Abstract: A semiconductor storage device is provided, the semiconductor storage device including: a resistance element configured to generate a reference potential to be supplied to a sense amplifier; and a switch unit having at least two states including a state in which the reference potential to be supplied to the sense amplifier is generated by injection of a current to the resistance element, and a state in which a reference potential generated outside the semiconductor storage device is supplied to the sense amplifier.

Abstract: To provide a sense amplifier which is capable of implementing a large capacity, a high speed, and an increased data rate of a semiconductor storage device. A sense amplifier is provided, the sense amplifier including: first and second inverters including switches configured to control an activation state and an inactivation state, and having inputs and outputs cross-coupled to each other, respectively; and first and second switches configured to switch between connection and disconnection of each of the cross-coupled first and second inverters with respect to an input from a storage element.

Abstract: To provide a novel and improved semiconductor storage device which is capable of implementing a large capacity by enabling normal reading of a value from a storage element. A semiconductor storage device is provided, the semiconductor storage device including: a memory element; a reference element in a first resistance state for generating a reference potential for identifying a value held in the memory element; and a reference element in a second resistance state in which a resistance value of the reference element is higher than that in the first resistance state for generating the reference potential, in which when generating the reference potential, the number of reference elements in the first resistance state is larger than the number of reference elements in the second resistance state.

Abstract: A paper straw 10 is comprised of an elongated paper tube 30 and a bending structure 20 composed in the tube 30. The bending structure 20 is comprised of a plural stiff part 21 and a plural soft part 22 alternately turn around thereof and make a tubular form. The paper tube is made from paper or the material made from plant. The stiff part 21 may have a large thickness and the soft part 22 may have a smaller thickness.

Abstract: To provide a sense amplifier which is capable of implementing a large capacity, a high speed, and an increased data rate of a semiconductor storage device. A sense amplifier is provided, the sense amplifier including: first and second inverters including switches configured to control an activation state and an inactivation state, and having inputs and outputs cross-coupled to each other, respectively; and first and second switches configured to switch between connection and disconnection of each of the cross-coupled first and second inverters with respect to an input from a storage element.

Abstract: An on-vehicle system comprises a Clock Extension Peripheral Interface (CXPI) bus and a device coupled to the CXPI bus as a slave node. The device comprises a transceiver configured to: generate a first signal by delaying an inverted signal of a transmission data signal; generate a second signal based on the transmission data signal, where the second signal has a low slew rate; selectively output the first signal or the second signal as a third signal, in response to a selector signal; and generate a clock signal in response to the third signal, where the clock signal is at a high level when the third signal is at a low level, and where the clock signal is at the low level when the third signal is at the high level.

Abstract: To provide a semiconductor storage device which is capable of setting a reference potential with a high reliability. A semiconductor storage device is provided, the semiconductor storage device including: a resistance element configured to generate a reference potential to be supplied to a sense amplifier; and a switch unit having at least two states including a state in which the reference potential to be supplied to the sense amplifier is generated by injection of a current to the resistance element, and a state in which a reference potential generated outside the semiconductor storage device is supplied to the sense amplifier.

Abstract: To provide a novel and improved semiconductor storage device which is capable of implementing a large capacity by enabling normal reading of a value from a storage element. A semiconductor storage device is provided, the semiconductor storage device including: a memory element; a reference element in a first resistance state for generating a reference potential for identifying a value held in the memory element; and a reference element in a second resistance state in which a resistance value of the reference element is higher than that in the first resistance state for generating the reference potential, in which when generating the reference potential, the number of reference elements in the first resistance state is larger than the number of reference elements in the second resistance state.

Abstract: An on-vehicle system comprises a Clock Extension Peripheral Interface (CXPI) bus and a device coupled to the CXPI bus. The device comprises a transceiver configured to: detect a baud rate clock signal and a phase difference between the baud rate clock signal and an input data signal that was generated asynchronously from the baud rate clock signal; obtain a timing from an edge of the baud rate clock signal based the phase difference; capture a value of the input data signal at the timing; and transmit the captured value as an output data signal over the CXPI bus.

