Patents by Inventor Masakazu Sakata
Masakazu Sakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240093813Abstract: There is provided a technique that includes: a first connector including a first opening including two longitudinally extending parallel sides and configured to provide a detachable connection to an opening of a first counterpart; and a second connector including a substantially circular second opening and configured to be connectable to an opening of a second counterpart; and a pipe including an internal space formed in a shape of a polyhedron and configured to allow fluid communication between the first opening and the second opening.Type: ApplicationFiled: July 18, 2023Publication date: March 21, 2024Applicant: Kokusai Electric CorporationInventors: Takuto SHOJI, Ryosuke TAKAHASHI, Masakazu SAKATA
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Publication number: 20230095537Abstract: There is provided a technique that includes: an exhauster including a casing in which a rotating body is installed; a gas supplier configured to supply an inert gas to the exhauster without passing through a process chamber; and a controller configured to be capable of controlling the gas supplier to supply the inert gas into the casing based on a temperature drop of the rotating body expected in advance in a state where a processing object is not being processed in the process chamber such that a temperature of the rotating body becomes equal to or higher than a target temperature.Type: ApplicationFiled: August 16, 2022Publication date: March 30, 2023Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Ryosuke TAKAHASHI, Masakazu SAKATA, Masamichi YACHI, Masamichi SAKASHITA
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Publication number: 20220310420Abstract: A cooling method is a method of cooling a processed substrate in a state of being held by a substrate holder, the method including: a first cooling step of cooling the substrate by supplying a gas toward the substrate holder disposed at a reference position; a stopping step of stopping supply of the gas; and a second cooling step of cooling the processed substrate held in a lower portion of the substrate holder.Type: ApplicationFiled: March 24, 2022Publication date: September 29, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Hironori SHIMADA, Daiki KAMIMURA, Tomoshi TANIYAMA, Tomoki MATSUNAGA, Yasunori EJIRI, Masakazu SAKATA, Mamoru Ohishi
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Publication number: 20200392620Abstract: According to one aspect of the technique, there is provided a processing apparatus including: a process structure including: a process furnace, in which an object to be processed is processed by a gas, provided in a housing; and an opening configured to enable a maintenance and provided at a rear side of the housing; an exhaust structure configured to allow a maintenance region to be provided at a region facing the opening and to exhaust the gas from the process furnace; and an exhaust apparatus configured to secure the maintenance region at the region facing the opening and placed in contact with a side of the exhaust structure opposite to the process structure.Type: ApplicationFiled: August 24, 2020Publication date: December 17, 2020Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Masanori OKUNO, Toshihiko YONEJIMA, Masakazu SAKATA, Masamichi YACHI
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Patent number: 10163663Abstract: A configuration capable of increasing an exhaust capability of an apparatus without degrading an operation of the apparatus includes: a processing furnace; an exhaust unit configured to exhaust a gas from a process chamber defined by the processing furnace, the exhaust unit having a first sidewall and a second sidewall opposite to the first sidewall; and an exhaust device disposed adjacent to the exhaust unit and connected to the exhaust unit via a connecting pipe provided with a vibration-absorbing member, the exhaust device having a first sidewall and a second sidewall opposite to the first sidewall, wherein the processing furnace, the exhaust unit and the exhaust device are disposed on a same plane, and only the first sidewall of the first and the second sidewalls of the exhaust device is disposed in a space defined by extensions of the first and the second sidewalls of the exhaust unit.Type: GrantFiled: November 22, 2017Date of Patent: December 25, 2018Assignee: Kokusai Electric CorporationInventors: Toshihiko Yonejima, Masanori Okuno, Masakazu Sakata, Hiroki Okamiya, Takeshi Kasai, Katsuaki Nogami, Takashi Ozaki, Kenji Kanayama, Unryu Ogawa, Seiyo Nakashima, Tomoyuki Yamada, Masayuki Yamada
