image of an anterior eye through machine learning on the basis of a learning image of an anterior eye and information about a condition in the learning image.

Abstract: A solid-state imaging device includes an N-type semiconductor layer, an element layer including a photoelectric conversion element and an active element, an interconnect layer providing an interconnect for the active element, and an element isolation trench penetrating the semiconductor layer. The element layer includes a P-type region and an N-type region. A first hole storage layer is formed on a surface of the semiconductor layer on a side opposite to the element layer. A second hole storage layer is formed in contact portions of the semiconductor layer and the element layer with the element isolation trench. The P-type region of the element layer and the first hole storage layer are connected to each other by the second hole storage layer.

Abstract: A solid-state imaging device includes a plurality of pixels two-dimensionally arranged on a semiconductor substrate. Each of the pixels includes at least one shallow light receiving portion formed near a surface of the semiconductor substrate and at least one deep light receiving portion formed under the shallow light receiving portion. One or more of the shallow light receiving portions and the deep light receiving portion are connected to each other so as to form a second light receiving portion. The rest of the shallow light receiving portions forms a first light receiving portion. Excess electric charge in the first light receiving portion is discharged to the deep light receiving portion.

Abstract: A plurality of pixels are two-dimensionally arranged on a semiconductor substrate. Each of the pixels includes: two photodiodes each generating charge by photoelectric conversion; first and second memories spaced apart from each other between the two photodiodes as viewed in cross section; a first readout gate reading charge from the two photodiodes to the first memory; and a second readout gate reading charge from the two photodiodes to the second memory.

Abstract: A solid-state imaging element includes a plurality of shallow light receivers that are arrayed two-dimensionally in the vicinity of the surface of a semiconductor substrate and a plurality of deep light receivers that are arrayed two-dimensionally below the shallow light receivers. The shallow light receivers include visible light image light receivers that photoelectrically convert visible light and infrared light and output signals, and infrared light receivers that photoelectrically convert the infrared light. The infrared light receivers include a first infrared light receiver that is used to correct the signals output from the visible light image light receivers to provide signals of visible light components in the visible light image light receivers and a second infrared light receiver that is connected to the deep light receivers to form a multilayer light receiver.

Abstract: An imaging apparatus includes a first detecting unit configured to detect the trajectory of a first touch operation which is a touch operation which is performed while contact with a touch panel is kept, a setting unit configured to set a touch operation area having a shape according to the trajectory of the first touch operation detected, a second detecting unit configured to detect a second touch operation which is a touch operation on the set touch operation area, and an output control unit 10e configured to control content output on the basis of the detected second touch operation.

Abstract: Disclosed is an extruded noodle having a hole extending therethrough in a longitudinal direction, wherein: the hole closes or contracts during boiling or rehydration in hot water; and the hole in a cross section of the noodle is configured such that a plurality of grooves are formed rotationally symmetrically about a center of the cross section, extending in an outer radial direction from the center of the cross section of the noodle.

Abstract: A semiconductor device includes a first interlayer film formed on an upper surface of a substrate, a first metal wiring line, a second interlayer film, a second metal wiring line, a first via electrically connecting the first metal wiring line and the second metal wiring line, a landing pad embedded in an upper portion of the first interlayer film and penetrating the second interlayer film, and a second via penetrating the substrate and the first interlayer film from a back side of the substrate and connected to the landing pad. The lower surface position of the landing pad is different from that of the first metal wiring line.

Abstract: Disclosed is a method for manufacturing instant noodles using extruded noodles, with each noodle having a hole extending therethrough in a longitudinal direction, wherein the hole closes or contracts during boiling or rehydration in hot water and the hole in a cross section of the noodle is configured such that a plurality of grooves are formed rotationally symmetrically about a center of the cross section, extending in an outer radial direction from the center of the cross section of the noodle.

