Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.

Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.

Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.

Abstract: A rubber stopper includes: a main body; and a cylindrical container insertion portion extending downward from a lower surface of the main body and configured to fit into a neck portion of a drug container. The main body includes a peripheral edge portion that is disposed on a radially outer side of the container insertion portion and that is configured to abut on an upper surface of an opening portion of the drug container when attached to the drug container. The container insertion portion includes: an outer surface portion that is configured to annularly contact an inner surface of the neck portion, an upper inner surface portion that forms a columnar gap portion, and at least one inclined surface extending obliquely downward toward the outer surface portion of the container insertion portion.

Abstract: This deposition apparatus includes a deposition chamber which includes a deposition region for forming a coating film on an object to be coated, a conveying device which conveys a conveyed carrier supporting the object, and a bias power source which applies a bias voltage to the object via the conveyed carrier, in which a plurality of rods which support the object and rotate around axes are disposed in the conveyed carrier along a carrier conveying direction in an upright posture, a protrusion member protruding to the outside in a radial direction is provided on an outer peripheral surface of the rod, an interference member which catches the protrusion member of the conveyed carrier moving in the deposition chamber and rotates the rod around the axis is provided on a wall surface of the deposition chamber, and the interference member and the bias power source are electrically connected to each other.

Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.

Abstract: A indwelling needle includes an outer needle, an outer needle hub with a flow path communicating with the inside of the outer needle and configured to connect a connector to the flow path, and a valve mechanism which opens and closes the flow path. The valve mechanism includes a valve element in the middle of the flow path having an openable/closable opening/closing section and an operation member having a side hole and configured to open and close the opening/closing section. The valve mechanism is positionable in a state in which the operation member penetrates through the opening/closing section to protrude therefrom and the side hole is located closer to the front end side than the opening/closing section. When infusion liquid is supplied in this state, the liquid flows to the flow path through the side hole and the dead space within the flow path is filled with the infusion liquid.

Abstract: A method of inspection and inspection apparatus able to use a captured image to more precisely inspect the state of film, defect parts, etc. at a surface of an object under inspection are provided. A method of inspection and inspection apparatus illuminating a surface of an object under inspection 10 by white light from an illumination unit LO while scanning the surface of the object under inspection 10 by an image capturing unit 100 to acquire a captured image and using the captured image to inspect a state of the surface of the object under inspection 10, which changes a state of polarization of light LR striking the image capturing unit 100 from an illuminated location of the object under inspection 10 and obtains a plurality of captured images based on light of different polarization states LR striking the image capturing unit 100.

Abstract: A indwelling needle includes an outer needle, an outer needle hub with a flow path communicating with the inside of the outer needle and configured to connect a connector to the flow path, and a valve mechanism which opens and closes the flow path. The valve mechanism includes a valve element in the middle of the flow path having an openable/closable opening/closing section and an operation member having a side hole and configured to open and close the opening/closing section. The valve mechanism is positionable in a state in which the operation member penetrates through the opening/closing section to protrude therefrom and the side hole is located closer to the front end side than the opening/closing section. When infusion liquid is supplied in this state, the liquid flows to the flow path through the side hole and the dead space within the flow path is filled with the infusion liquid.

Abstract: A semiconductor wafer inspection apparatus for inspecting an outer circumference edge part of a semiconductor wafer. The apparatus has a camera lens arranged facing an outer circumference edge part of a semiconductor wafer, an imaging surface arranged facing an outer circumference end face of a semiconductor wafer via the camera lens, a mirror forming an image of a first outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a mirror forming an image of a second outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a correction lens forming an image of an outer circumference end face of the semiconductor wafer on the imaging surface via the center part of the camera lens, and an illumination light guide lamp part illuminating the surfaces.

Abstract: A method of inspection and inspection apparatus able to use a captured image to more precisely inspect the state of film, defect parts, etc. at a surface of an object under inspection are provided. A method of inspection and inspection apparatus illuminating a surface of an object under inspection 10 by white light from an illumination unit LO while scanning the surface of the object under inspection 10 by an image capturing unit 100 to acquire a captured image and using the captured image to inspect a state of the surface of the object under inspection 10, which changes a state of polarization of light LR striking the image capturing unit 100 from an illuminated location of the object under inspection 10 and obtains a plurality of captured images based on light of different polarization states LR striking the image capturing unit 100.