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Publication number: 20180144953Abstract: A configuration capable of increasing an exhaust capability of an apparatus without degrading an operation of the apparatus includes: a processing furnace; an exhaust unit configured to exhaust a gas from a process chamber defined by the processing furnace, the exhaust unit having a first sidewall and a second sidewall opposite to the first sidewall; and an exhaust device disposed adjacent to the exhaust unit and connected to the exhaust unit via a connecting pipe provided with a vibration-absorbing member, the exhaust device having a first sidewall and a second sidewall opposite to the first sidewall, wherein the processing furnace, the exhaust unit and the exhaust device are disposed on a same plane, and only the first sidewall of the first and the second sidewalls of the exhaust device is disposed in a space defined by extensions of the first and the second sidewalls of the exhaust unit.Type: ApplicationFiled: November 22, 2017Publication date: May 24, 2018Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Toshihiko YONEJIMA, Masanori OKUNO, Masakazu SAKATA, Hiroki OKAMIYA, Takeshi KASAI, Katsuaki NOGAMI, Takashi OZAKI, Kenji KANAYAMA, Unryu OGAWA, Seiyo NAKASHIMA, Tomoyuki YAMADA, Masayuki YAMADA
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Patent number: 9786528Abstract: The substrate supporting table includes a supporting plate that supports a substrate, a peripheral wall that encompasses a flow path of a coolant under the supporting plate and has an upper end enclosed by the supporting plate, a lower cover that encloses a bottom portion of the flow path and encloses a lower end of the peripheral wall. The substrate supporting table further includes a coolant supplying component that supplies a coolant through an upstream input of the flow path, a discharging component that discharges the coolant through a downstream output of the flow path, and a partition disposed between a supplying hole of the coolant supplying component and a discharging hole of the discharging component. A gap is formed between the partition and the bottom portion of the flow path.Type: GrantFiled: February 28, 2012Date of Patent: October 10, 2017Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventor: Masakazu Sakata
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Patent number: 9378991Abstract: A substrate processing apparatus includes a transport chamber and a processing chamber that processes substrates. The transport chamber has a first substrate transport member transporting the substrates from the transport chamber to the processing chamber. The processing chamber has a first processing unit which is adjacent to the transport chamber and has a first substrate placing base, a second processing unit which is adjacent to the other side of the transport chamber in the first processing unit and has a second substrate placing base, a second substrate transport member transporting the substrates between the first processing unit and the second processing unit, and a control unit controlling at least the second substrate transport member.Type: GrantFiled: September 11, 2009Date of Patent: June 28, 2016Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akira Takahashi, Hidehiro Yanai, Masakazu Sakata
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Patent number: 9311765Abstract: A banknote deposit apparatus includes: a storing box 70 configured to receive the banknote stacked in a stacking unit 60 so as to store the banknote; and a clamping and transporting mechanism 10 configured to clamp surfaces of the banknote stacked in the stacking unit 60 and to transport the banknote to a direction parallel to the surfaces of the clamped banknote so as to store the banknote in the storing box. A front opening 61 through which the stacked banknote is taken out from outside, and a front shutter unit 62 configured to open and close the front opening are disposed on a front surface of the stacking unit 60.Type: GrantFiled: November 5, 2010Date of Patent: April 12, 2016Assignee: GLORY LTD.Inventors: Toru Akamatsu, Masaki Inoue, Masakazu Sakata
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Patent number: 9297287Abstract: An exhaust gas control apparatus includes a control device controlling a urea addition valve for adding urea from an upstream side of a NOx reduction catalyst. The control device obtains an ammonia adsorption amount distribution through the NOx reduction catalyst. When an ammonia adsorption amount in a predetermined part on a downstream side equals or exceeds a predetermined threshold, the control device controls the urea addition valve to stop the urea supply or reduce the amount thereof. The urea addition valve is controlled based on an adsorption amount distribution obtained from a model on which the catalyst is divided into cells such that an ammonia adsorption amount in a first cell positioned furthest upstream equals or exceeds a predetermined threshold close to a saturation adsorption amount and an ammonia adsorption amount in a second cell positioned downstream of the first cell reaches a predetermined target value smaller than the threshold.Type: GrantFiled: September 21, 2011Date of Patent: March 29, 2016Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION, KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Shinya Hirota, Shunsuke Toshioka, Akira Mikami, Koichiro Fukuda, Sakutaro Hoshi, Takashi Endo, Ryoichi Hibino, Matsuei Ueda, Akihiko Asano, Takafumi Yamauchi, Akira Shichi, Makoto Koike, Masatoshi Maruyama, Masakazu Sakata
