Abstract: A bipolar transistor includes a collector layer, a base layer, and an emitter layer that are formed in this order on a compound semiconductor substrate. The emitter layer is disposed inside an edge of the base layer in plan view. A base electrode is disposed on partial regions of the emitter layer and the base layer so as to extend from an inside of the emitter layer to an outside of the base layer in plan view. An insulating film is disposed between the base electrode and a portion of the base layer, with the portion not overlapping the emitter layer. An alloy layer extends from the base electrode through the emitter layer in a thickness direction and reaches the base layer. The alloy layer contains at least one element constituting the base electrode and elements constituting the emitter layer and the base layer.

Abstract: The zoom control apparatus configured to control an angle of view. The apparatus includes a motion acquirer configured to acquire a motion amount of an image capturing optical system, a calculator configured to calculate a displacement amount of a main object image in a captured image by using the motion amount of the image capturing optical system, a determiner configured to determine whether or not the displacement amount of the main object image is larger than a first threshold, and a controller configured to perform, when the displacement amount of the main object image is larger than the first threshold, control for making the angle of view wider than that for when the displacement amount of the main object image is smaller than the first threshold.

Abstract: A composition improves mechanical strength (e.g., impact resistance and flexural strength), and achieves improved mass productivity by reducing a situation in which a strand fuzzes during extrusion. The composition includes a conjugated diene-based polymer (A), fibers (B), and a thermoplastic resin (C), the composition including the conjugated diene-based polymer (A) in a ratio of 0.05 to 30 parts by mass based on 100 parts by mass of the thermoplastic resin (C), and including the fibers (B) in a ratio of 3 to 150 parts by mass based on 100 parts by mass of the thermoplastic resin (C), wherein the conjugated diene-based polymer (A) includes at least one functional group selected from the group consisting of an alkoxysilyl group and an amino group.

Abstract: A semiconductor chip includes a semiconductor substrate having a main surface, first and second electrodes, a first insulating layer, and first and second bumps. The first and second electrodes are formed above the main surface of the semiconductor substrate. The first insulating layer is formed above a first portion of the first electrode. The first bump is formed above a second portion of the first electrode and above the first insulating layer and is electrically connected to the first electrode. The second bump is formed above the second electrode. The area of the second bump is larger than that of the first bump in a plan view of the main surface of the semiconductor substrate. The first insulating layer adjusts the distance from the main surface of the semiconductor substrate to the top surface of the first bump in a direction normal to the main surface.

Abstract: An optical connecting device includes: a holder having a first end, a second end, and a through hole extending in a direction of a first axis from one of the first end and the second end to the other; multiple optical fibers held by the holder; a guide member extending in the through hole; and a resin body separating a side face of the guide member from an inner face of the through hole.

Abstract: A compound semiconductor substrate has a first main surface parallel to a first direction and a second direction perpendicular to the first direction, a second main surface located on a side opposite to the first main surface, and a recess. The recess has an opening, a bottom surface facing the opening, and a plurality of side surfaces located between the opening and the bottom surface. The side surfaces include at least one first side surface forming an angle of about ? degrees with the bottom surface in the recess and at least one second side surface forming an angle of about ? degrees with the bottom surface in the recess. The total length of edge lines between the first main surface and the at least one first side surface is larger than that of edge lines between the first main surface and the at least one second side surface.

Abstract: A circuit element is formed on a substrate made of a compound semiconductor. A bonding pad is disposed on the circuit element so as to at least partially overlap the circuit element. The bonding pad includes a first metal film and a second metal film formed on the first metal film. A metal material of the second metal film has a higher Young's modulus than a metal material of the first metal film.

Abstract: An optical apparatus comprises a shake detection unit, a first optical correction unit, a second optical correction unit, a zoom detection unit, a correction amount calculation unit configured to calculate correction amounts to be corrected by the first optical correction unit and the second optical correction unit, and a control unit configured to change a calculation method of the correction amounts according to whether or not zoom lens performs zoom operation, wherein the control unit controls to calculate the correction amounts by calculation of separating a frequency of the shake when the zoom operation is stopped, and to calculate the correction amounts by proportional calculation based on movable ranges of the first optical correction unit and the second optical correction unit when the zoom operation is performed.

Abstract: Provided is a composition capable of providing a formed article that, even when using continuous fibers, has excellent interfacial adhesion between the continuous fibers and a matrix resin, and as a result, has excellent mechanical strength (e.g., impact resistance and flexural strength). One aspect of a composition according to the present invention includes a polymer (A) including an amino group, fibers (B), and a thermoplastic resin (C), in which a content ratio of the fibers (B) is 70 parts by mass or more and 250 parts by mass or less based on 100 parts by mass of the thermoplastic resin (C). Another aspect of the composition according to the present invention includes a polymer (A) including an amino group, a non-woven fabric (B?), and a thermoplastic resin (C).

Abstract: A cutting insert includes: a polygonal shaped upper surface; a lower surface; a side surface connected to each of the upper and lower surfaces; and an upper cutting edge located at the intersection of the upper surface and the side surface. The upper surface alternately includes three major corners and three minor corners. The upper cutting edge includes: a corner cutting edge; a minor cutting edge inclined toward the lower surface as separating from the corner cutting edge at a first inclination angle; and a major cutting edge inclined toward the lower surface as separating from the minor cutting edge at a second inclination angle. The corner cutting edge, the minor cutting edge and the major cutting edge are located sequentially from a first major corner to each of first and second minor corners, both of which are adjacent to the first major corner.

