Abstract: A method for manufacturing a semiconductor light-emitting device of the invention includes: forming a semiconductor layer including a light-emitting layer and a first interconnect layer on a major surface of a temporary substrate; dividing the semiconductor layer and the first interconnect layer into a plurality of chips by a trench; collectively bonding each divided portion of the first interconnect layer of a plurality of chips to be bonded not adjacent to each other out of the plurality of chips on the temporary substrate to a second interconnect layer while opposing the major surface of the temporary substrate and the major surface of a supporting substrate forming the second interconnect layer, and collectively transferring a plurality of the bonded chips from the temporary substrate to the supporting substrate after irradiating interfaces between the bonded chips and the temporary substrate and separating the chips and the temporary substrate from each other.

Abstract: A method for manufacturing a semiconductor device includes: irradiating a growth substrate with laser light to focus the laser light into a prescribed position inside a crystal for a semiconductor device or inside the growth substrate, the crystal for the semiconductor device being formed on a first major surface of the growth substrate; moving the laser light in a direction parallel to the first major surface; and peeling off a thin layer including the crystal for the semiconductor device from the growth substrate, a wavelength of the laser light being longer than an absorption end wavelength of the crystal for the semiconductor device or the growth substrate, the laser light being irradiated inside a crystal for the semiconductor device or inside the growth substrate.

Abstract: The method of the invention for producing a group III-V semiconductor device includes forming, on a base, a plurality of semiconductor devices isolated from one another, each semiconductor device having at least an n-layer proximal to the base, and a p-layer distal to the base, and having a p-electrode formed on the top surface of the p-layer, and a first low-melting-point metal diffusion preventing layer, the low-melting-point metal diffusion preventing layer being formed on the top surface of the p-electrode; forming, from a dielectric material, a side-surface protective film so as to cover a side surface of each semiconductor device; bonding the semiconductor device to a conductive support substrate via a low-melting-point metal layer; and removing the base through the laser lift-off process.

Abstract: A method of making a light emitting element, the light emitting element with a semiconductor layer represented by: AlXInYGa1?X?YN (0?X?1, 0?Y?1, 0?X+Y?1), has the step of wet-etching a surface of the semiconductor layer by using an etching solution to have a roughened surface on the semiconductor layer. The wet-etching is conducted without irradiating the surface of the semiconductor layer with a light with a wavelength region corresponding to energy higher than bandgap energy of the semiconductor layer.

Abstract: A method for producing a Group III-V semiconductor device, includes forming, on a base, a plurality of semiconductor devices isolated from one another, forming, through ion implantation, a high-resistance region in a surface layer of a side surface of each semiconductor device, after formation of the high-resistance region, forming a p-electrode and a low-melting-point metal diffusion prevention layer on the top surface of the semiconductor device, bonding the semiconductor device to a conductive support substrate via a low-melting-point metal layer, and removing the base through the laser lift-off process.

Abstract: A method for producing a Group III nitride compound semiconductor element includes growing an epitaxial layer containing a Group III nitride compound semiconductor using a different kind of substrate as an epitaxial growth substrate, adhering a supporting substrate to the top surface of the epitaxial growth layer through a conductive layer, and then removing the epitaxial growth substrate by laser lift-off. Before adhesion of the epitaxial layer and the supporting substrate, a first groove that at least reaches an interface between the bottom surface of the epitaxial layer and the epitaxial growth substrate from the top surface of the epitaxial layer formed on the epitaxial growth substrate and acts as an air vent communicating with the outside of a wafer when the epitaxial layer and the supporting substrate are joined to each other.

Abstract: The present invention contemplates preventing clogging of a dicer for forming separation trenches in a semiconductor wafer, and as well improving the yield of a semiconductor device cut out of the semiconductor wafer. A second adhesive to be charged into spaces contains an epoxy material as a base material. Silica filler particles (diameter: about 2 to about 4 ?m) are added to the base material in an appropriate amount. Charging of the second adhesive may be performed by adding the adhesive dropwise to a side wall of a semiconductor wafer, or by immersing an edge of the semiconductor wafer in the adhesive in the form of liquid. When a liquid-form epoxy material of low viscosity is employed, the spaces can be evenly filled with the second adhesive by capillary action. An n-electrode is formed on an exposed surface of an n-type layer through vapor deposition employing a resist mask. Separation trenches are formed through half-cut dicing from the exposed surface of the n-type layer toward the second adhesive.

Abstract: A method of making a light emitting element, the light emitting element with a semiconductor layer represented by: AlxInyGa1-x-yN (0?X?1, 0?Y?1, 0?X+Y?1), has the step of wet-etching a surface of the semiconductor layer by using an etching solution to have a roughened surface on the semiconductor layer. The wet-etching is conducted without irradiating the surface of the semiconductor layer with a light with a wavelength region corresponding to energy higher than bandgap energy of the semiconductor layer.

Abstract: A Group III-V semiconductor device bonded to a conductive support substrate, which device has a side surface whose surface layer has a high-resistance region formed through ion implantation.

Abstract: The method of the invention for producing a group III-V semiconductor device includes forming, on a base, a plurality of semiconductor devices isolated from one another, each semiconductor device having at least an n-layer proximal to the base, and a p-layer distal to the base, and having a p-electrode formed on the top surface of the p-layer, and a first low-melting-point metal diffusion preventing layer, the low-melting-point metal diffusion preventing layer being formed on the top surface of the p-electrode; forming, from a dielectric material, a side-surface protective film so as to cover a side surface of each semiconductor device; bonding the semiconductor device to a conductive support substrate via a low-melting-point metal layer; and removing the base through the laser lift-off process.

