Abstract: A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.

Abstract: An optical device includes a base of ring shape, and a light emitting/receiving element and a transparent plate both attached to the base. A side face of the opening of the base is formed to have a taper serving as a draft for a molding resin. A side surface of the transparent plate is formed to have a taper widened upwardly and corresponding to the draft. These side face and surface engage each other with an adhesive layer interposed therebetween. A hologram may be mounted instead of the transparent plate.

Abstract: A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

Abstract: In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin.

Abstract: A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members which connect electrodes of the imaging element and the wiring members. The ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. The package is configured without adhesive interposed between the ribs and the transparent sealing plate, thereby reducing the effect on incident light.

Abstract: An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

Abstract: A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element.

Abstract: An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.

Abstract: A semiconductor image sensor includes: a semiconductor imaging element including an imaging area, a peripheral circuit area, and an electrode area; cylindrical electrodes provided on electrode terminals so as to be electrically connected with an external device; and a transparent resin layer provided on the upper surface of the semiconductor imaging element. The upper surface of each cylindrical electrode and the upper surface of the transparent resin layer are substantially of the same height.

Abstract: An optical device includes an optical element, a transparent member arranged on the optical element, and a transparent resin adhesive for causing the transparent member to adhere and be fixed onto a circuit formation face of the optical element. The optical device includes a light detecting region having a plurality of micro lenses, a peripheral circuit region formed in the outer peripheral part of the light detecting region, and an electrode region formed at the outer peripheral part of the peripheral circuit region. A roughed region in a saw-toothed shape in section is formed in part of a face of the transparent member which adheres to the optical element, the part being overlapped with the outer peripheral part of the light detecting region as viewed in plan.

Abstract: An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

Abstract: A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the semiconductor chip; connecting members for connecting the electrodes of the semiconductor chip with the respective inner leads, an encapsulating resin for encapsulating surfaces of the semiconductor chip and the connecting members; and external electrodes exposed from the encapsulating resin. Each of the inner leads extends across the periphery of the semiconductor chip from an internal side to an external side of the periphery, and includes a protruded portion provided on a surface of the inner lead on an external side relative to the periphery of the semiconductor chip, the protruded portion being protruded in a thickness direction.

Abstract: An optic device includes a base, an optical chip mounted on the base, and a transparent plate. A cylinder mirror in which an imaging optical system is incorporated is fitted on the base of the optic device, wherein a pair of positioning pins are provided at the bottom of the cylinder mirror. First positioning holes for defining a mounting position of the cylinder mirror to the base and second positioning holes having a smaller diameter than that of the first positioning holes for defining a mounting position of the optical chip to the base are formed in the base of the optic device.

Abstract: A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element.

Abstract: An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as an external terminal. The connections are each devoid of its lower part so as to be thinner than the land portion, and are provided between the outer frame and the land portions, between the land portions associated with each other in each lead, and between the land portions and the die pad. Furthermore, the inventive leadframe is provided with no member that functions as a suspension lead for connecting the outer frame and the die pad to each other during plastic encapsulation.

Abstract: A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the semiconductor chip; connecting members for connecting the electrodes of the semiconductor chip with the respective inner leads, an encapsulating resin for encapsulating surfaces of the semiconductor chip and the connecting members; and external electrodes exposed from the encapsulating resin. Each of the inner leads extends across the periphery of the semiconductor chip from an internal side to an external side of the periphery, and includes a protruded portion provided on a surface of the inner lead on an external side relative to the periphery of the semiconductor chip, the protruded portion being protruded in a thickness direction.

Abstract: An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring substrate; a cavity portion having a generally rectangular opening formed in a central portion of the upper surface; and a light-transmitting member placement section formed on the upper surface surrounding the opening for receiving a light-transmitting member thereon, wherein the light-transmitting member is for transmitting therethrough light to be received by, or light emitted from, an optical element chip.

Abstract: A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between the semiconductor chip and the inner leads. Each of the inner leads includes a protruded portion provided on a surface thereof on an outer side relative to the periphery of the semiconductor chip. The protruded portion protrudes in a thickness direction and is provided with a step portion formed in its side portion. The group of electrodes of the semiconductor chip is connected to surfaces of inner portions of the inner leads located on an inner side relative to their protruded portions, through electroconductive bumps, respectively. The encapsulating resin encapsulates the semiconductor chip and the electroconductive bumps and is formed to expose surfaces of the protruded portions.

Abstract: An adhesive sheet is attached to a package substrate having a through hole so that an ultraviolet (UV) curable resin layer of the adhesive sheet faces the package substrate. Light is then radiated to the UV curable resin layer through the through hole in order to cure the exposed part of the UV curable resin layer. The cured part of the UV curable resin layer is removed together with a base film of the adhesive sheet. A glass plate is then attached to the UV curable resin remaining on the package substrate. Light is then radiated to bond the glass plate to the package substrate.

Abstract: An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover a second opening mouth thereof. Part of the conductive portion is exposed at the device substrate to form a terminal portion. The terminal portion is provided so as to be substantially flush with the surface of the device and serves as a mount portion to be directly mounted on the interconnect substrate.