Patents by Inventor Masanori Miyagi

Masanori Miyagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190317476
    Abstract: In order to realize stable quality control, provided is a quality control device (1) having an input device which receives data such as an operation condition of each device (21) to (26) in a production system (20) for producing a product; a calculation unit which assigns a value of the operation condition to a correlation formula calculated in advance and calculates a value derived from the correlation formula; and a determination unit which performs good or bad determination on a quality of a workpiece in each process, on the basis of a result calculated by the calculation unit. Further, when “bad” is determined as a result of the good or bad determination, the quality control device (1) calculates an appropriate value of the operation condition and sets the value to each device (21) to (26).
    Type: Application
    Filed: November 8, 2017
    Publication date: October 17, 2019
    Applicant: Hitachi Ltd.
    Inventors: Masanori MIYAGI, Yoshiyuki TAKAMORI, Seunghwan PARK
  • Patent number: 10392296
    Abstract: A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: August 27, 2019
    Assignee: HITACHI, LTD.
    Inventors: Motomune Kodama, Masanori Miyagi, Takuya Aoyagi, Takashi Naito
  • Patent number: 10346426
    Abstract: A system-replication control apparatus includes a processor that executes a process. The process includes: monitoring a use state of a resource in each of data centers; storing facility information indicating resources respectively held by the data centers and a use cost of the resources, and replication condition applied when each system is replicated in a resource of another data center; and selecting a resource composition that satisfies the replication condition and that costs lower than a currently-selected resource, as a replication destination of the system, from among available resources by referring to the use state of the resource obtained at the monitoring and the facility information.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: July 9, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Koyo Miyagi, Hideki Sakurai, Masanori Kimura, Kei Ohishi
  • Publication number: 20190076964
    Abstract: An object of the present invention is to, in high-energy beam welding, improve accuracy of determining a welding quality or accuracy of maintaining a certain welding quality by feedback, thereby improving efficiency of manufacturing a welded product, i.e., a yield. One aspect of the present invention acquires an image of a molten pool by a camera, acquires a width, a length, and an area of the molten pool by image processing, further acquires reflected light, plasma, and thermal radiation light by an optical sensor, and carries out a multiple regression analysis with use of the above-described signals and a signal having an interaction effect among them, thereby accurately predicting a weld penetration depth and thus accurately determining the welding quality.
    Type: Application
    Filed: March 9, 2017
    Publication date: March 14, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Masayuki ICHINOHE, Masanori MIYAGI, Tatsuro KUROKI, Xudong ZHANG, Ryo INOUE
  • Patent number: 10026923
    Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: July 17, 2018
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Motomune Kodama, Masanori Miyagi, Takuya Aoyagi, Yuichi Sawai, Tadashi Fujieda, Takeshi Tsukamoto, Hajime Murakami
  • Publication number: 20180193951
    Abstract: It is an object of the present invention to provide a laser welding method making it possible to secure the effective welding length when the laser beam is applied obliquely. In a laser welding method in which oscillation scanning is periodically effected with a laser beam 4 while moving an object of welding 9 to apply the laser beam to a surface of the object of welding 9 to perform welding, at least one of the output of the laser beam 4, a scanning speed, and a scanning track is controlled, whereby welding is effected with input heat amounts on both left and right sides with respect to the welding progressing direction being substantially different from each other.
    Type: Application
    Filed: June 10, 2016
    Publication date: July 12, 2018
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Masanori MIYAGI, Masayuki ICHINOHE, Xudong ZHANG, Tatsuro KUROKI
  • Publication number: 20180099356
    Abstract: A welding apparatus includes: a laser beam irradiation section that emits a laser beam; a spectroscopic apparatus that receives plasma emission from a molten pool formed by laser beam irradiation, and acquires optical spectral information; and an estimation section that estimates material components of a weld zone on the basis of the optical spectral information, and estimates a property of the weld zone on the basis of the material components.
    Type: Application
    Filed: March 9, 2016
    Publication date: April 12, 2018
    Applicant: HITACHI, LTD.
