Abstract: A design support system includes memory, a receiving unit, and an associating unit. The memory stores information on design element classification that classifies a design element included in a product, and information on design requirement classification that classifies a design requirement required for the product. The receiving unit receives technical information regarding a design trouble. The associating unit refers to technical information regarding a design trouble, received by the receiving unit, and associates a classification item in the design requirement classification to which the design trouble belongs and a classification item in the design element classification to which a design element causing the design trouble belongs with each other, along with information on a phenomenon indicating a failure status of the design element included in the technical information.

Abstract: A design support system includes memory, a receiving unit, and an associating unit. The memory stores information on design element classification that classifies a design element included in a product, and information on design requirement classification that classifies a design requirement required for the product. The receiving unit receives technical information regarding a design trouble. The associating unit refers to technical information regarding a design trouble, received by the receiving unit, and associates a classification item in the design requirement classification to which the design trouble belongs and a classification item in the design element classification to which a design element causing the design trouble belongs with each other, along with information on a phenomenon indicating a failure status of the design element included in the technical information.

Abstract: A design support system includes a storage unit, an accepting unit, a selecting unit, and an associating unit. The storage unit stores information regarding design element classifications into which design elements constituting a product are classified and design requirement classifications into which design requirements required for the product are classified. The accepting unit accepts technical information regarding a trouble due to design. The selecting unit refers to the technical information regarding the trouble, selects a classification item to which the trouble belongs from among the design requirement classifications, and selects a classification item to which a design element that has caused the trouble belongs from among the design element classifications.

Abstract: A design support system includes a storage unit, an accepting unit, a selecting unit, and an associating unit. The storage unit stores information regarding design element classifications into which design elements constituting a product are classified and design requirement classifications into which design requirements required for the product are classified. The accepting unit accepts technical information regarding a trouble due to design. The selecting unit refers to the technical information regarding the trouble, selects a classification item to which the trouble belongs from among the design requirement classifications, and selects a classification item to which a design element that has caused the trouble belongs from among the design element classifications.

Abstract: A process for producing a polyimide-metal laminated body includes forming a metal conductive layer on a polyimide film having a ceramic-modified or pseudoceramic-modified surface with a wet plating process which includes forming at least a ground treatment layer by electroless plating, conducting electroless metal plating and conducting electrolytic copper plating.

Abstract: A polyimide-metal laminated body obtained by forming a metal conductive layer on a polyimide film, which has been ceramic-modified or pseudoceramic-modified on at least the surface, by a wet plating process capable of accomplishing metal plating on ceramic. A polyimide-metal laminated body and polyimide circuit board having satisfactory cohesion in wet plating steps, maintain practical cohesion even after high temperature aging treatment, and exhibiting satisfactory electrical insulating reliability, can be obtained.

Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken. Constitution: A vertical probe card having vertical probes 100, being used in measurement of electric characteristics of an LSI chip 610 to be measured, comprising a main substrate 300 forming conductive patterns 310, a plurality of probes 100 drooping vertically from the main substrate 300, and a probe support 200 provided at the back side of the main substrate 300 for supporting the probes 100, in which the probe support 200 is disposed parallel to the main substrate 300, and has an upper guide plate 210 and a lower guide plate 220 for supporting the probes 100 by passing the through-holes 211,221 opened in each, and the lower guide plate 220 is composed of three substrates 220A, 220B, 220C laminated separably.

Abstract: A multilayer wiring board is manufactured wherein an intermediate wiring layer having a signal pattern is formed on an upper side of a lower shielding layer via an insulating layer, and an upper shielding layer is then formed on an upper side of the intermediate wiring layer via an insulating layer, by a method including forming the lower shielding layer having a lower shielding portion under a portion in which the signal pattern is to be formed, forming a lower metal wall erected from the lower shielding portion under both sides of the portion in which the signal pattern is to be formed, and forming the insulating layer for exposing the lower metal wall and covering the lower shielding layer.

