Abstract: A system of bonded substrates may include a first substrate, a second substrate, and a bonding layer. The first substrate may include a bonding surface, wherein a geometry of the bonding surface of the first substrate includes a plurality of microchannels. The second substrate may include a complementary bonding surface. The bonding layer may be positioned between the first substrate and the second substrate, wherein the bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate. The bonding layer may include a metal.

Abstract: Apparatuses for coupling a semiconductor device to a cooling system, methods of coupling a semiconductor device to a cooling system, and systems incorporating the apparatuses are disclosed. An apparatus includes a first frame member coupled to the cooling system, a second frame member coupled via one or more fasteners to the first frame member, and a spring assembly disposed between the first frame member and the second frame member. The semiconductor device is disposed between the spring assembly and the second frame member.

Abstract: In one embodiment, a system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer positioned between the first substrate and the second substrate. The composite boding layer may include an interior bond region, an exterior bond region, and a metal matrix. The material of the interior bond region may have a greater elastic modulus than the material of the exterior bond region. A portion of the metal matrix may be in the interior bond region and a portion of the metal matrix may be in the exterior bond region. The composite bonding layer may also include a plurality of soft material members positioned in the portion of the metal matrix in the exterior bond region, or a plurality of hard material members positioned in the portion of the metal matrix in the interior bond region, or both.

Abstract: Systems and methods of simulating a physical bond layer comprising a composite material and predicting one or more properties of the composite material are disclosed. A method includes obtaining one or more X-ray images of a bulk physical sample of a composite material, the one or more X-ray images including one or more visual identifiers that correspond to one or more materials present in the bulk physical sample, and generating a three dimensional image of the bulk physical sample from the one or more X-ray images. The three dimensional image includes one or more labels indicating the presence and location of the one or more materials. The method further includes creating a meshed three dimensional microstructure-based model from the three dimensional image and simulating a physical bond layer with the meshed three dimensional microstructure-based model. The meshed three dimensional microstructure-based model incorporates data obtained from the one or more labels.

Abstract: A first substrate may be bonded to a second substrate in a method that may include providing the first substrate, providing a second substrate, providing a bonding layer precursor, positioning the bonding layer precursor between the first substrate and the second substrate, and bonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer. The first substrate may include a bonding surface, and a geometry of the bonding surface of the first substrate may include a plurality of microchannels. The second substrate may include a complementary bonding surface and the bonding layer precursor may include a metal. The bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate.

Abstract: A method of bonding a first substrate to a second substrate includes disposing a first high melting point metal layer onto a first substrate, disposing a first low melting point metal layer onto the first high melting point metal layer, disposing a second high melting point metal layer onto a second substrate, and disposing a second low melting point metal layer onto the second high melting point metal layer. The method further includes applying precursor metal particles onto the first and/or second low melting point metal layers, positioning the first and second low melting point metal layers such that the precursor metal particles contact both the first and second low melting point metal layers, and bonding the first substrate to the second substrate by heating the precursor metal particles and each metal layer to form an intermetallic alloy bonding layer between the first and second substrates.

Abstract: A seat reclining device includes: a reclining unit that includes a fixing member fixed to a seat cushion side and a rotating member fixed to the seat cushion side and supported by the fixing member to rotate freely, and that switches freely between a locked state and an unlocked state; a transmission lever supported by the fixing member to rotate freely on the same center as the fixing member; a release operation lever supported on the seat cushion side to rotate freely between lock operation and unlocking operation positions; a link which includes a protruding portion, in which each end portion of the link is supported by one of the transmission and release operation levers to rotate freely, and which switches the reclining unit from the locked state to the unlocked state; and a holding plate that includes an unlock holding portion.

Abstract: In one embodiment, a system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer positioned between the first substrate and the second substrate. The composite boding layer may include an interior bond region, an exterior bond region, and a metal matrix. The material of the interior bond region may have a greater elastic modulus than the material of the exterior bond region. A portion of the metal matrix may be in the interior bond region and a portion of the metal matrix may be in the exterior bond region. The composite bonding layer may also include a plurality of soft material members positioned in the portion of the metal matrix in the exterior bond region, or a plurality of hard material members positioned in the portion of the metal matrix in the interior bond region, or both.

Abstract: According to embodiments described herein, the properties of a transient liquid phase bond may be evaluated by a method that includes forming a bulk material sample. The bulk material sample may include the material of the transient liquid phase bond. Forming the bulk material sample may include providing a bonding material precursor and forming the bulk material sample by transient liquid phase bonding the bonding material precursor by spark plasma sintering the bonding material precursor. The bonding material precursor may include metal particles of a first metal composition and metal particles of a second metal composition. The method may further include testing the bulk material sample for one or more properties.

Abstract: A method for high temperature bonding of substrates may include providing a top substrate and a bottom substrate, and positioning an insert between the substrates to form a assembly. The insert may be shaped to hold at least an amount of Sn having a low melting temperature and a gap shaped to hold at least a plurality of metal particles having a high melting temperature greater than the low melting temperature. The assembly may be heated to below the low melting temperature and held for a first period of time. The assembly may further be heated to approximately the low melting temperature and held for a period of time at a temperature equal to or greater than the low melting temperature such that the amount of Sn and the amount of metal particles form one or more intermetallic bonds. The assembly may be cooled to create a bonded assembly.

