Abstract: A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.

Abstract: A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.

Abstract: The invention is objected to perform fixing in an optimum fixing condition even with various kinds of recording materials or the like while improving usability by discriminating the kinds of recording materials An image reading sensor 123 includes a reflective LED 301, a transmissive LED 303 disposed on the opposite side relative to a recording material 304 for detecting the transmitted amount of light, a CMOS area sensor 211, and an imaging lens 1113. The light from the reflective LED 301 as a light source is applied toward the surface of the recording material 304, and the reflected light from the recording material 304 is collected via the lens 303 and an image is formed on the CMOS area sensor 211. The LED 301 is disposed so as to apply LED light to the surface of the recording material 304 diagonally at a predetermined angle.

Abstract: In a probe apparatus comprising an inspecting device, an intermediate substrate and a probe substrate, in which the inspecting device is electrically connected to a proximal end of the intermediate substrate, and the intermediate substrate has a distal end electrically connected to a proximal end of the probe substrate, and the probe substrate has a distal end electrically connectable to a substrate under inspection, a plurality of probe substrates are electrically connected to the single intermediate substrate. When a particular probe substrate 4 is damaged, only the particular probe substrate 4 may be changed, the other probe substrates 4 continuing to be used, thereby achieving economy.

Abstract: In a picture reading device having a light emitting element that obliquely irradiates the surface of a paper with light, an area sensor that reads its irradiated area as a picture in which information related to a paper is read on the basis of the read results, the light irradiating element is arranged with an angle so as to irradiate the light from a direction oblique to a conveying direction of the paper. As a result, the picture reading device of the present invention eliminates such a problem that the same paper surface is received as a different image depending on the incident direction of the light, and the information related to an object to be read cannot be accurately read.

Abstract: The type of printing medium on which an image will be formed is discriminated based upon the image of the medium surface read by an image reading unit for reading the surface as an image. If the discriminated medium type is other than a prescribed printing medium, the image is formed without changing an image formation parameter. When the type of printing medium and the state of the surface are discriminated, image formation can be performed in the most stable image forming mode if an abnormality occurs.

Abstract: A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

Abstract: To provide a recording-material type determination apparatus and recording-material type determination method which can determine the type of recording material using simple calculations as well as to provide an image forming apparatus capable of obtaining stable image quality independent of the type of recording material using the apparatus and method. Based on data read by a read unit which reads surface images of recording material, a first calculation unit calculates the depth of irregularities in the surface of recording material and stores the results of calculation in a register A while a second calculation unit calculates the spacing of irregularities on the surface of the recording material and stores the results of calculation in a register B. Based on the values in the registers A and B, the type of recording material such as gloss paper, plain paper, rough paper or OHT is determined.

Abstract: This noncontact ID card or the like comprises an antenna circuit board having an antenna formed on a substrate and an interposer board having expanded electrodes formed on a substrate where an IC chip is embedded, the expanded electrodes being connected to electrodes of the IC chip, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the expanded electrodes.

Abstract: A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.

Abstract: In a picture reading device having a light emitting element that obliquely irradiates the surface of a paper with light, an area sensor that reads its irradiated area as a picture in which information related to a paper is read on the basis of the read results, the light irradiating element is arranged with an angle so as to irradiate the light from a direction oblique to a conveying direction of the paper. As a result, the picture reading device of the present invention eliminates such a problem that the same paper surface is received as a different image depending on the incident direction of the light, and the information related to an object to be read cannot be accurately read.

Abstract: In dual-side image formation, in order to suppress a difference in gloss between images on both sides of a recording material, the invention provides a fixing apparatus including a fixing member for fixing an image on the recording material by heat; a heat supply member for supplying heat from the exterior of the fixing member; dual-side image forming means which forms images on both sides of the recording material, wherein, in a dual-side image forming operation, a first image forming operation for forming an image on a first side of the recording material and a second image forming operation for forming an image on a second side of the recording material are executed repeatedly; and heat supply control means which controls heat supplied to the fixing member, wherein a heat supplying condition of the heat supply member is changed according to the side of the recording material when an image is fixed thereon.

Abstract: A fixing apparatus including a pair of rotary members forming a nip for pinching and conveying a recording material, and a rotatable heat supplying member in contact with at least either of the rotary members and supplying the rotary member with heat. An image forming on the pinched and conveyed recording material is fixed thereto by heat, and the rotary member receiving heat from the heat supplying member has different external diameters along the longitudinal direction and the heat supplying member has different plural external diameters so as to follow the shape of the rotary member.

Abstract: Provided is a picture reading device that is suited for discriminating the type/surface condition of a recording medium while requiring only a small circuit scale and less memory, and an image forming apparatus that uses the picture reading device. In a CMOS area sensor chip having a plurality of photoelectric conversion elements, there is provided a calculating unit for calculating the maximum value, the minimum value, and an average value of digital information related to a photoelectric conversion element in a specific area among the plurality of photoelectric conversion elements. Information calculated by the calculating unit is output in addition to digital information related to the plurality of photoelectric conversion elements.

Abstract: To provide a recording-material type determination apparatus and recording-material type determination method which can determine the type of recording material using simple calculations as well as to provide an image forming apparatus capable of obtaining stable image quality independent of the type of recording material using the apparatus and method.

Abstract: The invention concerns an etching liquid appropriate for etching thermoplastic polyimide resins. The etching liquid it is composed of an aliphatic amino-alcohol whose number of carbon is equal or inferior to 4 having an amino group or an imino group and a hydroxyl group in a molecular thereof, and a tetra alkyl ammonium hydroxide aqueous solution.

Abstract: A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

Abstract: There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.

Abstract: This noncontact ID card or the like comprises an antenna circuit board having an antenna formed on a substrate and an interposer board having expanded electrodes formed on a substrate where an IC chip is embedded, the expanded electrodes being connected to electrodes of the IC chip, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the expanded electrodes.

Abstract: The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened.