Patents by Inventor Masakazu Baba

Masakazu Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6755953
    Abstract: In order to preventing thiol-coated metal particles from being liberated from a self-aligning membrane on a substrate during coating the metal particles deposited on the self-aligning membrane with thiol molecules, this invention provides a process for forming a metal particle ordered structure wherein a voltage is applied on the substrate for preventing the metal particles from being liberated from the self-aligning membrane during coating the metal particles deposited on the self-aligning membrane on the substrate with thiol molecules.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: June 29, 2004
    Assignees: NEC Corporation, Japan Science and Technology Corporation
    Inventor: Masakazu Baba
  • Publication number: 20040108208
    Abstract: A separator has a specimen separating area comprising a number of recesses defined in an inner wall of a flow passage through which a specimen passes. For separating nucleic acid and protein, the recesses have openings whose maximum diameter is 300 nm or less, and adjacent ones of the recesses are spaced at an average interval of 300 nm or less.
    Type: Application
    Filed: August 19, 2003
    Publication date: June 10, 2004
    Inventors: Kazuhiro Iida, Noriyuki Iguchi, Hisao Kawaura, Toru Sano, Masakazu Baba, Hiroko Someya, Toshitsugu Sakamoto
  • Publication number: 20030049563
    Abstract: A fractionating apparatus is used for fractionating sample into micro-structures different in size, and includes a fractionating unit formed with a fractionating passage; the fractionating passage is defined in a groove formed in a substrate of the fractionating unit, and pillar patches are formed in the groove at intervals wider than the gap among the pillar patches; while the sample is migrated through the fractionating passage, small-sized DNA molecules are trapped in the pillar patches, and large-sized DNA molecules are smoothly migrated through the wide intervals; this results in that the large-sized DNA molecules reaches the end of the fractionating passage faster than the small-sized DNA molecules without clogging.
    Type: Application
    Filed: July 31, 2002
    Publication date: March 13, 2003
    Applicant: NEC CORPORATION
    Inventors: Kazuhiro Iida, Hisao Kawaura, Masakazu Baba, Toshitsugu Sakamoto, Toru Sano, Noriyuki Iguchi
  • Publication number: 20020189952
    Abstract: In order to preventing thiol-coated metal particles from being liberated from a self-aligning membrane on a substrate during coating the metal particles deposited on the self-aligning membrane with thiol molecules, this invention provides a process for forming a metal particle ordered structure wherein a voltage is applied on the substrate for preventing the metal particles from being liberated from the self-aligning membrane during coating the metal particles deposited on the self-aligning membrane on the substrate with thiol molecules.
    Type: Application
    Filed: June 12, 2002
    Publication date: December 19, 2002
    Inventor: Masakazu Baba
  • Patent number: 6331238
    Abstract: There is provided a method of patterning a substrate with an atomic mask having a mask substrate and first atoms adsorbed on the mask substrate, the first atoms forming a mask pattern having a one-atomic thickness, including the steps, in sequence, of (a) depositing adatoms over a surface of a substrate to be patterned, the adatoms having low reactivity with second atoms of which the substrate is composed, and (b) putting the atomic mask close to the substrate in such a distance that the first atoms make a chemical bond with the adatoms, so that adatoms located nearest to the first atoms are desorbed out of the substrate to form a pattern on the substrate, the pattern being defined as an area where none of the adatoms exists. In accordance with the above mentioned method, it is possible to form a pattern on the sub-nanometer or nanometer order with high accuracy and in a short period of time, and it is also possible to repeatedly form the same pattern by using the atomic mask.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: December 18, 2001
    Assignee: NEC Corporation
    Inventors: Takashi Yokoyama, Masakazu Baba
  • Patent number: 6099945
    Abstract: There is provided a method of patterning a substrate with an atomic mask having a mask substrate and first atoms adsorbed on the mask substrate, the first atoms forming a mask pattern having a one-atomic thickness, including the steps, in sequence, of (a) depositing adatoms over a surface of a substrate to be patterned, the adatoms having low reactivity with second atoms of which the substrate is composed, and (b) placed the atomic mask close to the substrate in such a distance that the first atoms form a chemical bond with the adatoms, so that adatoms located nearest to the first atoms are desorbed out of the substrate to form a pattern on the substrate, the pattern being defined as an area where none of the adatoms exists. In accordance with the above mentioned method, it is possible to form a pattern on the sub-nanometer or nanometer order with high accuracy and in a short period of time, and it is also possible to repeatedly form the same pattern by using the atomic mask.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: August 8, 2000
    Assignee: NEC Corporation
    Inventors: Takashi Yokoyama, Masakazu Baba