Abstract: A oscillator device includes: a first substrate that has a first surface, a second surface, and a through hole extending between the first surface and the second surface; a crystal oscillator that is disposed on the first surface of the first substrate, the crystal oscillator including an electrode; a second substrate that is disposed on the crystal oscillator; a through electrode that is disposed in the through hole, that has a diameter smaller than a diameter of the through hole, that is electrically coupled to the electrode, and that extends between the first surface and the second surface; and a filling member with which an area between an inner wall of the through hole and the through electrode is filled.

Abstract: An oscillator includes: a piezoelectric material to vibrate; a first inverting amplifier; a second inverting amplifier; a first output electrode to apply an output signal of the first inverting amplifier to the piezoelectric material; a second output electrode to apply an output signal of the second inverting amplifier to the piezoelectric material; a first input electrode to receive a voltage signal generated by the piezoelectric material and output the voltage signal to the first inverting amplifier; and a second input electrode to receive the voltage signal and output the voltage signal to the second inverting amplifier, wherein the first and second output electrodes are coupled to the piezoelectric material so that faces of the piezoelectric material move in opposite directions, and the first and second input electrodes are coupled to the piezoelectric material so that the voltage signals are input to the first and second input electrodes.

Abstract: An electronic device manufacturing method includes a cutting step at which a wafer is cut to obtain chips before pattern formation and a polishing step at which cut surfaces of the obtained chips are subjected in one batch to barrel polishing. The method further includes an aligning step at which the polished chips are aligned so that front surfaces thereof face in an upward direction. The method further includes a bonding step at which the cut surfaces of the aligned chips are bonded together with an adhesive to thereby form a chip assembly. The method further includes a pattern forming step at which a circuit pattern is formed on each of the chips of the chip assembly and a melting step at which the adhesive on the chip assembly is melted to thereby separate the chip assembly into chips after pattern formation.

Abstract: An electronic device includes: a first-member that includes a through-hole; a second-member that includes a connection-hole and that is in contact with the first-member in a state where the through-hole and the connection-hole are in communication with each other; a first-locking-surface that is formed on the first-member while extending radially outside of the through-hole and that faces a side opposite to the connection-hole-side; a second-locking-surface that is formed in the second-member while extending radially outside of the connection-hole and that faces a side opposite to the through-hole-side; and an adhesive-portion including a shaft-portion with which the through-hole and the connection-hole are filled, a first-large-diameter portion that is formed at an end of the shaft-portion and secured to the first-locking-surface, and a second-large-diameter portion that is formed at the other end of the shaft-portion and secured to the second-locking-surface.

Abstract: An electronic apparatus input and/or output a signal from and/or an external apparatus. The electronic apparatus includes: a clock section in which a frequency is set and which gives a clock signal having the set frequency; an input-output section which inputs and/or outputs the signal according to the clock signal given from the clock section; a frequency detecting section which detects a frequency of a signal given from the external apparatus; and a frequency setting section which determines the frequency of the clock signal based on the frequency detected by the frequency detecting section, and sets the frequency in the clock section. Since the frequency of the clock signal is automatically set based on the frequency given from the external apparatus, it is possible to diminish a cumbersome maintenance work or reduce the cost.

Abstract: A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.

Abstract: A piezoelectric crystal unit includes a package including a concave portion; a piezoelectric element having a protruding electrode and disposed within the package; and an electrically conductive adhesive contained in the concave portion. The piezoelectric element is fixed to the package with the protruding electrode embedded in the concave portion of the package.

Abstract: A tuning fork vibrator includes a package having an internal space having a rectangle column shape; a tuning fork vibration piece including a base, two vibration arms extending in parallel form the base and a first arm and a second arm extending obliquely from the base so as to interpose the two vibration arms, the tuning fork vibration piece having a length from the base to a tip in an extended direction of the two vibration arms which is longer than each side of the bottom surface of the internal space, wherein the tuning fork vibration piece is placed in the internal space with the extended direction set along a diagonal direction of the internal space, and a tip part of the first arm and a tip part of the second arm of the tuning fork vibration piece are fixed to the bottom surface of the internal space.

Abstract: A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.

Abstract: A temperature sensor includes a resonator; a first oscillation circuit to oscillate the resonator in a first oscillation mode; a second oscillation circuit to oscillate the resonator in a second oscillation mode different from the first oscillation mode; a switching circuit to connect the resonator to the first oscillation circuit or the second oscillation circuit; a control circuit to control the switching circuit so that the first oscillation circuit and the second oscillation circuit are alternately connected to the resonator; and a temperature information output circuit to generate information representing a frequency difference between a signal output from the first oscillation circuit kept in a status of being connected to the resonator and a signal output from the second oscillation circuit kept in the status of being connected to the resonator on the basis of these signals and to output the frequency difference information as temperature information on the resonator.

Abstract: A tuning fork vibrator includes a package having an internal space having a rectangle column shape; a tuning fork vibration piece including a base, two vibration arms extending in parallel form the base and a first arm and a second arm extending obliquely from the base so as to interpose the two vibration arms, the tuning fork vibration piece having a length from the base to a tip in an extended direction of the two vibration arms which is longer than each side of the bottom surface of the internal space, wherein the tuning fork vibration piece is placed in the internal space with the extended direction set along a diagonal direction of the internal space, and a tip part of the first arm and a tip part of the second arm of the tuning fork vibration piece are fixed to the bottom surface of the internal space.

Abstract: An electronic device manufacturing method includes a cutting step at which a wafer is cut to obtain chips before pattern formation and a polishing step at which cut surfaces of the obtained chips are subjected in one batch to barrel polishing. The method further includes an aligning step at which the polished chips are aligned so that front surfaces thereof face in an upward direction. The method further includes a bonding step at which the cut surfaces of the aligned chips are bonded together with an adhesive to thereby form a chip assembly. The method further includes a pattern forming step at which a circuit pattern is formed on each of the chips of the chip assembly and a melting step at which the adhesive on the chip assembly is melted to thereby separate the chip assembly into chips after pattern formation.

Abstract: A piezoelectric oscillator includes: a package including a floor surface and a step portion thereinside; a conductive adhesive applied on the step portion; and a piezoelectric vibrator including one end placed on the step portion via the conductive adhesive. The floor surface is provided with a recess filled with a resin material having a thermal deformation property. The package includes a sidewall having transparency.

Abstract: A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other.

Abstract: An oscillator device manufacturing method includes: placing an oscillator provided with electrodes on a convex pedestal provided on an assembly table; arranging, on the assembly table, a frame member including an opening surrounded by a frame thereof and provided with electrode pads on the frame such that the opening is positioned at the pedestal; connecting the electrode pads to the electrodes of the oscillator placed on the pedestal via wires, while the frame member is arranged on the assembly table; removing the frame member from the assembly table together with the oscillator after the connecting, and bonding the frame member connected to the oscillator to a substrate. By using the method, the oscillator device including the oscillator suspended in air above the substrate can be efficiently manufactured. In stead of using the frame member, a frame body in which frame members are arrayed can be employed.

Abstract: A temperature compensated crystal oscillator includes an oscillation circuit including a crystal oscillator; a variable capacitor inserted in series in the oscillation circuit; a thermosensitive circuit element whose resistance value changes in accordance with a temperature of the crystal oscillator, the thermosensitive circuit element being formed on the crystal oscillator by vapor deposition; and a correction circuit configured to correct capacitance of the variable capacitor based on a current value that is used when applying current to the thermosensitive circuit element.

Abstract: A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.

Abstract: There is provided a method of fabricating a resonator, the method includes, joining a vibrating plate with a substrate at a first surface thereof, grinding a surface of the vibrating plate joined with the substrate, forming an electrode on the ground surface of the vibrating plate, and etching electively a region at a second surface of the substrate, where the second surface is opposite to the first surface and the region is corresponding to a position of the electrode.

Abstract: A temperature compensated crystal oscillator is mounted to a board. A quartz resonator includes a quartz chip that generates an oscillation frequency. A resistive element is formed on the quartz chip. A temperature sensor is located closer to the board than the quartz resonator. The compensation part compensates for a change in the oscillation frequency generated by the quartz resonator based on a value of a current flowing in the resistive element and an output of the temperature sensor.

Abstract: An oscillator device manufacturing method includes: placing an oscillator provided with electrodes on a convex pedestal provided on an assembly table; arranging, on the assembly table, a frame member including an opening surrounded by a frame thereof and provided with electrode pads on the frame such that the opening is positioned at the pedestal; connecting the electrode pads to the electrodes of the oscillator placed on the pedestal via wires, while the frame member is arranged on the assembly table; removing the frame member from the assembly table together with the oscillator after the connecting, and bonding the frame member connected to the oscillator to a substrate. By using the method, the oscillator device including the oscillator suspended in air above the substrate can be efficiently manufactured. In stead of using the frame member, a frame body in which frame members are arrayed can be employed.