Abstract: A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized.

Abstract: There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin.

Abstract: An optical device includes a base of ring shape, and an optical chip and a transparent plate both attached to the base. The upper surface of the base is formed with a tapered recess inclined downwardly from its flat portion toward the opening. A gap between the tapered recess and the transparent plate is formed with an adhesive layer. Even if a gap between the transparent plate and the flat portion of the base is narrowed, the adhesive layer with a great thickness present between the tapered recess and the lower surface of the transparent plate maintains the mechanical adhesion strength between the base and the transparent plate. A raised ring and a recessed ring prevent adhesive from entering a positioning hole and the opening.

Abstract: An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. A boundary portion between the side surface of the recess and a top surface portion and a boundary portion between the side surface and bottom surface of the recess have a rounded shape.

Abstract: A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than ?15° C. and not more than ?5° C.

Abstract: An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. The recess has a two-level structure of a bottom recess and a portion located over the bottom recess. A stepped portion extends from an upper end of a first side surface of the bottom recess to a lower end of a second side surface of the bottom recess.

Abstract: An optical device includes: a base 10; an optical element chip 5 mounted on the base 10; an integrated circuit chip 50 bonded to the back surface of the optical element chip 5; and a transparent member (window member 6). An interconnect 12 is buried in the base 10. The interconnect 12 has an inner terminal portion 12a, an outer terminal portion 12b and an intermediate terminal portion 12c. Pad electrodes 5b on the optical element chip 5 are connected to the inner terminal portion 12a via bumps 8. Pad electrodes 50b on the integrated circuit chip 50 are connected to the intermediate terminal portion 12c via fine metal wires 52. The integrated circuit chip 50 equipped with peripheral circuits and other circuits and the optical element chip 5 are combined into one package.

Abstract: There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin.

Abstract: There is provided a connection structure between a Si electrode (Si member) and an Al wire (Al member). Between the Si electrode and the Al wire, a first part and second parts are present in interposed relation. Each of the first and second parts is in contact with the Si electrode and with the Al wire. In the first part, a Si oxide layer and an Al oxide layer are present. The Si oxide layer is in contact with the Si electrode. The Al oxide layer is interposed between the Si oxide layer and the Al wire. In some of the second parts, Al is present. In the others of the second parts, a Si portion and an Al portion are present.

Abstract: An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The other end of the wiring is an external terminal portion. A semiconductor chip incorporating peripheral circuits, etc., and a metal wire for connecting a pad electrode of the semiconductor chip and the wiring are buried in the base. The semiconductor chip incorporating peripheral circuits, etc., and the metal wire are buried together with the wiring in the base by molding, whereby the optical device and the semiconductor chip incorporating peripheral circuits, etc., are integrated into a single package.

Abstract: The electronic component includes: a fixed film; a vibration film facing the fixed film; a first electrode formed on the fixed film and having at least one first through hole in the center portion; and a second electrode formed on a portion of the vibration film corresponding to the first electrode and having at least one second through hole in the peripheral portion. An air gap communicating with the first and second through holes is formed between the fixed film and the vibration film and surrounded with a rib. At least one side hole is provided to extend in the rib surrounding the air gap from the air gap toward outside.

Abstract: An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The other end of the wiring is an external terminal portion. A semiconductor chip incorporating peripheral circuits, etc., and a metal wire for connecting a pad electrode of the semiconductor chip and the wiring are buried in the base. The semiconductor chip incorporating peripheral circuits, etc., and the metal wire are buried together with the wiring in the base by molding, whereby the optical device and the semiconductor chip incorporating peripheral circuits, etc., are integrated into a single package.

Abstract: A semiconductor chip is mounted on an upper surface of the heat sink plate that is provided with a plurality of heat releasing terminals on a lower surface of the heat releasing. A plurality of electric signal terminals are regularly disposed in a lattice-like manner around the heat sink plate. Lower end surfaces of the electric signal terminals and the heat releasing terminals are exposed from and sealed with a sealing resin. The heat sink plate is formed as an integrated body including a protruding portion that protrudes from a central portion of an upper surface and supports the semiconductor chip, a plurality of supporting portions that are positioned around a rear surface of the protruding portion so as to support the protruding portion and that are exposed at a rear surface of the sealing resin, the plurality of heat releasing terminals, and a thin-walled portion that is recessed from lower end surfaces of the supporting portions and the heat releasing terminals.

Abstract: An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film.

Abstract: An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

Abstract: A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.

Abstract: An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

Abstract: A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space of the housing and an external terminal portion exposed at an outer portion of the housing; an imaging element arranged on the base in the internal space of the housing; connecting members connecting electrodes of the imaging element to the internal terminal portions of the metal lead pieces; and a transparent plate fastened to an upper face of the ribs. The upper face of the ribs is provided with a lower step portion that is lowered along an external periphery, and the transparent plate is fastened to the upper face of the ribs by an adhesive filled at least into the lower step portion.

Abstract: A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between the semiconductor chip and the inner leads. Each of the inner leads includes a protruded portion provided on a surface thereof on an outer side relative to the periphery of the semiconductor chip. The protruded portion protrudes in a thickness direction and is provided with a step portion formed in its side portion. The group of electrodes of the semiconductor chip is connected to surfaces of inner portions of the inner leads located on an inner side relative to their protruded portions, through electroconductive bumps, respectively. The encapsulating resin encapsulates the semiconductor chip and the electroconductive bumps and is formed to expose surfaces of the protruded portions.

Abstract: A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space of the housing and an external terminal portion exposed at an outer portion of the housing; an imaging element arranged on the base in the internal space of the housing; connecting members connecting electrodes of the imaging element to the internal terminal portions of the metal lead pieces; and a transparent plate fastened to an upper face of the ribs. The upper face of the ribs is provided with a lower step portion that is lowered along an external periphery, and the transparent plate is fastened to the upper face of the ribs by an adhesive filled at least into the lower step portion.