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Substrate processing apparatus, substrate supporter and method of manufacturing semiconductor device
Patent number: 9076644Abstract: A substrate processing apparatus of the present invention includes a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face; a heating element arranged in the substrate placement stage and configured to heat the substrate; a plurality of struts configured to support the flange from below, and an exhaust unit configured to exhaust an atmosphere in the process chamber, wherein the supporting member is provided between the substrate placement stage and the plurality of struts.Type: GrantFiled: January 16, 2012Date of Patent: July 7, 2015Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Masakazu Sakata, Hidehiro Yanai -
Patent number: 8789511Abstract: A controller for a pressure reducing valve is applied to a fuel injection system which is provided with a pressure reducing valve in a common-rail and a fuel pressure sensor detecting a fuel pressure in a fuel supply passage from the accumulator to an injection port of the fuel injector. The controller includes a fuel-pressure-variation detector for detecting a fuel pressure variation timing at which a detection value of the fuel pressure sensor is varied due to an opening operation or a closing operation of the pressure reducing valve. The controller further includes a response-delay-time computing portion for computing a response delay time of the pressure reducing valve based on a command timing and a fuel pressure variation timing.Type: GrantFiled: August 17, 2011Date of Patent: July 29, 2014Assignee: Denso CorporationInventor: Masakazu Sakata
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SUBSTRATE PROCESSING APPARATUS, SUBSTRATE SUPPORTER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number: 20140004710Abstract: A substrate processing apparatus of the present invention includes a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face; a heating element arranged in the substrate placement stage and configured to heat the substrate; a plurality of struts configured to support the flange from below, and an exhaust unit configured to exhaust an atmosphere in the process chamber, wherein the supporting member is provided between the substrate placement stage and the plurality of struts.Type: ApplicationFiled: January 16, 2012Publication date: January 2, 2014Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Masakazu Sakata, Hidehiro Yanai -
Publication number: 20130247543Abstract: An exhaust gas control apparatus includes a control device controlling a urea addition valve for adding urea from an upstream side of a NOx reduction catalyst. The control device obtains an ammonia adsorption amount distribution through the NOx reduction catalyst. When an ammonia adsorption amount in a predetermined part on a downstream side equals or exceeds a predetermined threshold, the control device controls the urea addition valve to stop the urea supply or reduce the amount thereof. The urea addition valve is controlled based on an adsorption amount distribution obtained from a model on which the catalyst is divided into cells such that an ammonia adsorption amount in a first cell positioned furthest upstream equals or exceeds a predetermined threshold close to a saturation adsorption amount and an ammonia adsorption amount in a second cell positioned downstream of the first cell reaches a predetermined target value smaller than the threshold.Type: ApplicationFiled: September 21, 2011Publication date: September 26, 2013Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, DENSO CORPORATIONInventors: Shinya Hirota, Shunsuke Toshioka, Akira Mikami, Koichiro Fukuda, Sakutaro Hoshi, Takashi Endo, Ryoichi Hibino, Matsuei Ueda, Akihiko Asano, Takafumi Yamauchi, Akira Shichi, Makoto Koike, Masatoshi Maruyama, Masakazu Sakata
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Patent number: 8444363Abstract: Provided is a substrate processing apparatus configured to attain conflicting purposes of high throughput and footprint reduction. The substrate processing apparatus comprises a carrying chamber, and a loadlock chamber and at least two process chambers that are arranged around the carrying chamber. The carrying chamber comprises a substrate carrying unit configured to carry a substrate between the loadlock chamber and the process chambers. The substrate carrying unit comprises a first arm provided with a first finger and a second finger, and leading ends of the first and second fingers extend horizontally in the same direction. Each of the process chambers comprises a first process unit and a second process unit, and the second process unit is disposed at a side of the process chamber distant from the carrying chamber with the first process unit being disposed therebetween.Type: GrantFiled: November 16, 2009Date of Patent: May 21, 2013Assignee: Hitachi Kokusai Electric Inc.Inventors: Masakazu Sakata, Akira Takahashi, Hidehiro Yanai, Motonari Takebayashi, Shinya Tanaka
