Patents by Inventor Masao Tokunari

Masao Tokunari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9389366
    Abstract: Embodiments of the present invention provide optical modules which input and output wavelength multiplexed optical signals to and from an optical waveguide, and a manufacturing method thereof. In one embodiment, an optical module comprises light emitting and light receiving element pairs that are positioned on grooves of one or more optical waveguides, where each light emitting and light receiving element pair corresponds to a different wavelength of light. Each light emitting and light receiving element pair includes an optical pin comprising an inclined surface and a light selecting filter that are configured to reflect light of a corresponding wavelength from an optical waveguide to the light receiving element, and from the light emitting element to the optical waveguide.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: July 12, 2016
    Assignee: International Business Machines Corporation
    Inventors: Shigeru Nakagawa, Yoichi Taira, Masao Tokunari
  • Patent number: 9372305
    Abstract: A method for fabricating, and a structure embodying, a single-mode polymer wave guide array aligned with a polymer waveguide array through adiabatic coupling. The present invention provides a structure having a combination of (i) a stub fabricated on a polymer and (ii) a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning (a) a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with (b) a silicon waveguide (SiWG) array fabricated on the silicon chip; wherein, the stub fabricated on the polymer is patterned according to a nano-imprint process, along with the PWG array, in a direction in which the PWG array is fabricated, and the groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: June 21, 2016
    Assignee: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Yoichi Taira, Masao Tokunari
  • Patent number: 9354408
    Abstract: A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: May 31, 2016
    Assignee: International Business Machines Corporation
    Inventors: Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada
  • Patent number: 9341797
    Abstract: An optical module includes: at least one optical waveguide provided on a surface of a substrate; a plurality of grooves provided in the optical waveguide on the surface of the substrate and having both a surface orthogonal to the surface of the substrate and an inclined surface; multiple pairs of light-emitting and light-receiving elements aligned with the plurality of grooves in the optical waveguide and provided so as to correspond to light of different wavelengths on the optical waveguide; and a plurality of light-selecting filters each provided on an inclined surface of the plurality of grooves in the optical waveguide and reflecting light of the wavelength corresponding to the light-emitting element in the respective pair of light-emitting and light-receiving elements towards the optical waveguide, and selectively reflecting light of the corresponding wavelength from the light propagating through the optical waveguide towards the corresponding pair of light-emitting and light-receiving elements.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: May 17, 2016
    Assignee: International Business Machines Corporation
    Inventors: Shigeru Nakagawa, Yoichi Taira, Masao Tokunari
  • Patent number: 9341785
    Abstract: Optical systems for wavelength division multiplexing and wavelength division demultiplexing with a multi-core fiber, and methods of their fabrication, are disclosed. In accordance with one method for fabricating an optical system for wavelength division demultiplexing, a resin is molded to define an element with a plurality of angled surfaces. Further, a plurality of filters are formed around the element, where each of the filters is configured to filter at least one respective wavelength and transmit at least one other respective wavelength. In addition, reflective surfaces are formed on the plurality of angled surfaces. Moreover, an additional resin is formed over the element and over the plurality of filters to complete a guiding structure. Further, arrays of photodiodes are affixed to the guiding structure below the plurality of filters. Alternatively, for demultiplexing embodiments, sets of laser chips are affixed to the guiding structure.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: May 17, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jean Benoit Héroux, Masao Tokunari
  • Patent number: 9289921
    Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: March 22, 2016
    Assignee: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Masao Tokunari
  • Publication number: 20150338589
    Abstract: A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).
    Type: Application
    Filed: October 17, 2013
    Publication date: November 26, 2015
    Inventors: Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada
  • Publication number: 20150226921
    Abstract: Optical systems for wavelength division multiplexing and wavelength division demultiplexing with a multi-core fiber, and methods of their fabrication, are disclosed. The systems include a coupling mirror with a plurality of angled surfaces that are configured to direct light to or from different cores of a multi-core fiber. In addition, the multiplexer systems can further include laser chips for generating light, while the demultiplexer systems can include photodiode arrays for detecting light from the multi-core fiber. The systems can also include a guiding structure comprising filters/micro-mirrors to direct light from the lasers or to the photodiodes.
    Type: Application
    Filed: April 27, 2015
    Publication date: August 13, 2015
    Inventors: Jean Benoit Héroux, Masao Tokunari
  • Publication number: 20150202802
    Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.
    Type: Application
    Filed: March 31, 2015
    Publication date: July 23, 2015
    Inventors: Hidetoshi NUMATA, Masao TOKUNARI
  • Patent number: 9077450
    Abstract: Optical systems for wavelength division multiplexing and wavelength division demultiplexing with a multi-core fiber, and methods of their fabrication, are disclosed. The systems include a coupling mirror with a plurality of angled surfaces that are configured to direct light to or from different cores of a multi-core fiber. In addition, the multiplexer systems can further include laser chips for generating light, while the demultiplexer systems can include photodiode arrays for detecting light from the multi-core fiber. The systems can also include a guiding structure comprising filters/micro-mirrors to direct light from the lasers or to the photodiodes.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: July 7, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Benoit Héroux, Masao Tokunari
  • Publication number: 20150153522
    Abstract: Embodiments of the present invention provide optical modules which input and output wavelength multiplexed optical signals to and from an optical waveguide, and a manufacturing method thereof. In one embodiment, an optical module comprises light emitting and light receiving element pairs that are positioned on grooves of one or more optical waveguides, where each light emitting and light receiving element pair corresponds to a different wavelength of light. Each light emitting and light receiving element pair includes an optical pin comprising an inclined surface and a light selecting filter that are configured to reflect light of a corresponding wavelength from an optical waveguide to the light receiving element, and from the light emitting element to the optical waveguide.