Abstract: [Problem] To provide a surface inspection apparatus able to suitably inspect the outer circumference edge part of a semiconductor wafer or other plate-shaped member.

Abstract: As an assembly 50 of articles of management targets, a serial number that becomes a consecutive number is recorded in each of RFID tags 1, 2, . . . , 12 attended to cardboard boxes 31, 32, . . . , 42 in which articles are stored and a flag, by which the total number of articles that becomes a management target of articles can be calculated, is recorded in at least one of RFID tags. For example, the serial numbers are consecutive numbers starting from one, and the total number of articles is recorded in the flags of all of the RFID tags, or an end flag indicating the last is recorded in the flag of the last RFID tag. The serial numbers are consecutive numbers starting an arbitrary number, a start flag indicating the first is recorded in the flag of the first RFID tag and an end flag indicating the last is recorded in the flag of the last RFID tag, or the total number is recorded in the flag of the last RFID tag.

Abstract: The present invention provides a method for stabilizing an oral solid formulation containing a benzimidazole-based compound or a physiologically acceptable salt thereof. That is, it provides a method for stabilizing a benzimidazole-based compound or a physiologically acceptable salt thereof, comprising incorporating 1) a crospovidone or a crospovidone and 2) sodium hydroxide and/or potassium hydroxide to a benzimidazole-based compound or a physiologically acceptable salt thereof.

Abstract: The present invention provides a chemically stable pharmaceutical preparation of a benzimidazole type compound. That is, the present invention relates to a composition comprising at least one substance selected from sodium carbonate, potassium carbonate, sodium hydroxide, potassium hydroxide, aminoalkyl methaacrylate copolymer E, arginine aspartate, hydroxypropyl cellulose and crospovidone incorporated into a benzimidazole type compound or an alkali metal salt thereof.

Abstract: The present invention provides a chemically stable pharmaceutical preparation of a benzimidazole type compound. That is, the present invention relates to a composition comprising at least one substance selected from sodium carbonate, potassium carbonate, sodium hydroxide, potassium hydroxide, aminoalkyl methaacrylate copolymer E, arginine aspartate, hydroxypropyl cellulose and crospovidone incorporated into a benzimidazole type compound or an alkali metal salt thereof.

Abstract: A transmitting station transmits FM radio waves which carry program information, such as news, and time information representing the current time. Each of receivers generates the first time information in accordance with an internal clock, corrects the first time information in accordance with the time information transmitted from the transmitting station, and generates the second time information. Each receiver progresses a game by changing the image displayed on the display, in accordance with a predetermined element, which is obtained from the program information transmitted from the transmitting station, and the first or second time information. Therefore, the progress of the game differs depending on the reception of the second information and the time information, and accordingly the progress of the game is unexpectable.

Abstract: Spectral image signals simultaneously provided by two CCD television cameras for an R-image and an IR-image are selected by a visual controller and are sent sequentially to a sending parabolic antenna where two spectral radiometers provided with photosensors measure the amounts of radiation energy of light rays of wavelengths around a wavelength corresponding to the R-image and light rays of wavelengths around a wavelength corresponding to the IR-image to obtain spectral radiation data representing the amounts of spectral radiation energy, respectively.

Abstract: To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.

Abstract: A semiconductor device employing a new isolation process is disclosed, wherein an isolation area is a region in which a burying material is buried in a deep groove formed in a semiconductor body with a substantially constant width by anisotropic dry etching, semiconductor elements are formed in selected ones of semiconductor regions isolated by the isolation area, and others of the semiconductor regions, with no semiconductor element formed therein, have their whole surface covered with a thick oxide film which is produced by the local oxidation of the semiconductor body.The new isolation process is well-suited for a bipolar type semiconductor device, wherein the deep groove is formed so as to reach a semiconductor substrate through an N.sup.+ -type buried layer, and a thick oxide film formed simultaneously with the aforementioned thick oxide film isolates the base region and collector contact region of a bipolar transistor.