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Patent number: 8418438Abstract: An exhaust gas purifying system for a diesel engine has an ECU, a passage of exhaust gas, a unit having SCR catalyst, a NOx sensor placed at a downstream side of the unit, and a urea water adding valve placed at an upstream side of the unit. The SCR catalyst in the unit selectively adsorbs ammonia, and selectively purifies NOx contained in an exhaust gas emitted from the diesel engine by the adsorbed ammonia. The ECU changes the urea water adding amount, and performs abnormality diagnosis based on the detection result of the NOx sensor while changing an adding amount of the urea water. The ECU uses a first condition to indicate the presence of an excess NOx amount in the exhaust gas, and a second condition to indicate there is no error cause by the ammonia adsorption on the SCR catalyst.Type: GrantFiled: April 13, 2010Date of Patent: April 16, 2013Assignee: Denso CorporationInventors: Osamu Shimomura, Masakazu Sakata, Masatoshi Maruyama, Kazuharu Tochikawa
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Publication number: 20120329290Abstract: Provided is a substrate placement stage or substrate processing apparatus which can suppress thermal deformation of the substrate placement stage when the substrate placement stage on which a substrate is placed is heated in a process chamber. The substrate placement stage includes: a heating element; a first member surrounding the heating element; and a second member covering a surface of the first member and including a placing surface for placing a substrate thereon, wherein the first member is made of a first material containing ceramics and aluminum, and the second member is made of a second material containing ceramics and aluminum, a content of the ceramics in the second material being lower than that of the first material.Type: ApplicationFiled: May 24, 2012Publication date: December 27, 2012Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Toshiya Shimada, Kazuhiro Shimeno, Masakazu Sakata, Hidehiro Yanai, Tomihiro Amano, Yuichi Wada
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Publication number: 20120285788Abstract: A banknote deposit apparatus includes: a storing box 70 configured to receive the banknote stacked in a stacking unit 60 so as to store the banknote; and a clamping and transporting mechanism 10 configured to clamp surfaces of the banknote stacked in the stacking unit 60 and to transport the banknote to a direction parallel to the surfaces of the clamped banknote so as to store the banknote in the storing box. A front opening 61 through which the stacked banknote is taken out from outside, and a front shutter unit 62 configured to open and close the front opening are disposed on a front surface of the stacking unit 60.Type: ApplicationFiled: November 5, 2010Publication date: November 15, 2012Inventors: Toru Akamatsu, Masaki Inoue, Masakazu Sakata
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Publication number: 20120222818Abstract: The substrate supporting table includes a supporting plate that supports a substrate, a peripheral wall that encompasses a flow path of a coolant under the supporting plate and has an upper end enclosed by the supporting plate, a lower cover that encloses a bottom portion of the flow path and encloses a lower end of the peripheral wall. The substrate supporting table further includes a coolant supplying component that supplies a coolant through an upstream input of the flow path, a discharging component that discharges the coolant through a downstream output of the flow path, and a partition disposed between a supplying hole of the coolant supplying component and a discharging hole of the discharging component. A gap is formed between the partition and the bottom portion of the flow path.Type: ApplicationFiled: February 28, 2012Publication date: September 6, 2012Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventor: Masakazu SAKATA
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Patent number: 8209966Abstract: An exhaust emission control device is used for an engine and is applied to an exhaust gas purifying system. The system has an NOx catalyst disposed in an exhaust passage of the engine to promote selective purification of NOx in exhaust gas performed by ammonia, which is a reducing agent for reducing NOx, and a reducing agent adding device for adding the reducing agent to an upstream side of the catalyst in a flow direction of exhaust gas. The device includes a catalyst temperature detecting device for detecting temperature of the catalyst, a reaction ratio calculating device for calculating a reaction ratio, which is a ratio of a reaction amount of ammonia to a reaction amount of NOx in the catalyst, based on the temperature of the catalyst, and an ammonia consumed amount calculating device for calculating a consumed amount of ammonia in the catalyst based on the reaction ratio.Type: GrantFiled: May 14, 2009Date of Patent: July 3, 2012Assignees: Denso Corporation, Nippon Soken, Inc.Inventors: Masakazu Sakata, Masatoshi Maruyama, Osamu Shimomura