Abstract: A magnetic recording medium includes a nonmagnetic substrate and at least a magnetic layer, a protective layer, and a lubricating layer provided on the nonmagnetic substrate. The magnetic recording medium is characterized in that the lubricating layer is formed of a lubricating agent represented by general formulas (1), (2) or (3), in which substituents R1, R2, R3, and R4 in the lubricating agent represent organic groups, at least one of the substituents R1 and R2 at the end part of the lubricating agent and the substituents R3 and R4 contain a plurality of functional groups, and the shortest distance between the functional groups is a distance of three or more atoms, preferably five atoms. The magnetic recording medium may be used for a heat assisted recording method in which the temperature of the magnetic layer reaches 150° C. to 200° C.

Abstract: A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for the buffer part in contact with the object in the chamber, a cooler for the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object.

Abstract: [Object of the Invention] To decrease the load applied to a spine so as to prevent and treat lumbago, when carrying various shapes of goods with hands. [Solution] A load carrying supporter used for carrying goods by hands, comprising an attachment attached to a worker's body and a load supporter fixed to the attachment. The attachment attached around the worker's waist, and the load supporter has a high frictional resistance material facing outward from the worker's body. Most of the load is lead to the waist and the distance between the loading point and the spine becomes small. Therefore the pressure and the bending moment on the spine become very small.

Abstract: A heat-bonding apparatus and method of manufacturing a heat-bonded product without overheating during cooling thereof after the completion of the heat-bonding, where the object can be cooled in a shorter time than the conventional when the heat-bonding is performed in a vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part placed into contact with the object, an object temperature sensor for detecting a temperature of the object heated through the buffer part, a buffer temperature sensor for detecting a temperature of the buffer part, a vacuum breaker for breaking the vacuum, and a controller for operating the vacuum breaker to break the vacuum when a temperature difference between a temperature detected by the object temperature sensor and a temperature detected by the buffer temperature sensor falls within a range of specified temperature difference.

Abstract: To provide a thermal processing apparatus where a projection area perpendicular to the axis of a sealing structure and attachment structure of heat radiation heater is decreased and a chamber volume is decreased. The apparatus has a chamber for accommodating a workpiece of a thermal processing object, the chamber having a partition wall for partitioning inside from outside of the chamber, a heat radiation heater disposed penetrating the partition wall, wherein the heater has a ring seal arranged on an outer peripheral surface of the extension section, and hermetically sealing the chamber, and a heat blocking plate arranged between the heat radiation unit and the ring seal in the axial direction of the glass tube, for blocking heat radiated from the heat radiation unit to the ring seal, the heat blocking plate having an inner peripheral surface fitting along the extension section.

Abstract: A heat-bonding apparatus and method of manufacturing a heat-bonded product without overheating during cooling thereof after the completion of the heat-bonding, where the object can be cooled in a shorter time than the conventional when the heat-bonding is performed in a vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part placed into contact with the object, an object temperature sensor for detecting a temperature of the object heated through the buffer part, a buffer temperature sensor for detecting a temperature of the buffer part, a vacuum breaker for breaking the vacuum, and a controller for operating the vacuum breaker to break the vacuum when a temperature difference between a temperature detected by the object temperature sensor and a temperature detected by the buffer temperature sensor falls within a range of specified temperature difference.

Abstract: A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature suitable for heat-bonding, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part in contact with the object in the chamber, a cooler for discharging heat of the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object.

Abstract: An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece.

Abstract: To provide a thermal processing apparatus where a projection area perpendicular to the axis of a sealing structure and attachment structure of heat radiation heater is decreased and a chamber volume is decreased. The apparatus has a chamber for accommodating a workpiece of a thermal processing object, the chamber having a partition wall for partitioning inside from outside of the chamber, a heat radiation heater disposed penetrating the partition wall, wherein the heater has a ring seal arranged on an outer peripheral surface of the extension section, and hermetically sealing the chamber, and a heat blocking plate arranged between the heat radiation unit and the ring seal in the axial direction of the glass tube, for blocking heat radiated from the heat radiation unit to the ring seal, the heat blocking plate having an inner peripheral surface fitting along the extension section.

Abstract: An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece.

Abstract: Disclosed herein is a storage control device that includes a temperature sensor, temperature information selection section, refresh command reception section and trigger issuance frequency setting section.