Abstract: A solid-state imaging element includes a plurality of shallow light receivers that are arrayed two-dimensionally in the vicinity of the surface of a semiconductor substrate and a plurality of deep light receivers that are arrayed two-dimensionally below the shallow light receivers. The shallow light receivers include visible light image light receivers that photoelectrically convert visible light and infrared light and output signals, and infrared light receivers that photoelectrically convert the infrared light. The infrared light receivers include a first infrared light receiver that is used to correct the signals output from the visible light image light receivers to provide signals of visible light components in the visible light image light receivers and a second infrared light receiver that is connected to the deep light receivers to form a multilayer light receiver.

Abstract: The solid-state imaging device according to the present disclosure includes a substrate, a first impurity region of a first conductive type disposed in the substrate, light receiving elements of a second conductive type disposed in the first impurity region, an overflow drain region of the second conductive type disposed below the first impurity region, a second impurity region of the second conductive type configuring, together with the overflow drain region, a drain path for excessive charge from the light receiving elements, and a reflective film.

Abstract: A semiconductor device includes a first interlayer film formed on an upper surface of a substrate, a first metal wiring line, a second interlayer film, a second metal wiring line, a first via electrically connecting the first metal wiring line and the second metal wiring line, a landing pad embedded in an upper portion of the first interlayer film and penetrating the second interlayer film, and a second via penetrating the substrate and the first interlayer film from a back side of the substrate and connected to the landing pad. The lower surface position of the landing pad is different from that of the first metal wiring line.

Abstract: A solid-state imaging device includes a plurality of pixels two-dimensionally arranged on a semiconductor substrate. Each of the pixels includes at least one shallow light receiving portion formed near a surface of the semiconductor substrate and at least one deep light receiving portion formed under the shallow light receiving portion. One or more of the shallow light receiving portions and the deep light receiving portion are connected to each other so as to form a second light receiving portion. The rest of the shallow light receiving portions forms a first light receiving portion. Excess electric charge in the first light receiving portion is discharged to the deep light receiving portion.

Abstract: A central control unit of a terminal apparatus performs control for displaying a plurality of images in a display unit by superimposing them such that at least one of the images can be observed through one or more other images distinguishably, designating one or more of the plurality of images, detecting a user manipulation performed for the plurality of images, and changing the designated one or more images spatially or temporally according to the detected user manipulation while keeping the plurality of images superimposed and displayed.

Abstract: A plurality of pixels are two-dimensionally arranged on a semiconductor substrate. Each of the pixels includes: two photodiodes each generating charge by photoelectric conversion; first and second memories spaced apart from each other between the two photodiodes as viewed in cross section; a first readout gate reading charge from the two photodiodes to the first memory; and a second readout gate reading charge from the two photodiodes to the second memory.

Abstract: A location obtaining unit obtains information on a location of the image capture apparatus during image; a direction obtaining unit obtains direction of an object in an image captured; a device information obtaining unit obtains information on a location of a wireless device that is included by an object during image capture; a distance obtaining unit obtains a distance of the object in the image captured from the image capture apparatus; an object location calculating unit calculates a location of the object based on the information on the location of the image capture apparatus, a direction of the object in the image, and the distance of the object from the image capture apparatus; and an object identifying unit identifies that the object is the object including the wireless device if the location of the object and the location of the wireless device are within a predetermined range.

Abstract: A central control unit of a terminal apparatus performs control for displaying a plurality of images in a display unit by superimposing them such that at least one of the images can be observed through one or more other images distinguishably, designating one or more of the plurality of images, detecting a user manipulation performed for the plurality of images, and changing the designated one or more images spatially or temporally according to the detected user manipulation while keeping the plurality of images superimposed and displayed.

Abstract: An imaging apparatus includes a first detecting unit configured to detect the trajectory of a first touch operation which is a touch operation which is performed while contact with a touch panel is kept, a setting unit configured to set a touch operation area having a shape according to the trajectory of the first touch operation detected, a second detecting unit configured to detect a second touch operation which is a touch operation on the set touch operation area, and an output control unit 10e configured to control content output on the basis of the detected second touch operation.