Abstract: A copper or copper alloy sheet strip with a surface coating layer according to an embodiment of the present invention includes: a copper or copper alloy sheet strip as a base metal; and an underlayer and a Cu—Sn alloy layer provided as the surface coating layer on a surface of the base metal in this order, the underlayer including any one or two layers of a Ni layer, a Co layer, and a Fe layer, wherein a surface of the Cu—Sn alloy layer has an arithmetic mean roughness Ra of 0.3 to 3.4 ?m, and a maximum height Rz of 2.2 to 14.4 ?m.

Abstract: An electrically conductive material for a connection component that includes a Cu—Sn alloy coating layer in which a Cu content is 55 to 70 atomic % and has an average thickness of 0.1 to 3.0 ?m, and a Sn coating layer having an average thickness of 0.2 to 5.0 ?m, which are formed in this order on a surface of a base material made of a copper or copper alloy sheet strip. When a reflected electron image of a material surface is observed with a scanning electron microscope at a magnification of 100 times, a region A and a region B having a higher brightness than the region A and in which the Cu—Sn alloy coating layer is not exposed coexist on the material surface, and an area ratio of the region A on the material surface is 2 to 65%.

Abstract: Disclosed herein is a sheet strip including a copper alloy sheet strip, as a base material, and the surface coating layer containing a Ni layer, a Cu—Sn alloy layer and a Sn layer formed on a surface of the copper alloy sheet strip. The copper alloy sheet strip has a structure in which precipitates are dispersed in a copper alloy matrix. The Cu—Sn alloy layer is partially exposed on the outermost surface of the surface coating layer, and a surface exposed area ratio thereof is in a range of 3 to 75%. The Cu—Sn alloy layer contains 1) a ? layer, or 2) a ? phase and a ? phase, the ? phase existing between the Ni layer and the ? phase.

Abstract: A conductive material for connection parts includes a matrix, a Cu—Sn alloy coating layer having a Cu content of 20 to 70 at % and an average thickness of 0.2 to 3.0 ?m and an Sn coating layer having an average thickness of 0.05 to 5.0 ?m. The Cu—Sn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

Abstract: A conductive material for connection parts includes a matrix, a Cu—Sn alloy covering layer having a Cu content of 20 to 70 at % and an average thickness of from 0.2 to 3.0 ?m, and a Sn covering layer having an average thickness of from 0.05 to 5.0 ?m. The matrix is a copper alloy strip containing specified amounts of Fe and P. The Cu—Sn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

Abstract: A copper alloy sheet strip with a surface coating layer, including: a copper alloy sheet strip, as a base material, including copper, 1.0 to 4.5% by mass of Ni and/or Co and 0.2 to 1.0% by mass of Si, based on the total amount of the copper alloy sheet strip; and a surface coating layer including a Ni layer, a Cu—Sn alloy layer and a Sn layer formed on a surface of the copper alloy sheet strip in this order. A Cu—Sn alloy layer is partially exposed on an outermost surface of the surface coating layer such that a surface exposed area ratio is from 3 to 75%. A surface roughness of the surface coating layer is 0.15 ?m or more in at least one direction, and 3.0 ?m or less in all directions.

Abstract: An electrically conductive material for a connection component is disclosed. The electrically conductive material includes a Cu—Sn alloy coating layer 5 in which a Cu content is 55 to 70 at % and has an average thickness of 0.1 to 3.0 ?m, and a Sn coating layer 6 having an average thickness of 0.2 to 5.0 ?m, which are formed in this order on a surface of a base material made of a copper or copper alloy sheet strip. When a reflected electron image of a material surface is observed with a scanning electron microscope at a magnification of 100 times, a region A and a region B having a higher brightness than the region A and in which the Cu—Sn alloy coating layer is not exposed coexist on the material surface, and an area ratio of the region A on the material surface is 2 to 65%.

Abstract: A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 ?m. Formed on the Ni coating layer is a Cu—Sn alloy coating layer having an average thickness of 0.4 to 1.0 ?m. Formed on the Cu—Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 ?m. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 ?m or more and less than 0.15 ?m in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu—Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

Abstract: A conductive material for connection parts includes a matrix, a Cu—Sn alloy covering layer having a Cu content of 20 to 70 at % and an average thickness of from 0.2 to 3.0 ?m, and a Sn covering layer having an average thickness of from 0.05 to 5.0 ?m. The matrix is a copper alloy strip containing specified amounts of Cr and Zr or specified amounts of Fe and P, or a Cu—Zn alloy strip containing a specified amount of Zn. The Cu—Sn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

Abstract: An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and an average thickness of 0.2 to 3.0 ?m. The Sn coating layer has an average thickness of 0.2 to 5.0 ?m. A surface of the electroconductive material has an arithmetic average roughness Ra of at least 0.15 ?m in at least one direction along the surface and 3.0 ?m or less in all directions along the surface. The Cu—Sn alloy coating layer is partially exposed at the surface of the electroconductive material. An area ratio of the Cu—Sn alloy coating layer exposed at the surface of the electroconductive material is 3 to 75%. An average crystal grain size on a surface of the Cu—Sn alloy coating layer is less than 2 ?m.

Abstract: Disclosed is a copper alloy sheet strip with a surface coating layer, including a copper alloy sheet strip, as a base material, consisting of 1.0 to 4.5% by mass of one or more of Ni and Co and 0.2 to 1.0% by mass of Si, with the balance being copper and inevitable impurities; and the surface coating layer composed of a Ni layer, a Cu—Sn alloy layer, and a Sn layer formed on a surface of the copper alloy sheet strip in this order; wherein the Ni layer has an average thickness of 0.1 to 3.0 ?m, the Cu—Sn alloy layer has an average thickness of 0.2 to 3.0 ?m, and the Sn layer has an average thickness of 0.05 to 5.