Abstract: A first substrate may be bonded to a second substrate in a method that may include providing the first substrate, providing a second substrate, providing a bonding layer precursor, positioning the bonding layer precursor between the first substrate and the second substrate, and bonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer. The first substrate may include a bonding surface, and a geometry of the bonding surface of the first substrate may include a plurality of microchannels. The second substrate may include a complementary bonding surface and the bonding layer precursor may include a metal. The bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate.

Abstract: An electrical connector is disclosed having a housing and a female terminal. The housing has an assembly receiving space. The female terminal is positioned in the assembly receiving space and has a first female terminal, a second female terminal, and an elastic connecting spring. The first female terminal has a first contact receiving space. The second female terminal has a second contact receiving space and is independently displaceable relative to the first female terminal along a longitudinal axis. The elastic connecting spring connects the first female terminal to the second female terminal.

Abstract: A method for high temperature bonding of substrates may include providing first and second substrates and forming at least one trace onto one or more adjacent surfaces of the substrates. The trace may include at least a first configuration of a material having a high melting temperature. The material may include at least one or more chemical elements selected from a group consisting of nickel, silver, aluminum, and copper. The method may further include depositing tin on a top surface of the trace and bonding the substrates together to create a bond layer using a high temperature bonding process. The top surface of the trace may be disposable between the substrates. The trace may be incorporated into the bond layer that is dispersed between aligned and adjacent surfaces of the substrates. The first configuration may form one or more intermetallic bonds in the bond layer.

Abstract: An electrical connector is disclosed having a terminal housing and a female type terminal positioned in the terminal housing. The terminal housing has a first terminal housing, and a second terminal housing positioned independent from the first terminal housing. The female type terminal has a first female terminal, second female terminal, and a coupling member. The first female terminal is positioned in the first terminal housing and is electrically connected to a first male terminal. The second female terminal is positioned in the second terminal housing and is electrically connected to a second male terminal. The coupling member connects the first female terminal to the second female terminal.

Abstract: A guide device that guides a component terminal includes: a guide portion configured to guide the component terminal to a specified position; and a separating mechanism portion configured to move the guide portion away from the component terminal after the guidance of the component terminal, as compared with before the guidance of the above component terminal.

Abstract: A system management device (1) includes: a data request transmission unit (5) which successively transmits data request signals (C5) to a management object system (50); a feature data extraction unit (6) which extracts feature data (D3) from data (D50) acquired by a data acquisition unit (3); an error information extraction unit (7) which extracts error information from the data; a feature data storage unit (8) which stores feature data at a time of occurrence of an error as error-occurrence-time feature data (D6) according to the error information; and a system control unit (9) which, each time the data is acquired, compares a status value included in the feature data (D3) in the acquired data with a status value included in the error-occurrence-time feature data (D6) already stored in the feature data storage unit (8) and performs control of the management object system (50) according to a result of the comparison.

Abstract: A system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer. The first substrate may include a bonding surface and the second substrate may include a complementary bonding surface. The composite bonding layer may be positioned between the first substrate and the second substrate. The composite boding layer may include a metal matrix and a plurality of stress-reducing additives disposed in the metal matrix. Each stress-reducing additive may include a three-dimensional shape The stress-reducing additives may include a ratio of length:height of at least about 2:1. An elastic modulus of a material of the stress-reducing additive may be less than an elastic modulus of the material of the metal matrix.

Abstract: According to one embodiment disclosed herein, a first substrate may be bonded to a second substrate by a method which includes providing the first substrate which includes a bonding surface, providing the second substrate which includes a complementary bonding surface, providing a bonding layer precursor which includes metal particles of a first metal composition and metal particles of a second metal composition, and forming a transient liquid phase bonding layer by spark plasma sintering the bonding layer precursor. The bonding layer precursor may be positioned between the first substrate and the second substrate, and the bonding layer may be in contact with the bonding surface of the first substrate and the complementary bonding surface of the second substrate.

Abstract: A data storage unit (111) which stores attribute management information for managing attribute information of a content file included in data recorded on a recording medium which has been used previously and medium management information including partial medium identification information designated in each predetermined part by at least one of a content file placed immediately under a layer formed in the data recorded on the recording medium and a layer, a medium identification information comparison unit (107) which compares partial medium identification information generated from data of the recording medium which is going to be used and the partial medium identification included in the medium management information, and a tag management information update unit (113) which updates the attribute information partially when a result of the comparison indicates disagreement are included.

Abstract: An electrical connector is disclosed having a terminal housing, a female terminal, and a holding protrusion. The female terminal is positioned in the terminal housing and has a terminal body into which a complementary male terminal may be inserted and extracted. The holding protrusion projects from the terminal body in a direction orthogonal to inserting and extracting directions, and is press-fitted in the terminal receiving terminal housing.