Patents by Inventor Masami Nishikawa

Masami Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020124921
    Abstract: A method for correcting dynamic unbalance of a pneumatic tire which comprises adhering a counter weight to an inner surface of the tire to reduce dynamic unbalance of the tire, wherein the counter weight is made of a material having a specific gravity in a range of from 0.016 to 0.21 such as a strip of a spongy material.
    Type: Application
    Filed: December 18, 2001
    Publication date: September 12, 2002
    Inventors: Tokuzo Nakajima, Hiroyuki Kobayashi, Naoki Yukawa, Masami Nishikawa
  • Publication number: 20020059971
    Abstract: A tire noise reducing system comprises a wheel rim, a pneumatic tire to be mounted on the wheel rim and a noise damper to be disposed in an annular tire cavity enclosed by the wheel rim and the pneumatic tire mounted thereon, wherein the noise damper is made of a multi-cellular material whose volume S2 is in a range of not less than 0.4% of the volume S1 of said annular tire cavity. Preferably, the specific gravity of the damper is set in a range of from 0.005 to 0.06.
    Type: Application
    Filed: August 30, 2001
    Publication date: May 23, 2002
    Inventors: Naoki Yukawa, Tokuzo Nakajima, Masami Nishikawa, Chieko Aoki, Hideaki Sugihara
  • Patent number: 6343843
    Abstract: A pneumatic tire, a wheel rim, and an assembly of a pneumatic tire and a wheel rim, which are provided with lawn-like materials for damping air resonance of the tire cavity are disclosed. An assembly of a pneumatic tire and a wheel rim where a foaming agent is injected into the tire cavity is also disclosed.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: February 5, 2002
    Assignee: Sumitomo Rubber Industries, Ltd.
    Inventor: Masami Nishikawa
  • Publication number: 20010007268
    Abstract: A tire noise damper to be disposed in an annular tire hollow formed between a wheel rim and a pneumatic tire mounted thereon, the damper made of a flexible material and comprising a base to be secured to the wheel rim and at least one flap extending from the base to be risen radially outwards from the wheel rim by centrifugal force during running to block the annular tire hollow. For example, the damper comprises at least one annular elastic band to be put around the wheel rim, the annular band provided with at least one U-cut for forming a flap, and the base is formed by the remaining annular portion of the band. In another example, the damper is made of a strip of the fixable material having a certain length, the base is formed by one end portion of the strip, and the flap is formed by the remaining portion of the strip.
    Type: Application
    Filed: December 22, 2000
    Publication date: July 12, 2001
    Inventors: Naoki Yukawa, Masami Nishikawa, Chieko Aoki, Hideaki Sugihara
  • Publication number: 20010006084
    Abstract: A tire noise reducing system comprises a wheel rim, a pneumatic tire to be mounted on the wheel rim to form an annular tire hollow, and a resonance damper to be disposed in the annular tire hollow, wherein the damper is one of an annular elastic loose band disposed around the rim and a flexible slack strip having a certain length and fixed to the wheel rim at two points so that a portion between the fixed points slacks, whereby a loose portion of the loose band and the slack portion of the slack strip are risen by a centrifugal force during running to block the annular tire hollow.
    Type: Application
    Filed: December 22, 2000
    Publication date: July 5, 2001
    Inventors: Naoki Yukawa, Tokuzo Nakajima, Masami Nishikawa, Chieko Aoki, Hideaki Sugihara
  • Patent number: 5901984
    Abstract: A coupling mechanism for removably connecting a fluid line to an apparatus such as a mass flow controller and includes a flange member for connection to the apparatus so that it is cantilevered from the apparatus and provides a fluid connection with a bore opening that is vertically aligned. A yoke member is dimensioned to extend over the flange member and have a corresponding fluid conduit and bore that can be aligned vertically with the bore opening on the flange member. A seal member can be positioned between the yoke member and the flange member. A spacer member is mounted in the yoke member and a fastener member can be aligned vertically to exert a force on the flange member to apply a sealing pressure to the seal member while locking the yoke member to the flange member.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: May 11, 1999
    Assignee: Stec Inc.
    Inventor: Masami Nishikawa
  • Patent number: 5031019
    Abstract: A method for manufacturing a Bi-CMOS device by preparing both of bipolar and MOS standard cells in a library is provided. A substrate of a first conductivity type is provided and a plurality of buried layers of a second conductivity type are formed on selected locations of the substrate. Then an epitaxial layer of the first conductivity type is formed on the substrate covering the buried layers. Then a plurality of wells of the second conductivity type are formed in the epitaxial layer such that each of the wells extends through the epitaxial layer from the top surface to at least a portion of the corresponding buried layer to thereby define a plurality of electrically isolated islands in the epitaxial layer. Then a bipolar transistor is formed in at least one of the islands with a MOS transistor formed in at least another of the islands.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: July 9, 1991
    Assignee: Ricoh Company, Ltd.
    Inventors: Daisuke Kosaka, Yoshinori Ueda, Tetsuo Hikawa, Masami Nishikawa
  • Patent number: 4857484
    Abstract: A method for forming a bonding connection in a semiconductor integrated cirucit device includes a step of ion implanting a bonding pad of aluminum with silicon atoms before bonding a bonding wire to the bonding pad. The silicon atoms are introduced into the bonding pad only at its surface and its vicinity, so that the bonding pad is provided with an enhanced humidity-resistant characteristic while maintaining the overall electrical resistance of an interconnection system at a low level.
    Type: Grant
    Filed: February 22, 1988
    Date of Patent: August 15, 1989
    Assignee: Ricoh Company, Ltd.
    Inventor: Masami Nishikawa