Abstract: A battery pack includes: a battery stack; a lower case that houses the battery stack; an upper cover that covers the battery stack; a restraint band that restrains the upper cover; a first fastening member that fastens the upper cover to the lower case; and a second fastening member that fastens the restraint band to the upper cover. The upper cover has a top wall provided above the battery stack, and the top wall includes a base for fastening the second fastening member. The restraint band has a top plate portion provided above the top wall, the top plate portion has a bead extending in one direction, and the bead has a covering portion that covers the base. The second fastening member fastens the covering portion to the base.

Abstract: A vehicle frame includes an elongated main body member, a reinforcing member along the main body member, and an adhesive layer that joins the main body member and the reinforcing member. The main body member includes a main body first wall portion and two main body side wall portions. The reinforcing member includes a reinforcing first wall portion and two reinforcing side wall portions. The adhesive layer is formed such that a thickness between the main body side wall portion and the reinforcing side wall portion at a reinforcing side end portion is larger than a thickness between the main body first wall portion and the reinforcing first wall portion.

Abstract: A mounting structure for a power storage device includes: a power storage device including a power storage stack and a housing case; a floor member; and a rear bracket. The housing case includes a lower case having a rear wall, and an upper case. The floor member is provided with an attachment portion for attaching the rear bracket. The rear bracket includes a front end portion and a rear end portion that is attached to the attachment portion. The power storage stack is disposed inside the housing case to provide a gap between the power storage stack and the rear wall. The front end portion of the rear bracket is fixed to the rear wall to be located between an upper surface and a lower surface of the power storage stack in an up-down direction.

Abstract: A method for manufacturing a secondary battery electrode slurry composition, the method includes kneading a composition having a solids concentration of from 60 mass % to 80 mass % containing an active material, a thickener and water to obtain a first kneaded product; adding a hydrophilic binder (different from the thickener) and water to the first kneaded product, and kneading the same to obtain a second kneaded product; and adjusting the solids concentration of the second kneaded product to from 40 mass % to 60 mass %.

Abstract: A power storage device based on the present disclosure includes a plurality of power storage modules, a housing case, a plate, a shielding plate, and a heat conduction member. The power storage modules are disposed side by side along a first direction orthogonal to a vertical direction. The housing case includes an upper case and a lower case, and houses the power storage modules. The plate is disposed above the power storage modules in the housing case. The shielding plate is fixed to the plate and disposed between the power storage modules. The heat conduction member is disposed between the shielding plate and the lower case, and has a higher thermal conductivity than the shielding plate.

Abstract: A semiconductor device according to an embodiment includes a holding circuit including a buffer configured to obtain a heat stress information having a temperature dependency every predetermined period and a stress counter configured to accumulate the heat stress information and hold the accumulated value as a cumulative stress count value, a control circuit including an operation determination threshold value, and a wireless communication circuit. According to the semiconductor device according to the embodiment, while reducing the power consumption, it is possible to wirelessly transmit the cumulative heat stress information.

Abstract: A mounting structure for a power storage device includes: a power storage device including a power storage stack and a housing case; a floor member; and a rear bracket. The housing case includes a lower case having a rear wall, and an upper case. The floor member is provided with an attachment portion for attaching the rear bracket. The rear bracket includes a front end portion and a rear end portion that is attached to the attachment portion. The power storage stack is disposed inside the housing case to provide a gap between the power storage stack and the rear wall. The front end portion of the rear bracket is fixed to the rear wall to be located between an upper surface and a lower surface of the power storage stack in an up-down direction.

Abstract: A mounting structure for a power storage device includes: a power storage device including a power storage stack and a housing case; a floor member; and a rear bracket. The housing case includes a lower case having a rear wall, and an upper case. The floor member is provided with an attachment portion for attaching the rear bracket. The rear bracket includes a front end portion and a rear end portion that is attached to the attachment portion. The power storage stack is disposed inside the housing case to provide a gap between the power storage stack and the rear wall. The front end portion of the rear bracket is fixed to the rear wall to be located between an upper surface and a lower surface of the power storage stack in an up-down direction.

Abstract: A busbar module includes a case to be attached to a battery assembly, busbars and electric wires having a connection end to be connected to the busbars. The case includes busbar accommodation portions to accommodate the busbars and an electric wire routing groove portion to accommodate the electric wires. The electric wire routing groove portion includes a connection end accommodation portion to accommodate the connection end, an accommodation portion cover and an electric wire lead-out portion configured such that the electric wires are drawn out from the connection end accommodation portion toward a direction. An outer surface of the accommodation portion cover is to form a bottom surface of a routing path configured such that the electric wires drawn out from the connection end accommodation portion extend in the routing path.

Abstract: A battery module includes: a plurality of secondary batteries arranged side by side in one direction; a bus bar via which secondary batteries adjacent to each other in the one direction from among the secondary batteries are electrically connected to each other; and a voltage detecting terminal connected to the bus bar. Each of the secondary batteries includes a pair of external terminals. The bus bar includes connecting portions connected to corresponding external terminals, and a protrusion portion protruding upward from the connecting portions. The voltage detection terminal is connected to the protrusion portion.

Abstract: A vehicle includes a battery pack, seats, and seat rails. The battery pack has a battery case and a battery unit accommodated in the battery case. The seat rails are frame members disposed over the battery pack and fixed to the vehicular body. The battery case has an upper portion with four openings located under the seat rails and formed through both an upper surface of the battery case and a side surface of the battery case.

Abstract: A busbar module includes a case to be attached to a battery assembly, busbars and electric wires having a connection end to be connected to the busbars. The case includes busbar accommodation portions to accommodate the busbars and an electric wire routing groove portion to accommodate the electric wires. The electric wire routing groove portion includes a connection end accommodation portion to accommodate the connection end, an accommodation portion cover and an electric wire lead-out portion configured such that the electric wires are drawn out from the connection end accommodation portion toward a direction. An outer surface of the accommodation portion cover is to form a bottom surface of a routing path configured such that the electric wires drawn out from the connection end accommodation portion extend in the routing path.

Abstract: An object of the present invention is to provide a technique of duplexing monitor circuits in which a common cause failure can be eliminated. A semiconductor device has: a first monitor circuit monitoring that temperature or voltage of the semiconductor device is within a normal operation range; and a second monitor circuit monitoring normal operation of the first monitor circuit. The first and second monitor circuits generate information of temperature or voltage on the basis of different principles.

Abstract: A mounting structure for a power storage device includes: a power storage device including a power storage stack and a housing case; a floor member; and a rear bracket. The housing case includes a lower case having a rear wall, and an upper case. The floor member is provided with an attachment portion for attaching the rear bracket. The rear bracket includes a front end portion and a rear end portion that is attached to the attachment portion. The power storage stack is disposed inside the housing case to provide a gap between the power storage stack and the rear wall. The front end portion of the rear bracket is fixed to the rear wall to be located between an upper surface and a lower surface of the power storage stack in an up-down direction.

Abstract: The semiconductor device has a module having a predetermined function, an error information acquisition circuit for acquiring error information about an error occurring in the module, a stress acquisition circuit for acquiring a stress accumulated value as an accumulated value of stress applied to the semiconductor device, and an analysis data storage for storing analysis data as data for analyzing the state of the semiconductor device, the error information and the stress accumulated value at the time of occurrence of the error being associated with each other.

Abstract: To provide prepreg having high thermostability and a molded body (fiber reinforced composite) obtained from the prepreg, the prepreg is formed by impregnating a reinforced fiber having an elastic modulus of 100 to 900 GPa with an epoxy resin composition including the following Components A to D so as to have a resin content within a range of 25 to 50 mass %: Component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; Component B: an epoxy resin that is liquid at 30° C.; Component C: a diblock copolymer having a B-M structure, wherein M is a block including at least 50 mass % of methyl methacrylate, B is a block immiscible with the epoxy resins and the block M, a glass transition temperature of the block B being 20° C. or lower; and Component D: dicyandiamide, or an amine curing agent that is a derivative of dicyandiamide.

Abstract: A semiconductor device according to an embodiment includes a holding circuit including a buffer configured to obtain a heat stress information having a temperature dependency every predetermined period and a stress counter configured to accumulate the heat stress information and hold the accumulated value as a cumulative stress count value, a control circuit including an operation determination threshold value, and a wireless communication circuit. According to the semiconductor device according to the embodiment, while reducing the power consumption, it is possible to wirelessly transmit the cumulative heat stress information.

Abstract: To provide prepreg having high thermostability and a molded body (fiber reinforced composite) obtained from the prepreg, the prepreg is formed by impregnating a reinforced fiber having an elastic modulus of 100 to 900 GPa with an epoxy resin composition including the following Components A to D so as to have a resin content within a range of 25 to 50 mass %: Component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; Component B: an epoxy resin that is liquid at 30° C.; Component C: a diblock copolymer having a B-M structure, wherein M is a block including at least 50 mass % of methyl methacrylate, B is a block immiscible with the epoxy resins and the block M, a glass transition temperature of the block B being 20° C. or lower; and Component D: dicyandiamide, or an amine curing agent that is a derivative of dicyandiamide.

Abstract: The semiconductor device has a module having a predetermined function, an error information acquisition circuit for acquiring error information about an error occurring in the module, a stress acquisition circuit for acquiring a stress accumulated value as an accumulated value of stress applied to the semiconductor device, and an analysis data storage for storing analysis data as data for analyzing the state of the semiconductor device, the error information and the stress accumulated value at the time of occurrence of the error being associated with each other.

Abstract: A battery pack has a battery unit and a battery case. The battery case includes side frames and an upper frame. The upper frame includes an upper surface portion and a trailing portion that extends downward from an end portion of the upper surface portion. Each of the side frames includes a side surface portion, an intermediate portion that extends from an upper end of the side surface portion inward in the width direction so as to pass below the upper surface portion and faces the upper surface portion in an up-down direction, and a contact portion that extends upward from an end portion of the intermediate portion and is brought into contact with the upper surface portion. The trailing portion includes one or more access openings that are accessible to a space between the upper surface portion and the intermediate portion facing each other in the up-down direction.