Patents by Inventor Masakazu FUKUMITSU
Masakazu FUKUMITSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154600Abstract: A resonance device is provided that includes a resonator including a base, a plurality of vibration arms having arms on a fixed end side connected to the base and weight portions on an open end side. A frame is around a periphery of the vibration arms and holds the base. The vibration arms extending parallel to each other and vibrating in an out-of-plane bending vibration mode as a main vibration. A lower cover and an upper form a vibration space for the resonator. A protrusion protrudes into the vibration space from an inner surface of the lower or upper cover. The frame has projections formed in positions facing the weight portions in a plan view.Type: ApplicationFiled: January 18, 2024Publication date: May 9, 2024Inventors: Ryota KAWAI, Yoshiyuki HIGUCHI, Masakazu FUKUMITSU, Fumiya ENDOU, Takehiko KISHI, Ville KAAJAKARI
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Publication number: 20240128948Abstract: A resonance device that includes: a first substrate having a first silicon substrate and a resonator, wherein the resonator includes a single-crystal silicon film and a first silicon oxide film interposed between the single-crystal silicon film and the first silicon substrate, and a through hole that passes through the single-crystal silicon film and the first silicon oxide film; a second substrate opposite the first substrate; a frame shaped bonding portion that bonds the first substrate to the second substrate to seal a vibration space of the resonator; and a first blocking member disposed in an interior of the through hole and surrounding a vibration portion of the resonator in a plan view of the first substrate so as to divide the first silicon oxide film, wherein the first blocking member has a lower helium permeability than the first silicon oxide film.Type: ApplicationFiled: December 28, 2023Publication date: April 18, 2024Inventors: Masakazu FUKUMITSU, Yoshiyuki HIGUCHI, Takehiko KISHI
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Patent number: 11909379Abstract: A MEMS device that includes a substrate including an element and a connection wiring electrically connected to the element, and a connection portion electrically connected to the connection wiring. The connection portion is formed of a eutectic alloy of a first metal and a second metal. A line width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view.Type: GrantFiled: December 1, 2020Date of Patent: February 20, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yoshihisa Inoue, Masakazu Fukumitsu, Yuichi Goto
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Patent number: 11881838Abstract: A resonance device that includes a MEMS substrate including a resonator, an upper lid, and a bonding portion bonding the MEMS substrate and the upper lid to seal a vibration space of the resonator. The bonding portion includes a eutectic layer containing a eutectic alloy as a main component thereof. The eutectic alloy is composed of a first metal containing aluminum as a main component thereof, a second metal of germanium or silicon, and a third metal of titanium or nickel.Type: GrantFiled: January 29, 2021Date of Patent: January 23, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kentarou Dehara, Masakazu Fukumitsu
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Publication number: 20230421131Abstract: A method is provided for manufacturing a resonance device, the method includes forming a recessed portion that forms a vibration space for a resonator in an object that is at least one of an upper lid and a lower lid and includes etching on the object by isotropic etching while the object is covered with a mask having a peripheral portion having a frame shape and a stopper formation that extends from the peripheral portion toward an inside of the peripheral portion. The method further includes etching the object while the object is covered with the mask to form a stopper at a position overlapping with the stopper formation on a bottom surface of the recessed portion in a plan view of the object. In this aspect, the stopper restricts collision of the resonator with the bottom surface of the recessed portion.Type: ApplicationFiled: September 7, 2023Publication date: December 28, 2023Inventors: Masakazu FUKUMITSU, Naoto YATANI, Ryota KAWAI, Fumiya ENDOU
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Publication number: 20230361740Abstract: A resonance device is provided that includes a first substrate including a resonator; and a second substrate bonded to the first substrate. The second substrate includes a first power supply terminal electrically connected to an upper electrode of the resonator, and a ground terminal electrically connected to a lower electrode of the resonator. The first substrate includes a first inner wire that electrically connects the upper electrode to the first power supply terminal, and a first coupling wire connected to the first inner wire and having an end portion located at an outer edge of the first substrate.Type: ApplicationFiled: July 19, 2023Publication date: November 9, 2023Inventors: Yoshiyuki HIGUCHI, Masakazu FUKUMITSU