Abstract: To enable a probe to be applied to a probe card for use in inspecting the IC chip having a fine pitch such as 100 &mgr;m, for example, as a pitch size between the electrodes by improving the probe for the probe card having a bare wire structure made of palladium alloy and the probe for the probe card having a bare wire structure made of beryllium copper alloy. There is provided a probe for the probe card characterized in that the same is comprised of a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy. In addition, there is provided a probe for the probe card having a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy and further the wire drawing with the wire drawing dies is applied to it.

Abstract: When continuously outputted pulses from a first pulse to an (N+1)th (where N is an integer) are received, a pulse specifying circuit specifies a number N of a pulse whose properties are to be measured. Further, a gate generating circuit generates a gate signal which is at high level during a period from the end of the (N−1)th pulse to the start of the Nth pulse and which is at low level during a period from the end of the Nth pulse to the start of the (N+1)th pulse. A semiconductor evaluating apparatus measures the width of the Nth pulse based on the generated gate signal.

Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken.

Abstract: To remove foreign matter without deforming the end of a probe, and prevent new foreign matter from adhering to the end of a probe.

Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.

Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.

Abstract: A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.

Abstract: An image forming apparatus includes: a latent image carrier 1 to form a latent image in accordance with an image signal; a developing unit 14 to develop the latent image with a predetermined toner; an intermediate transfer body 2 coming into contact with the latent image carrier 1 so that the intermediate transfer body can be rotated together with the latent image carrier, the intermediate transfer body being capable of transferring a toner image formed on the latent image carrier 1; a transfer roller 4 to simultaneously transfer the toner image held on the intermediate transfer body 2 onto a recording medium 11; and a transfer roller 3 arranged in the downstream close to a contact region (nip portion) of the latent image carrier 1 with the intermediate transfer body 2, the transfer roller 3 being arranged on a side of the intermediate transfer body 2 reverse to a toner image holding surface so as to transfer the toner image on the intermediate transfer body 2 by forming a transfer electric field between the

Abstract: An image forming apparatus of such a type as is provided with a photosensitive member having a semi-conductive intermediate transfer member disposed opposite the photosensitive member. A charger electrically charges the photosensitive member. An exposure device forms an electrostatic latent image on the photosensitive member and developer visualizes the electrostatic latent image using toner identical in polarity to the photosensitive member. A primary transfer device transfers the toner image to the intermediate transfer member by applying a bias opposite in polarity to the photosensitive member, and a secondary transfer apparatus transfers the toner image on the intermediate transfer member to a transfer material. An optical charge-eliminator optically removes the electrical charge from the photosensitive member.

Abstract: Probe card is a part which is incorporated into a probing equipment to test finished IC chips, This card is customarily mounted with a plurality of probes, very fine needle and generally bent, and each probe is disposed so that its front end may pinpoint to a pad of an IC chip of interest. In performing the probing test, a most important condition is to keep the probe contact pressure on the pad of an IC chip at a constant position during measurement time, but in performing such at a high temperature, heated IC chips radiate the probe card and thereby positional deviation of the contact point is caused by heat expansion of the probe card and hence the contact pressure may change.

Abstract: A locking system which is operated with card keys and the locking system is generally provided for a door lock of a guest room in a hotel. The locking system requires no time piece, and a card key including an IC memory can be used many times without illegal use of the key such as forgery or alteration of the key or illegal use by taking the key back intentionally. In the locking system, first and second identification codes have been set in the IC memory. A lock permits an unlocking operation when the first identification code read from the IC memory is coincident with a third identification code preset in the lock. In case of the first and third identification codes different from each other, when the second identification code has been stored in the IC memory, the first and third identification codes are replaced by the second identification code so that the first and third identification codes coincide with each other, and the second identification code is erased from the IC memory.

Abstract: The invention provides a novel antibacterial compound and a process for producing it. Futhermore, the invention provides a novel antibacterial polymer composite comprising a polymer and the antimicrobial compositon.