    Inventor: Masanori MIYAGI
  • Patent number: 9875154
    Abstract: Provided is a non-volatile semiconductor storage device which can be downsized with a simple circuit without impairing the function of an error correcting section, and a method of testing the non-volatile semiconductor storage device. An error correction circuit is configured to perform error detection and correction of merely the same number of bits as data bits, and a circuit for performing error detection and correction of check bits is omitted to downsize the circuit. A multiplexer for, in a testing state, replacing a part of the data bits read out from a storage element array with the check bits, and inputting the check bits to the error correction circuit is provided. Thus, error detection and correction of the check bits are performed to enable shipment inspection concerning the check bits as well.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: January 23, 2018
    Assignee: SII SEMICONDUCTOR CORPORATION
    Inventors: Masanori Miyagi, Taro Yamasaki
  • Patent number: 9824900
    Abstract: The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: November 21, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Motomune Kodama, Takashi Naito, Yuichi Sawai, Tadashi Fujieda, Takuya Aoyagi, Masanori Miyagi
  • Publication number: 20170301883
    Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 19, 2017
    Inventors: Takashi NAITO, Shinichi TACHIZONO, Kei YOSHIMURA, Yuji HASHIBA, Motomune KODAMA, Masanori MIYAGI, Takuya AOYAGI, Yuichi SAWAI, Tadashi FUJIEDA, Takeshi TSUKAMOTO, Hajime MURAKAMI
  • Patent number: 9789568
    Abstract: An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag2O in terms of oxides and the glass transition point is 180° C. or less.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: October 17, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Takuya Aoyagi, Motomune Kodama, Takashi Naito, Tadashi Fujieda, Yuichi Sawai, Masanori Miyagi, Haruo Akahoshi, Norihisa Iwasaki
  • Patent number: 9728341
    Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: August 8, 2017
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Motomune Kodama, Masanori Miyagi, Takuya Aoyagi, Yuichi Sawai, Tadashi Fujieda, Takeshi Tsukamoto, Hajime Murakami
  • Patent number: 9614178
    Abstract: In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10?7/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: April 4, 2017
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Takuya Aoyagi, Masanori Miyagi, Motomune Kodama, Yuichi Sawai, Tadashi Fujieda, Takeshi Tsukamoto, Hajime Murakami
  • Publication number: 20170017543
    Abstract: Provided is a non-volatile semiconductor storage device which can be downsized with a simple circuit without impairing the function of an error correcting section, and a method of testing the non-volatile semiconductor storage device. An error correction circuit is configured to perform error detection and correction of merely the same number of bits as data bits, and a circuit for performing error detection and correction of check bits is omitted to downsize the circuit. A multiplexer for, in a testing state, replacing a part of the data bits read out from a storage element array with the check bits, and inputting the check bits to the error correction circuit is provided. Thus, error detection and correction of the check bits are performed to enable shipment inspection concerning the check bits as well.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 19, 2017
    Inventors: Masanori MIYAGI, Taro YAMASAKI
  • Patent number: 9543265
    Abstract: Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: January 10, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Motomune Kodama, Takashi Naito, Tadashi Fujieda, Yuichi Sawai, Takuya Aoyagi, Masanori Miyagi
  • Publication number: 20160325377
    Abstract: An object of the present invention is to reduce spatter generation by stabilizing a keyhole in a laser welding method. A welded joint in which a plurality of workpieces are welded by irradiation with a laser beam, wherein the following formulae 1 to 3 are satisfied, b/a?0.6—(formula 1), h/d?1.0—(formula 2), and h/a<3.0—(formula 3), where a is a surface width of a weld bead formed across the plurality of workpieces, h is a maximum penetration depth of the weld bead, b is a penetration width of the weld bead at a position where a penetration depth of the weld bead is h/2, and d is the penetration depth at a center position of the weld bead.
    Type: Application
    Filed: January 17, 2014
    Publication date: November 10, 2016
    Inventors: Xudong ZHANG, Kinya AOTA, Masanori MIYAGI
  • Publication number: 20160257610
    Abstract: A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.
    Type: Application
    Filed: December 4, 2013
    Publication date: September 8, 2016
    Applicant: HITACHI, LTD.
    Inventors: Motomune KODAMA, Masanori MIYAGI, Takuya AOYAGI, Takashi NAITO
  • Patent number: 9373558
    Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: June 21, 2016
    Assignee: HITACHI, LTD.
    Inventors: Nobutake Tsuyuno, Hiroshi Hozoji, Takashi Naito, Motomune Kodama, Masanori Miyagi, Takuya Aoyagi
  • Publication number: 20160005671
    Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 7, 2016
    Applicant: HITACHI, LTD.
    Inventors: Nobutake TSUYUNO, Hiroshi HOZOJI, Takashi NAITO, Motomune KODAMA, Masanori MIYAGI, Takuya AOYAGI
  • Publication number: 20150301889
    Abstract: Provided is a non-volatile semiconductor storage device which can be downsized with a simple circuit without impairing the function of an error correcting section, and a method of testing the non-volatile semiconductor storage device. An error correction circuit is configured to perform error detection and correction of merely the same number of bits as data bits, and a circuit for performing error detection and correction of check bits is omitted to downsize the circuit. A multiplexer for, in a testing state, replacing a part of the data bits read out from a storage element array with the check bits, and inputting the check bits to the error correction circuit is provided. Thus, error detection and correction of the check bits are performed to enable shipment inspection concerning the check bits as well.
    Type: Application
    Filed: July 1, 2015
    Publication date: October 22, 2015
    Inventors: Masanori MIYAGI, Taro YAMASAKI