Abstract: The pattern transfer apparatus includes a first substrate on which a circuit pattern of an arbitrary semiconductor device is drawn, a first stage including a substrate holding mechanism for holding the first substrate, an illumination optical system for illuminating the circuit pattern of the semiconductor device drawn on the first substrate, a second stage on which a second substrate can be mounted, a reducing optical system or an equimultiple optical system for transferring a part of the circuit pattern of the semiconductor device drawn on the first substrate, and a mechanism for moving at least one of first and second elements, the first element being one of the first and second stages and the second element being the reducing optical system or an equimultiple optical system, wherein the first stage has a holding mechanism for holding one of substrates of at least two sizes and for changing a gripping force in accordance with the sizes of the substrates.

Abstract: This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film.

Abstract: A plasma processing apparatus includes a first electrode which is substantially flat and has a substrate mounting region mounted with a substrate to be treated, a chamber for containing the first electrode, gas introducing means for introducing a predetermined gas into the chamber, gas exhausting means for exhausting the gas from the chamber, a second electrode constituted of one of a metal portion of the chamber and a metal plate provided inside the chamber, power supply means for supplying high-frequency power between the first electrode and the second electrode, and an insulative cover for covering a surface of the first electrode other than the substrate mounting region. The substrate mounting region is formed as a convex portion on the first electrode, and an outside shape thereof is smaller than that of the substrate. The substrate is mounted on the substrate mounting region so as to completely cover the substrate mounting region.

Abstract: This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film.

Abstract: This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film.

Abstract: A method for forming an X-ray exposure mask having an X-ray permeable film with a high visible-light transmissivity. The method includes the steps of forming an aluminum oxide anti-reflective film on an x-ray permeable film, placing an x-ray absorber on the anti-reflective film and etching with the x-ray absorber to form x-ray pattern.

Abstract: An X-ray mask can be manufactured by forming an X-ray transmitting thin film on a mask support, forming an X-ray absorber thin film on the X-ray transmitting thin film, and patterning the X-ray absorber thin film with a desired pattern to form an X-ray absorber pattern. Prior to the patterning, at least one inert element with an atomic number greater than that of neon is ion-implanted in the X-ray absorber thin film.

Abstract: An X-ray mask includes an X-ray transmitting thin film consisting of SiC, a W X-ray absorber formed on one surface of the thin film and having a predetermined pattern, and a support frame arranged on a peripheral portion of the thin film. The thin film is constituted by a plurality of SiC layers having different C/Si composition ratios. When the thin film is formed by a CVD method, the flow rate of a gas containing Si is fixed while a gas containing C or a diluted gas mixture of the gas containing C is changed. Consequently, the visible light transmittance of the thin film is improved.

Abstract: Distillers solubles are purified by a centrifugal separation to a degree above 50,000 which is the product of g x minute, or a filtration with addition of a filter aid. The clarified matter is purified by a molecular sieve ultrafiltration treatment, reverse osmosis or an organic solvent precipitation. The clarified matter or purified matter thus obtained is pulverized by spray drying, lyophilic drying or air drying.Said clarified matter, purified matter or pulverized matter is added to a fermentation medium or a feed as an available component.

Abstract: Distillers solubles are purified by a centrifugal separation to a degree above 50,000, which is the product of g.times.minute, or a filtration with addition of a filter aid. The clarified matter is purified by a molecular sieve treatment, ultrafiltration, reverse osmosis or an organic solvent precipitation. The clarified matter or purified matter thus obtained is pulverized by spray drying, lyophilic drying or air drying.Said clarified matter, purified matter or pulverized matter is added to a fermentation medium or a feed as an available component.

Abstract: Distillers solubles are purified by a centrifugal separation to a degree above 50,000, which is the product of g .times. minute, or a filtration with addition of a filter aid. The clarified matter is purified by a molecular sieve treatment, ultrafiltration, reverse osmosis or an organic solvent precipitation. The clarified matter or purified matter thus obtained is pulverized by spray drying, lyophilic drying or air drying.Said clarified matter, purified matter or pulverized matter is added to a fermentation medium or a feed as an available component.