Abstract: Disclosed is a copper alloy sheet strip with a surface coating layer, including a copper alloy sheet strip, as a base material, consisting of Ni: 0.4 to 2.5% by mass, Sn: 0.4 to 2.5% by mass, and P: 0.027 to 0.15% by mass, a mass ratio Ni/P between the Ni content to the P content being less than 25, as well as any one of Fe: 0.0005 to 0.15% by mass, Zn: 1% by mass or less, Mn: 0.1% by mass or less, Si: 0.1% by mass or less, and Mg: 0.3% by mass or less, with the balance being Cu and inevitable impurities, and having a structure in which precipitates are dispersed in a copper alloy matrix, each precipitate having a diameter of 60 nm or less, 20 or more precipitates each having a diameter of 5 nm or more and 60 nm or less being observed in the visual field of 500 nm×500 nm; and the surface coating layer composed of a Ni layer, a Cu—Sn alloy layer, and a Sn layer formed on a surface of the copper alloy sheet strip in this order; wherein the Ni layer has an average thickness of 0.1 to 3.

Abstract: A Sn-coated copper alloy strip including a surface coating layer containing a Ni layer, a Cu—Sn intermetallic compound layer, and a Sn layer formed in this order over the surface of a base material containing a copper alloy strip, in which an average thickness of the Ni layer is from 0.1 to 3.0 ?m, an average thickness of the Cu—Sn intermetallic compound layer is from 0.02 to 3.0 ?m, an average thickness of the Sn layer is from 0.01 to 5.0 ?m, and the Cu—Sn intermetallic compound layer contains only an ?-phase or the ?-phase and an ?-phase.

Abstract: An electroconductive material for a connection component have a base member made of a copper alloy plate, a Ni coating layer, a Cu—Sn alloy coating layer, and a Sn coating layer. A surface of the material is subjected to reflow treatment. The base member surface is roughened. The Cu—Sn alloy coating layer is partially exposed from the outside surface of the Sn coating layer. Regions of the Cu—Sn alloy coating layer exposed to the outside surface of the Sn coating layer have random microstructures distributed irregularly between portions of the Sn coating layer and streak microstructures extending in parallel to a rolled direction of the base member. The streak microstructures having a length of 50 ?m or more and a width of 10 ?m or less are contained in a number of 35 or more per 1 mm2.

Abstract: An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and an average thickness of 0.2 to 3.0 ?m. The Sn coating layer has an average thickness of 0.2 to 5.0 ?m. A surface of the electroconductive material has an arithmetic average roughness Ra of at least 0.15 ?m in at least one direction along the surface and 3.0 ?m or less in all directions along the surface. The Cu—Sn alloy coating layer is partially exposed at the surface of the electroconductive material. An area ratio of the Cu—Sn alloy coating layer exposed at the surface of the electroconductive material is 3 to 75%. An average crystal grain size on a surface of the Cu—Sn alloy coating layer is less than 2 ?m.

Abstract: A Sn-coated copper alloy strip including a surface coating layer containing a Ni layer, a Cu—Sn intermetallic compound layer, and a Sn layer formed in this order over the surface of a base material containing a copper alloy strip, in which an average thickness of the Ni layer is from 0.1 to 3.0 ?m, an average thickness of the Cu—Sn intermetallic compound layer is from 0.02 to 3.0 ?m, an average thickness of the Sn layer is from 0.01 to 5.0 ?m, and the Cu—Sn intermetallic compound layer contains only an ?-phase or the ?-phase and an ?-phase.

Abstract: A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 ?m. Formed on the Ni coating layer is a Cu—Sn alloy coating layer having an average thickness of 0.4 to 1.0 ?m. Formed on the Cu—Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 ?m. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 ?m or more and less than 0.15 ?m in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu—Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

Abstract: This invention intends to provide a molten metal pouring amount control apparatus in which a sliding resistance of a slide frame is small and a pressing force around a nozzle hole is stabilized so that there is no fear that any trouble such as a molten metal leakage occurs and further, a structure thereof is simple and maintenance cost is low. More specifically, this invention provides a molten metal pouring amount control apparatus for adjusting an opening of a nozzle hole in a fixed plate and an opening of a nozzle hole in a sliding plate by sliding a slide frame by means of a driving means, the control apparatus further comprising guide units each including a plurality of steel balls arranged in line between the slide frame and springs, the guide units being provided on both sides of the sliding plate.

Abstract: With a rotary nozzle of the type in which a slide plate brick having at least one nozzle bore is rotated so as to adjust the degree of overlapping between the nozzle bore thereof and a nozzle bore of a fixed plate brick to control the rate of pouring of molten steel or the like, the bricks constituting the fixed plate brick and the slide plate brick are formed into the most rational and economical shape for the purpose of seeking a reduction in their cost and also the bricks are used for the purpose of seeking a reduction in the running cost of the rotary nozzle. To achieve these purposes, the shape of the brick 40 is formed into a substantially elliptic shape and nozzle bores 41a and 41b are provided in the respective eccentric positions.

Abstract: A method of controlling drawing of a cast piece in horizontal continuous casting, in which drawing is controlled in accordance with an inwardly curved passage to keep the acceleration low at the start of the drawing and to increase it gradually in the drawing process for the purpose of reducing the number of bubbles appearing on the surface layer of the cast piece by sucking the ambient air into the mold when drawing the cast piece.