Abstract: A compound semiconductor substrate has a first main surface parallel to a first direction and a second direction perpendicular to the first direction, a second main surface located on a side opposite to the first main surface, and a recess. The recess has an opening, a bottom surface facing the opening, and a plurality of side surfaces located between the opening and the bottom surface. The side surfaces include at least one first side surface forming an angle of about ? degrees with the bottom surface in the recess and at least one second side surface forming an angle of about ? degrees with the bottom surface in the recess. The total length of edge lines between the first main surface and the at least one first side surface is larger than that of edge lines between the first main surface and the at least one second side surface.

Abstract: A semiconductor chip includes a single-crystal substrate and a metal electrode on the bottom surface of the substrate. The metal electrode has a region in which a first metal is exposed and a region in which a second metal is exposed, the second metal having a standard electrode potential different from that of the first metal.

Abstract: A modified conjugated diene-based polymer is produced that is a modified product of a conjugated diene-based polymer obtained by polymerizing a conjugated diene compound, or polymerizing a conjugated diene compound and an aromatic vinyl compound, in the presence of an alkali metal compound or an alkaline-earth metal compound. The modified conjugated diene-based polymer is produced by a production method that includes a main chain modification step that reacts at least either an unsaturated bond or a functional group that is included in a terminal-modified polymer and is not situated at a terminal of the terminal-modified polymer, with a specific compound that includes a functional group that interacts with silica, the terminal-modified polymer being obtained by introducing a functional group that interacts with silica into at least one terminal of the conjugated diene-based polymer.

Abstract: An HBT includes a semiconductor substrate having first and second principal surfaces opposite each other; and a collector layer, a base layer, and an emitter layer stacked in this order on the first principal surface side of the semiconductor substrate. The collector layer includes a first semiconductor layer with metal particles dispersed therein, the metal particles each formed by a plurality of metal atoms bonded with each other.

Abstract: A cutting insert of an embodiment of the present invention includes an upper surface, a lower surface, a side surface connected to each of the upper surface and the lower surface, and an upper cutting edge located at an intersection of the upper surface and the side surface. The lower surface includes a mount part having alternately three first top portions spaced a distance a away from a central axis extending between the upper and lower surfaces and three second top portions spaced a distance b away from the central axis in a bottom view. The mount part further has a concave part including at least the central axis. The second top portions are located closer to the upper surface than the first top portions. A cutting tool with the cutting insert, and a method of manufacturing a machined product by using the cutting tool are also provided.

Abstract: An HBT includes a semiconductor substrate having first and second principal surfaces opposite each other; and a collector layer, a base layer, and an emitter layer stacked in this order on the first principal surface side of the semiconductor substrate. The collector layer includes a first semiconductor layer with metal particles dispersed therein, the metal particles each formed by a plurality of metal atoms bonded with each other.

Abstract: There is provided with an image shake correction device that controls an image correction unit and corrects an image shake of a captured image. The image shake correction device calculates a first correction amount to be used for correcting the image shake while shooting moving images and a second correction amount to be used for correcting the image shake while shooting still images based on a shake detection signal. The image shake correction device selects the correction amount to be used for correcting the image shake from either the first correction amount or the second correction amount and executes a control that updates an intermediate calculation value of the calculation unit corresponding to the correction amount that has not been selected from either the first calculation unit or the second calculation unit, with a value of the correction amount that has been selected.

Abstract: A cutting insert of an embodiment of the present invention includes an upper surface, a lower surface, a side surface connected to each of the upper surface and the lower surface, and an upper cutting edge located at an intersection of the upper surface and the side surface. The lower surface includes a mount part having alternately three first top portions spaced a distance a away from a central axis extending between the upper and lower surfaces and three second top portions spaced a distance b away from the central axis in a bottom view. The mount part further has a concave part including at least the central axis. The second top portions are located closer to the upper surface than the first top portions. A cutting tool with the cutting insert, and a method of manufacturing a machined product by using the cutting tool are also provided.

Abstract: A composition improves mechanical strength (e.g., impact resistance and flexural strength), and achieves improved mass productivity by reducing a situation in which a strand fuzzes during extrusion. The composition includes a conjugated diene-based polymer (A), fibers (B), and a thermoplastic resin (C), the composition including the conjugated diene-based polymer (A) in a ratio of 0.05 to 30 parts by mass based on 100 parts by mass of the thermoplastic resin (C), and including the fibers (B) in a ratio of 3 to 150 parts by mass based on 100 parts by mass of the thermoplastic resin (C), wherein the conjugated diene-based polymer (A) includes at least one functional group selected from the group consisting of an alkoxysilyl group and an amino group.

Abstract: A cutting insert includes: a polygonal shaped upper surface; a lower surface; a side surface connected to each of the upper and lower surfaces; and an upper cutting edge located at the intersection of the upper surface and the side surface. The upper surface alternately includes three major corners and three minor corners. The upper cutting edge includes: a corner cutting edge; a minor cutting edge inclined toward the lower surface as separating from the corner cutting edge at a first inclination angle; and a major cutting edge inclined toward the lower surface as separating from the minor cutting edge at a second inclination angle. The corner cutting edge, the minor cutting edge and the major cutting edge are located sequentially from a first major corner to each of first and second minor corners, both of which are adjacent to the first major corner.