Abstract: An optical structure includes a substrate having a cavity on a first surface of the substrate, an optical component on the substrate, and an adhesive infiltrating into a gap between the substrate and the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface being opposed to the substrate, and the recess covers an opening of the cavity of the substrate.

Abstract: An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.

Abstract: An optical structure includes a substrate having a cavity on a first surface of the substrate, an optical component on the substrate, and an adhesive infiltrating into a gap between the substrate and the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface being opposed to the substrate, and the recess covers an opening of the cavity of the substrate.

Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.

Abstract: A micro-mirror array for optical coupling in a waveguide array including, a transparent body having a slanted portion, a sidewall portion, and a bottom portion, the sidewall portion and the bottom portion each respectively facing the slanted portion, and wherein a complementary shape of a conventional form off-axis mirror is arranged on the slanted portion, and a reflective coating on at least a portion of the complementary shape.

Abstract: An optical module includes: at least one optical waveguide provided on a surface of a substrate; a plurality of grooves provided in the optical waveguide on the surface of the substrate and having both a surface orthogonal to the surface of the substrate and an inclined surface; multiple pairs of light-emitting and light-receiving elements aligned with the plurality of grooves in the optical waveguide and provided so as to correspond to light of different wavelengths on the optical waveguide; and a plurality of light-selecting filters each provided on an inclined surface of the plurality of grooves in the optical waveguide and reflecting light of the wavelength corresponding to the light-emitting element in the respective pair of light-emitting and light-receiving elements towards the optical waveguide, and selectively reflecting light of the corresponding wavelength from the light propagating through the optical waveguide towards the corresponding pair of light-emitting and light-receiving elements.

Abstract: An optical interconnect structure and method are provided. The optical interconnect structure includes a plate on which a mirror is formed. The optical interconnect structure further includes a waveguide structure comprising a waveguide core and an opening. The plate is mounted on the waveguide structure such the mirror is inserted in the opening for light coupling (i) from the waveguide core and to an optical element positioned on the plate and (ii) to the waveguide core from the optical element positioned on the plate.

Abstract: Embodiments of the present invention provide optical modules which input and output wavelength multiplexed optical signals to and from an optical waveguide, and a manufacturing method thereof. In one embodiment, an optical module comprises light emitting and light receiving element pairs that are positioned on grooves of one or more optical waveguides, where each light emitting and light receiving element pair corresponds to a different wavelength of light. Each light emitting and light receiving element pair includes an optical pin comprising an inclined surface and a light selecting filter that are configured to reflect light of a corresponding wavelength from an optical waveguide to the light receiving element, and from the light emitting element to the optical waveguide.

Abstract: A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).

Abstract: An optical module includes: at least one optical waveguide provided on a surface of a substrate; a plurality of grooves provided in the optical waveguide on the surface of the substrate and having both a surface orthogonal to the surface of the substrate and an inclined surface; multiple pairs of light-emitting and light-receiving elements aligned with the plurality of grooves in the optical waveguide and provided so as to correspond to light of different wavelengths on the optical waveguide; and a plurality of light-selecting filters each provided on an inclined surface of the plurality of grooves in the optical waveguide and reflecting light of the wavelength corresponding to the light-emitting element in the respective pair of light-emitting and light-receiving elements towards the optical waveguide, and selectively reflecting light of the corresponding wavelength from the light propagating through the optical waveguide towards the corresponding pair of light-emitting and light-receiving elements.

Abstract: A method for fabricating an optical multi-chip module (MCM) includes temporarily curing an underfill material on a chip including an optical device to prevent flow of the underfill material. The chip is flip-chip mounted on a waveguide module having a mirror for directing light to or from the chip, wherein the underfill material is disposed between the chip and the waveguide module. The underfill material is cured to adhere the chip to the waveguide module.

Abstract: An optical module includes: at least one optical waveguide provided on a surface of a substrate; a plurality of grooves provided in the optical waveguide on the surface of the substrate and having both a surface orthogonal to the surface of the substrate and an inclined surface; multiple pairs of light-emitting and light-receiving elements aligned with the plurality of grooves in the optical waveguide and provided so as to correspond to light of different wavelengths on the optical waveguide; and a plurality of light-selecting filters each provided on an inclined surface of the plurality of grooves in the optical waveguide and reflecting light of the wavelength corresponding to the light-emitting element in the respective pair of light-emitting and light-receiving elements towards the optical waveguide, and selectively reflecting light of the corresponding wavelength from the light propagating through the optical waveguide towards the corresponding pair of light-emitting and light-receiving elements.

Abstract: A method for fabricating an optical multi-chip module (MCM) includes temporarily curing an underfill material on a chip including an optical device to prevent flow of the underfill material. The chip is flip-chip mounted on a waveguide module having a minor for directing light to or from the chip, wherein the underfill material is disposed between the chip and the waveguide module. The underfill material is cured to adhere the chip to the waveguide module.

Abstract: A method for fabricating an optical multi-chip module (MCM) includes temporarily curing an underfill material on a chip including an optical device to prevent flow of the underfill material. The chip is flip-chip mounted on a waveguide module having a mirror for directing light to or from the chip, wherein the underfill material is disposed between the chip and the waveguide module. The underfill material is cured to adhere the chip to the waveguide module.

Abstract: A structure includes a combination of a stub fabricated on a polymer and a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with a silicon waveguide (SiWG) array fabricated on the silicon chip. The stub fabricated on the polymer is patterned according to a nano-imprint process along with the PWG array in a direction in which the PWG array is fabricated. The groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.

Abstract: Optical systems for wavelength division multiplexing and wavelength division demultiplexing with a multi-core fiber, and methods of their fabrication, are disclosed. The systems include a coupling mirror with a plurality of angled surfaces that are configured to direct light to or from different cores of a multi-core fiber. In addition, the multiplexer systems can further include laser chips for generating light, while the demultiplexer systems can include photodiode arrays for detecting light from the multi-core fiber. The systems can also include a guiding structure comprising filters/micro-mirrors to direct light from the lasers or to the photodiodes.

Abstract: A structure includes a combination of a stub fabricated on a polymer and a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with a silicon waveguide (SiWG) array fabricated on the silicon chip. The stub fabricated on the polymer is patterned according to a nano-imprint process along with the PWG array in a direction in which the PWG array is fabricated. The groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.

Abstract: A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).

Abstract: Embodiments of the present invention provide optical modules which input and output wavelength multiplexed optical signals to and from an optical waveguide, and a manufacturing method thereof. In one embodiment, an optical module comprises light emitting and light receiving element pairs that are positioned on grooves of one or more optical waveguides, where each light emitting and light receiving element pair corresponds to a different wavelength of light. Each light emitting and light receiving element pair includes an optical pin comprising an inclined surface and a light selecting filter that are configured to reflect light of a corresponding wavelength from an optical waveguide to the light receiving element, and from the light emitting element to the optical waveguide.

Abstract: An optical module includes: at least one optical waveguide provided on a surface of a substrate; a plurality of grooves provided in the optical waveguide on the surface of the substrate and having both a surface orthogonal to the surface of the substrate and an inclined surface; multiple pairs of light-emitting and light-receiving elements aligned with the plurality of grooves in the optical waveguide and provided so as to correspond to light of different wavelengths on the optical waveguide; and a plurality of light-selecting filters each provided on an inclined surface of the plurality of grooves in the optical waveguide and reflecting light of the wavelength corresponding to the light-emitting element in the respective pair of light-emitting and light-receiving elements towards the optical waveguide, and selectively reflecting light of the corresponding wavelength from the light propagating through the optical waveguide towards the corresponding pair of light-emitting and light-receiving elements.