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Publication number: 20230361741Abstract: A manufacturing method is provided for a resonance device that includes preparing a collective board including first power supply terminals electrically connected to upper electrodes of a plurality of resonators, and a first coupling wire that electrically connects two or more of the first power supply terminals. The method includes dividing the collective board into a plurality of resonance devices. Moreover, the first power supply terminals include a first metal layer and a second metal layer covering the first metal layer. The first coupling wire includes a portion of the first metal layer that extends from a region covered with the second metal layer. The method further includes removing the portion of the first metal layer extending from the region covered with the second metal layer before the dividing the collective board into the plurality of resonance devices.Type: ApplicationFiled: July 17, 2023Publication date: November 9, 2023Inventors: Masakazu FUKUMITSU, Yoshiyuki HIGUCHI
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Publication number: 20230353122Abstract: A method of manufacturing a resonance device includes preparing a resonance device and adjusting a frequency of the resonator. The resonance device includes a lower lid, an upper lid joined to the lower lid, and a resonator with vibration arms that vibrate in bending vibration in an interior space between the lower and upper lids. The adjusting of the frequency of the resonator includes vibrating the vibration arms in bending vibration and thereby causing respective ends of the arms to strike the lower lid at an impact speed of 3.5×103 ?m/sec or more. The ends of the vibration arms are made of silicon oxide, and the lower lid is made of silicon.Type: ApplicationFiled: July 12, 2023Publication date: November 2, 2023Inventors: Fumiya ENDOU, Masakazu FUKUMITSU
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Patent number: 11753296Abstract: A MEMS device includes a lower substrate having a resonator, an upper substrate disposed to oppose an upper electrode of the resonator, a bonding layer sealing an internal space between the lower substrate and the upper substrate, and wiring layers that contain the same metal material as the bonding layer. Moreover, a rare gas content of each of the wiring layers is less than 1×1020 (atoms/cm3).Type: GrantFiled: September 1, 2020Date of Patent: September 12, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masakazu Fukumitsu
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Patent number: 11757425Abstract: A resonance device that includes a MEMS substrate including a resonator, an upper cover, and a bonding portion that bonds the MEMS substrate to the upper cover to seal a vibration space of the resonator. The bonding portion includes a eutectic layer composed of a eutectic alloy of germanium and a metal mainly containing aluminum, a first titanium (Ti) layer, a first aluminum oxide film, and a first conductive layer consecutively arranged from the MEMS substrate to the upper cover.Type: GrantFiled: May 27, 2020Date of Patent: September 12, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Masakazu Fukumitsu, Kentarou Dehara
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Publication number: 20230283257Abstract: A resonator is provided that includes a vibrating portion including three or more vibrating arms with at least two vibrating arms that bend out of plane with different phases and a base. The resonator also includes a frame that holds the vibrating portion; and a support arm having one end connected to the frame and the other end connected to a rear end portion of the base. The other end of the support arm is connected to a position in a range from ?0.1 WB to 0.1 WB, with respect to a base width WB of the base, relative to a position, on the rear end portion of the base where a center line passes in a plan view. A support arm length of the support arm is 0.2 or more times and 0.4 or less times a vibrating arm length of the vibrating arms.Type: ApplicationFiled: May 11, 2023Publication date: September 7, 2023Inventors: Ryota KAWAI, Masakazu FUKUMITSU, Yoshiyuki HIGUCHI
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Publication number: 20230208392Abstract: A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.Type: ApplicationFiled: February 28, 2023Publication date: June 29, 2023Inventors: Yoshiyuki HIGUCHI, Masakazu FUKUMITSU
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Publication number: 20230119602Abstract: A resonance device that includes a MEMS substrate including a resonator having a vibrating portion, a holding portion configured to hold the vibrating portion, and an isolation groove that surrounds the vibrating portion in a plan view of the resonance device; and an upper lid facing the MEMS substrate with the resonator interposed therebetween and that includes a connection wiring electrically connected to the vibrating portion.Type: ApplicationFiled: December 16, 2022Publication date: April 20, 2023Inventors: Masakazu FUKUMITSU, Takashi UEDA
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Patent number: 11597648Abstract: A MEMS device and a MEMS device manufacturing method are provided for suppressing damage to device parts. An exemplary method of manufacturing a resonance device includes radiating laser light from a bottom surface side of a second substrate to form modified regions inside the second substrate along dividing lines of a first substrate, which has device parts formed on a top surface thereof, and the second substrate, the top surface of which is bonded to the bottom surface of the first substrate via bonding portions. The method further includes dividing the first and second substrates along the dividing lines by applying stress to the modified regions. The bonding portions are formed along the dividing lines and block the laser light.Type: GrantFiled: January 26, 2021Date of Patent: March 7, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masakazu Fukumitsu
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Publication number: 20230018209Abstract: A vibration member is provided that includes a base with front and rear ends opposite to each other, and vibration arms fixed to the front end, extending away therefrom, and including at least one first vibration arm and a pair of second vibration arms positioned on both sides of a first vibration arm group including the at least one first vibration arm in a direction intersecting a longitudinal direction. A holding arm is provided that has one end connected to the base and the other end connected to a frame. A plurality of vibration portions include a piezoelectric film, and a lower electrode and an upper electrode that sandwich the piezoelectric film. A connection wiring line that connects the respective upper electrodes of the pair of second vibration arms to each other is provided in a region of at least either of the base or the holding arm.Type: ApplicationFiled: September 14, 2022Publication date: January 19, 2023Inventors: Yoshiyuki HIGUCHI, Ryota KAWAI, Yoshihisa INOUE, Masakazu FUKUMITSU
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Publication number: 20230008378Abstract: A resonance device is provided that includes a lower lid that has a recessed portion, and a resonator that is mounted on the lower lid and has a vibration arm that performs out-of-plane bending vibration in a space including the recessed portion and a frame provided around the vibration arm and having a facing portion facing a tip of the vibration arm. The facing portion of the frame is located in an outer-side portion of the resonator with respect to a straight line connecting an intersection point of a perpendicular extending from the tip of the vibration arm toward the recessed portion of the lower lid and the recessed portion of the lower lid, to a cavity edge of the recessed portion facing the tip of the vibration arm.Type: ApplicationFiled: September 7, 2022Publication date: January 12, 2023Inventors: Masakazu FUKUMITSU, Takehiko KISHI
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Publication number: 20220368301Abstract: A method of manufacturing a collective substrate that includes: forming at least one first mark in or on a first main surface of a first substrate; joining the first main surface of the first substrate and a first main surface of a second substrate to each other; forming an opening in the second substrate such that the first mark is exposed therein; and forming a device portion in or on a second main surface of the second substrate while using the first mark as a reference.Type: ApplicationFiled: July 21, 2022Publication date: November 17, 2022Inventors: Masakazu FUKUMITSU, Taku KAMOTO
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Publication number: 20220231663Abstract: A resonance device is provided that includes a lower cover; an upper cover coupled to the lower cover; and a resonator that has vibration arms that generate bending vibration in an interior space provided between the lower cover and the upper cover. Moreover, the vibration arms have distal ends provided with metal films on a side that faces the upper cover, and a gap is provided between the distal ends of the vibration arms and the upper cover that is larger than a gap between the distal ends of the vibration arms and the lower cover.Type: ApplicationFiled: April 6, 2022Publication date: July 21, 2022Inventors: Masakazu FUKUMITSU, Takehiko KISHI, Yoshiyuki HIGUCHI
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Publication number: 20220153573Abstract: A package structure that includes a pair of substrates arranged to oppose each other so as to form an internal space; a bonding portion sealing the pair of substrates; an element is sealed in the internal space and surrounded by the pair of substrates; an adsorption layer within the internal space and opposing at least one substrate of the pair of substrates, the adsorption layer constructed to adsorbs at least hydrogen; and a diffusion-inhibiting layer between the at least one substrate and the adsorption layer, and in which hydrogen is more difficult to diffuse compared with in the at least one substrate.Type: ApplicationFiled: February 8, 2022Publication date: May 19, 2022Inventors: Yoshiyuki HIGUCHI, Masakazu FUKUMITSU
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Patent number: 11329624Abstract: A resonator that includes a vibrating portion that has a piezoelectric film, and a lower and upper electrodes that face each other with the piezoelectric film interposed therebetween. Moreover, a holding portion is provided at least around a maximum displacement region of the vibrating portion and has an insulating film. A holding arm connects the vibrating portion and the holding portion, and include a conductive portion that is in contact with the insulating film of the holding portion in at least a region that faces the maximum displacement region of the vibrating portion. In addition, the conductive portion is electrically connected to the lower electrode or the upper electrode or is grounded.Type: GrantFiled: December 5, 2018Date of Patent: May 10, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuichi Goto, Masakazu Fukumitsu