Abstract: In layer structure 20 of a semiconductor laser of a surface emitting type, 21 and 24 represent an n-type contact layer made of n-type GaN and a p-layer made of p-type AlGaN, respectively. In the laser, an n-type DBR layer 22 made of n-type InGaN and a DBR layer 25 made of dielectric are formed on and below a InGaN active layer 23, respectively, each of which forms a reflection surface vertical to the z axis. By forming a reflection surface vertical to the z axis at each of on and above the active layer 23, a resonator is obtained. Here optical distance between two reflection facets are arranged to an integral multiple of half a oscillation wavelength. Consequently, the present invention enables to produce a semiconductor laser of a surface emitting type easier by far compared with a conventional invention.

Abstract: An object of the invention is to prevent defoliation of a first electrode layer of the device of the invention including a high-reflectance metal layer. In the group III nitride based compound semiconductor optical device of the invention, an electrode formed on a p-type layer has a first electrode layer which is formed from high-reflectance rhodium (Rh) and which is directly joined to the p-type layer, and a second electrode layer which is formed from titanium (Ti) having reactivity with nitrogen and which is provided so as to cover the first electrode layer, and a portion of the second electrode layer is joined to the uppermost layer of the group III nitride based compound semiconductor.

Abstract: The present invention contemplates preventing clogging of a dicer for forming separation trenches in a semiconductor wafer, and as well improving the yield of a semiconductor device cut out of the semiconductor wafer. A second adhesive to be charged into spaces contains an epoxy material as a base material. Silica filler particles (diameter: about 2 to about 4 ?m) are added to the base material in an appropriate amount. Charging of the second adhesive may be performed by adding the adhesive dropwise to a side wall of a semiconductor wafer, or by immersing an edge of the semiconductor wafer in the adhesive in the form of liquid. When a liquid-form epoxy material of low viscosity is employed, the spaces can be evenly filled with the second adhesive by capillary action. An n-electrode is formed on an exposed surface of an n-type layer through vapor deposition employing a resist mask. Separation trenches are formed through half-cut dicing from the exposed surface of the n-type layer toward the second adhesive.

Abstract: The interval ? between each stripe of interference fringe generated in a conventional n-type contact layer is determined by a function (f(?)=?(n2?neq2)?1/2/2) wherein ?, n, and neq represent luminous wavelength ? of lights radiated from a light emitting part 104, refractive index n of the n-type contact layer, and equivalent refractive index neq of the n-type contact layer in guided wave mode, respectively. The remaining thickness ? of the n-type contact layer 102 at the concave part D which is formed at the back surface of the crystal growth substrate may be about ?/2. When at least one portion of the n-type contact layer which is formed right beneath the laser cavity remains with about ? in thickness, the n-type contact layer arranged even right beneath the laser cavity can maintain excellent contact to a negative electrode.

Abstract: In layer structure 20 of a semiconductor laser of a surface emitting type, 21 and 24 represent an n-type contact layer made of n-type GaN and a p-layer made of p-type AlGaN, respectively. In the laser, an n-type DBR layer 22 made of n-type InGaN and a DBR layer 25 made of dielectric are formed on and below a InGaN active layer 23, respectively, each of which forms a reflection surface vertical to the z axis. By forming a reflection surface vertical to the z axis at each of on and above the active layer 23, a resonator is obtained. Here optical distance between two reflection facets are arranged to an integral multiple of half a oscillation wavelength. Consequently, the present invention enables to produce a semiconductor laser of a surface emitting type easier by far compared with a conventional invention.

Abstract: A scintillator includes a Group III nitride compound semiconductor layer that emits fluorescent light when radiated by, for example, a CU-K?-ray source, an X-ray source, or a ?-ray source, and a scintillation counter including a scintillator having a Group III nitride compound semiconductor.

Abstract: The interval &Lgr; between each stripe of interference fringe generated in a conventional n-type contact layer is determined by a function (f(&lgr;)=&lgr;(n2−neq2)−1/2/2) wherein &lgr;, n, and neq represent luminous wavelength &lgr; of lights radiated from a light emitting part 104, refractive index n of the n-type contact layer, and equivalent refractive index neq of the n-type contact layer in guided wave mode, respectively. The remaining thickness &dgr; of the n-type contact layer 102 at the concave part D which is formed at the back surface of the crystal growth substrate may be about &Lgr;/2. When at least one portion of the n-type contact layer which is formed right beneath the laser cavity remains with about &dgr; in thickness, the n-type contact layer arranged even right beneath the laser cavity can maintain excellent contact to a negative electrode.

Abstract: A scintillator is made of a Group III nitride compound semiconductor layer.

Abstract: When sapphire is epitaxially grown on a seed substrate of Si at a growth temperature of about 350° C. by an ionized cluster beam vapor deposition and epitaxy method, a &ggr; phase Al2O3 layer is formed. When the &ggr; phase Al2O3 layer is exposed to a high temperature of not lower than 1000° C., the &ggr; phase Al2O3 layer then changes to an &agr; phase Al2O3 layer by phase transition. A known or optional semiconductor light-emitting element can be formed on the &agr; phase sapphire. When the seed substrate of Si is then selectively removed by etching, a semiconductor light-emitting element having a light-extracting surface of the sapphire processed into a desired shape can be obtained. As a result, external quantum efficiency of the semiconductor light-emitting element can be improved as well as light-condensing characteristic and directivity of light output from the semiconductor light-emitting element can be improved.