Abstract: In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

Abstract: A resin etching solution containing a hydroxyalkylamine, an alkali metal compound and water, or an aliphatic alcohol, an aliphatic amine, an alkali metal compound and water, and a process for etching a polyimide film containing a resist pattern or metal layer pattern formed on either or both sides using the resin etching solution.

Abstract: The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substrate, and the polymer bumps are at least partially hardened. The bond pads of the flip chip are then aligned with the bond pads of the substrate, and the at least partially hardened polymer bumps are pushed through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate. This process results in direct electrical and mechanical bonding of the polymer bumps between the chip and substrate bond pads, even though the adhesive film was applied on the substrate in a manner that covered the substrate bond pads. The polymer bumps displace the adhesive as they are pushed through it and expand laterally on the substrate bond pads.

Abstract: A flaw sensor for a metal pipe has an exciting coil for generating remote field eddy currents in the pipe. First and second groups of receiving coils are spaced from the exciting coil by respective distances along the axis of the pipe in a region of the generated remote field eddy currents. The first and second groups have respective pluralities of receiving coils with axes perpendicular to the pipe axis and disposed circumferentially about the pipe axis at predetermined angular increments wherein the receiving coils of the second group are staggered relative to the receiving coils of the first group. A third receiving coil is disposed coaxially with the pipe at still another distance from the exciting coil along the pipe axis but also in the region of the generated remote field eddy currents.

Abstract: An apparatus for producing a multiple layer conjugate fiber having a housing with a rotary cylinder plug and a stationary spinning plate. The housing is provided with at least two polymer feed inlets and the rotary cylinder plug contains at least two grooves along the outer periphery and passageways in communication with the grooves which open out at the lower surface of the rotary plug. The spinning plate contains a plurality of spinning orifices that are positioned and lined up with the passageways of the rotary cylinder plug. Means are provided for forming a limited space or multiple laminar chamber.