Patents by Inventor Masami Fukunaga

Masami Fukunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5989436
    Abstract: A method and a device for dehydrating a heavy oil wherein an emulsion of water and a heavy oil is mixed in a stirring chamber together with a suitable amount of an emulsion breaker, the mixture is subjected to separation in a two-phase separation tank to a heavy oil-rich component and a water-rich component, the heavy oil-rich component is then fed to a dehydrator of a high voltage charge type in which separation to a dehydrated heavy oil and a water-rich component is effected, the water-rich component fractions supplied from the two-phase separation tank and the dehydrator are mixed in a pipeline, the mixture thus obtained is admixed with an O/W emulsion breaker and then, fed to a stirring chamber and finally separated to a heavy oil-containing component and a heavy oil-free water layer in a second separation chamber.
    Type: Grant
    Filed: November 14, 1996
    Date of Patent: November 23, 1999
    Assignee: Mitsubishi Jukogyo Kabushiki Kaisha
    Inventors: Hiroshi Suzumura, Masato Kaneko, Isao Matsuura, Masami Fukunaga, Masaki Iijima
  • Patent number: 5713751
    Abstract: An IC socket includes a base constructed integral with a top face for placing the resting portions of contact pins, an back face opposite to the top face, space passing through the base just under the back face, a plurality of first slit holes extending outwardly from the space, and a plurality of second slit holes arranged among the first slit holes adjacent to one another and outside the first slit holes. First contact pins are such that their pillar portions are inserted in the first slit holes, and second contact pins are such that their pillar portions are inserted in the second slit holes. In this way, all the contact pins is mounted to the base. The first and second contact pins are electrically connected with the leads of an integrated circuit by sandwiching the leads between the resting portions and the contact portions of the contact pins.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: February 3, 1998
    Assignee: Enplas Corporation
    Inventor: Masami Fukunaga
  • Patent number: 5669780
    Abstract: An IC socket comprises a socket body, a cover urged upward, stage means for mounting an IC device, a slide plate urged downward for actuating contact pins, and two slide bars each of which is pivotably mounted, in one end region thereof, to the cover and has a pushing portion and a shaft in another end region thereof. With respect to each of the slide bars, the pushing portion abuts on a protruding portion of the slide plate and the shaft slidably abuts on a concave portion of a guide. When the cover is pushed down, the shafts open rightward and leftward at the bottom, to cause the pushing portions to push up the slide plate. As the shaft approaches a position under the protruding portion, reaction against the cover is reduced. In this manner, the IC socket is enabled to stay increase in resistance against the pushing-down operation of the cover.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: September 23, 1997
    Assignee: Enplas Corporation
    Inventor: Masami Fukunaga
  • Patent number: 4691975
    Abstract: In order to construct an IC-tester socket as a whole into a compact size and to make the mounting and removal of an IC package easy and further to enable stable and positive contact between the lead terminals of the IC package and contact pins, the IC-tester socket is comprised of a socket body capable of accomodating an IC package; a plurality of contact pins provided within the socket body and each having resilient first and second arms capable, in their normal state, of nipping each said lead terminal; and releasers mounted vertically movably on the socket body for being able to release the nipping of the lead terminals done by these first and second arms.
    Type: Grant
    Filed: October 21, 1986
    Date of Patent: September 8, 1987
    Assignee: Dai-Ichi Seiko Kabushiki Kaisha
    Inventors: Masami Fukunaga, Tomoyoshi Yamaguchi