    Type: Application
    Filed: October 21, 2014
    Publication date: June 4, 2015
    Inventors: Shigeru Nakagawa, Yoichi Taira, Masao Tokunari
  • Patent number: 9023256
    Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: May 5, 2015
    Assignee: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Masao Tokunari
  • Publication number: 20150104129
    Abstract: An optical module includes: at least one optical waveguide provided on a surface of a substrate; a plurality of grooves provided in the optical waveguide on the surface of the substrate and having both a surface orthogonal to the surface of the substrate and an inclined surface; multiple pairs of light-emitting and light-receiving elements aligned with the plurality of grooves in the optical waveguide and provided so as to correspond to light of different wavelengths on the optical waveguide; and a plurality of light-selecting filters each provided on an inclined surface of the plurality of grooves in the optical waveguide and reflecting light of the wavelength corresponding to the light-emitting element in the respective pair of light-emitting and light-receiving elements towards the optical waveguide, and selectively reflecting light of the corresponding wavelength from the light propagating through the optical waveguide towards the corresponding pair of light-emitting and light-receiving elements.
    Type: Application
    Filed: September 11, 2014
    Publication date: April 16, 2015
    Inventors: Shigeru Nakagawa, Yoichi Taira, Masao Tokunari
  • Publication number: 20150069645
    Abstract: Optical systems for wavelength division multiplexing and wavelength division demultiplexing with a multi-core fiber, and methods of their fabrication, are disclosed. In accordance with one method for fabricating an optical system for wavelength division demultiplexing, a resin is molded to define an element with a plurality of angled surfaces. Further, a plurality of filters are formed around the element, where each of the filters is configured to filter at least one respective wavelength and transmit at least one other respective wavelength. In addition, reflective surfaces are formed on the plurality of angled surfaces. Moreover, an additional resin is formed over the element and over the plurality of filters to complete a guiding structure. Further, arrays of photodiodes are affixed to the guiding structure below the plurality of filters. Alternatively, for demultiplexing embodiments, sets of laser chips are affixed to the guiding structure.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 12, 2015
    Applicant: INTERATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Benoit Héroux, Masao Tokunari
  • Publication number: 20150071638
    Abstract: Optical systems for wavelength division multiplexing and wavelength division demultiplexing with a multi-core fiber, and methods of their fabrication, are disclosed. The systems include a coupling mirror with a plurality of angled surfaces that are configured to direct light to or from different cores of a multi-core fiber. In addition, the multiplexer systems can further include laser chips for generating light, while the demultiplexer systems can include photodiode arrays for detecting light from the multi-core fiber. The systems can also include a guiding structure comprising filters/micro-mirrors to direct light from the lasers or to the photodiodes.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 12, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Benoit Héroux, Masao Tokunari
  • Patent number: 8971678
    Abstract: Spacer resin pattern layer which precisely aligns a light-emitting element or a light-receiving element relative to both a waveguide pattern layer and electrical circuit pattern layer from the semiconductor wafer level. A substratum of resin having a through-hole provided for electrical communication with an electrical circuit pattern layer is formed on a semiconductor wafer. A truncated cone-shaped three-dimensional reflective surface is formed to guide the emitted light towards or received light from a waveguide pattern layer. A metal film is deposited planarly in a predetermined range from the center when positioned relative to the position of the through-hole. A truncated cone-shaped mold is stamped in the center. By modifying the direction of the light using this tapered structure, the precision tolerance is increased and optical loss is reduced.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: March 3, 2015
    Assignee: International Business Machines Corporation
    Inventors: Daiju Nakano, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada
  • Publication number: 20140112629
    Abstract: A method for fabricating, and a structure embodying, a single-mode polymer wave guide array aligned with a polymer waveguide array through adiabatic coupling. The present invention provides a structure having a combination of (i) a stub fabricated on a polymer and (ii) a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning (a) a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with (b) a silicon waveguide (SiWG) array fabricated on the silicon chip; wherein, the stub fabricated on the polymer is patterned according to a nano-imprint process, along with the PWG array, in a direction in which the PWG array is fabricated, and the groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.
    Type: Application
    Filed: October 10, 2013
    Publication date: April 24, 2014
    Applicant: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Yoichi Taira, Masao Tokunari
  • Publication number: 20140061979
    Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 6, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hidetoshi NUMATA, Masao TOKUNARI
  • Publication number: 20130301986
    Abstract: Spacer resin pattern layer which precisely aligns a light-emitting element or a light-receiving element relative to both a waveguide pattern layer and electrical circuit pattern layer from the semiconductor wafer level. A substratum of resin having a through-hole provided for electrical communication with an electrical circuit pattern layer is formed on a semiconductor wafer. A truncated cone-shaped three-dimensional reflective surface is formed to guide the emitted light towards or received light from a waveguide pattern layer. A metal film is deposited planarly in a predetermined range from the center when positioned relative to the position of the through-hole. A truncated cone-shaped mold is stamped in the center. By modifying the direction of the light using this tapered structure, the precision tolerance is increased and optical loss is reduced.
    Type: Application
    Filed: April 16, 2013
    Publication date: November 14, 2013
    Inventors: Daiju Nakano, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada