Abstract: A liquid discharge head includes a flow channel member, a pressurization part, a plurality of discharge holes, a flexible substrate, a cover member, and a heater. The flow channel member includes a first surface and a second surface that is positioned on an opposite side of the first surface. The pressurization part is positioned on the first surface. The plurality of discharge holes are positioned on the second surface. For the flexible substrate, a one-end part thereof that is positioned on the pressurization part is electrically connected to the pressurization part. The cover member covers the one-end part of the flexible substrate. The heater is positioned on the cover member.

Abstract: A liquid discharge head includes a head body, a driver IC, a housing, a heat dissipation plate, and a pressing member. The head body includes a discharge hole configured to discharge a liquid. The driver IC controls driving of the head body. The housing is located on the head body, and includes an opening at a side surface. The heat dissipation plate is located at the opening of the housing, and is configured to dissipate heat generated by the driver IC. The pressing member presses the driver IC against the heat dissipation plate. In addition, the heat dissipation plate is fixed to the pressing member.

Abstract: A liquid discharge head according to an embodiment includes a head body having a first surface configured to discharge a liquid and a second surface facing the first surface, a drive IC configured to drive the head body, and a head cover configured to cover at least the second surface of the head body while housing the drive IC. The head cover includes a top plate facing the second surface of the head body and a first side plate that is connected to the top plate and that is in contact with the drive IC, and in the head cover, a thickness of the first side plate is thinner than a thickness of the top plate.

Abstract: A head unit includes a common passage, at least one recording head, and a joint mechanism. The joint mechanism has a first valve and couples the common passage to the recording head. The first valve includes: a first stopper having a switch member with an insertion hole and an engagement boss projecting from its inner surface, a sliding portion inserted in the insertion hole slidably up and down, and an engagement groove engaged with the engagement boss; and a first sealing member fitted on the first stopper to be in contact with or away from the insertion hole's inner surface. Rotating the switch member to move the first stopper up/down causes the first valve to switch between a closed state, with the first sealing member in contact with the insertion hole's inner surface, and an open state, with the first sealing member away from the insertion hole's inner surface.

Abstract: A liquid discharge head includes a flow channel member, a pressurization part, a plurality of discharge holes, a flexible substrate, a cover member, and a heater. The flow channel member includes a first surface and a second surface that is positioned on an opposite side of the first surface. The pressurization part is positioned on the first surface. The plurality of discharge holes are positioned on the second surface. For the flexible substrate, a one-end part thereof that is positioned on the pressurization part is electrically connected to the pressurization part. The cover member covers the one-end part of the flexible substrate. The heater is positioned on the cover member.

Abstract: A head unit includes a common passage, at least one recording head, and a joint mechanism. The common flow passage has a liquid feed passage through which to pass at least one kind of liquid including ink. The recording head is attachable and detachable to and from the common flow passage, and has nozzles through which to eject the ink. The joint mechanism couples the liquid feed passage to a liquid feed port in the recording head, and has a first valve for opening and closing the liquid feed passage and a coupling member for coupling the first valve to the liquid feed port. In the top surface of the coupling member is a liquid reservoir portion for storing, when the recording head is removed from the common flow passage with the first valve closed, ink left between the first valve and the coupling member.

Abstract: A liquid discharge head includes a head body, a driver IC, a housing, a heat dissipation plate, and a pressing member. The head body includes a discharge hole configured to discharge a liquid. The driver IC controls driving of the head body. The housing is located on the head body, and includes an opening at a side surface. The heat dissipation plate is located at the opening of the housing, and is configured to dissipate heat generated by the driver IC. The pressing member presses the driver IC against the heat dissipation plate. In addition, the heat dissipation plate is fixed to the pressing member.

Abstract: A head unit includes a common passage, at least one recording head, and a joint mechanism. The joint mechanism has a first valve and couples the common passage to the recording head. The first valve includes: a first stopper having a switch member with an insertion hole and an engagement boss projecting from its inner surface, a sliding portion inserted in the insertion hole slidably up and down, and an engagement groove engaged with the engagement boss; and a first sealing member fitted on the first stopper to be in contact with or away from the insertion hole's inner surface. Rotating the switch member to move the first stopper up/down causes the first valve to switch between a closed state, with the first sealing member in contact with the insertion hole's inner surface, and an open state, with the first sealing member away from the insertion hole's inner surface.

Abstract: A liquid discharge head according to an embodiment includes a head body having a first surface configured to discharge a liquid and a second surface facing the first surface, a drive IC configured to drive the head body, and a head cover configured to cover at least the second surface of the head body while housing the drive IC. The head cover includes a top plate facing the second surface of the head body and a first side plate that is connected to the top plate and that is in contact with the drive IC, and in the head cover, a thickness of the first side plate is thinner than a thickness of the top plate.

Abstract: A piezoelectric vibrator is located on a first end portion of a second surface of a panel, and is configured to vibrate while being bent in a first direction, the first end portion extending in the first direction. A double-sided tape is located between the panel and a first case. An adhesive is located between the panel and the first case. The first end portion includes an element region, and has second and third end portions with the element region interposed between the second and third end portions. The second end portion faces the element region, and includes a first adhesive region. The double-sided tape is present between the first adhesive region and the element region, and is not present in a region located closer to an outer edge of the panel than the first adhesive region.

Abstract: A piezoelectric vibrator is located on a first end portion of a second surface of a panel, and is configured to vibrate while being bent in a first direction, the first end portion extending in the first direction. A double-sided tape is located between the panel and a first case. An adhesive is located between the panel and the first case. The first end portion includes an element region, and has second and third end portions with the element region interposed between the second and third end portions. The second end portion faces the element region, and includes a first adhesive region. The double-sided tape is present between the first adhesive region and the element region, and is not present in a region located closer to an outer edge of the panel than the first adhesive region.

Abstract: A semiconductor device which can achieve a reduction of EMI noises is provided. For example, a first region which is used for forming a core circuit block CRBK, a first power-source voltage line (LNVD1) in the first region, a first power-source voltage generating circuit (VREG), a first power source pad (PDvcl) outside the first region, a second power-source voltage line LNVD2 which connects the LNVD1 and the PDvcl, and an on-chip capacitor CC are provided. The PDvcl is connected to an external capacitor. The CC includes an upper electrode UPN which has a partial section of the LNVD2 and a lower electrode LWN to which a reference power-source voltage VSS is supplied. A first power source voltage (VDD) on the LNVD1 is applied to the PDvcl through the UPN.

Abstract: A semiconductor device capable of achieving a reduction of noise is provided. For example, the semiconductor device includes a first region for forming a core circuit block CRBK, a power-source voltage line LNVD1 disposed in the first region, a power-source voltage line LNVD2 disposed on the outside of the first region, and an on-chip capacitor CC. The CC has an upper electrode UPN being a partial section of the LNVD2, and a lower electrode LWN to which a reference power source voltage VSS is supplied. The CC is configured by a unit cell. An internal power source voltage VDD from a power-source source node is supplied to a CRBK through the UPN.

Abstract: The present invention is directed to solve a problem that, in a semiconductor device capable of generating a clock signal by coupling a quartz oscillator to an external terminal to which an I/O port is coupled, leak current of the I/O port which is in the inactive state disturbs activation of a clock. The semiconductor device has a first terminal, an amplification circuit coupled to the first terminal, and an output buffer whose output terminal is coupled to the first terminal. The output buffer has first and second transistors of a first conduction type coupled in series via a first node between a first power supply line and an output terminal, and the conduction states of the first and second transistors of the first conduction state are controlled in response to a first control signal which is applied commonly to the gate of each of the first and second transistors.

Abstract: An electronic device includes: a main body; a screen panel disposed on a surface of the main body and configured to display an image; a frame-shaped cover panel disposed on the surface of the main body to cover an outer periphery of the screen panel; a bone conduction vibrator incorporated in the main body and attached to a rear surface of the screen panel, and an adhesive layer fixedly attaching the cover panel at a rear surface thereof to an outer peripheral portion of the surface of the screen panel. The adhesive layer extends along the outer peripheral portion of the surface of the screen panel and has a missing portion in which an area to be located in the vicinity of the bone conduction vibrator is missing. The missing portion-provides a gap between the surface of the screen panel and the rear surface of the cover panel.

Abstract: The present invention is directed to solve a problem that, in a semiconductor device capable of generating a clock signal by coupling a quartz oscillator to an external terminal to which an I/O port is coupled, leak current of the I/O port which is in the inactive state disturbs activation of a clock. The semiconductor device has a first terminal, an amplification circuit coupled to the first terminal, and an output buffer whose output terminal is coupled to the first terminal. The output buffer has first and second transistors of a first conduction type coupled in series via a first node between a first power supply line and an output terminal, and the conduction states of the first and second transistors of the first conduction state are controlled in response to a first control signal which is applied commonly to the gate of each of the first and second transistors.

Abstract: The present invention is directed to solve a problem that, in a semiconductor device capable of generating a clock signal by coupling a quartz oscillator to an external terminal to which an I/O port is coupled, leak current of the I/O port which is in the inactive state disturbs activation of a clock. The semiconductor device has a first terminal, an amplification circuit coupled to the first terminal, and an output buffer whose output terminal is coupled to the first terminal. The output buffer has first and second transistors of a first conduction type coupled in series via a first node between a first power supply line and an output terminal, and the conduction states of the first and second transistors of the first conduction state are controlled in response to a first control signal which is applied commonly to the gate of each of the first and second transistors.

Abstract: An electronic device of the invention includes: a main body; a screen panel disposed on a surface of the main body and configured to display an image; a frame-shaped cover panel disposed on the surface of the main body to cover an outer periphery of the screen panel; a bone conduction vibrator incorporated in the main body and attached to a rear surface of the screen panel, the bone conduction vibrator being configured to transmit audio by bone conduction; and an adhesive layer fixedly attaching the cover panel at a rear surface thereof to an outer peripheral portion of the surface of the screen panel. The adhesive layer extends along the outer peripheral portion of the surface of the screen panel and has a missing portion in which an area to be located in the vicinity of the bone conduction vibrator is missing. The missing portion in the adhesive layer provides a gap between the surface of the screen panel and the rear surface of the cover panel.

Abstract: The present invention is directed to solve a problem that, in a semiconductor device capable of generating a clock signal by coupling a quartz oscillator to an external terminal to which an I/O port is coupled, leak current of the I/O port which is in the inactive state disturbs activation of a clock. The semiconductor device has a first terminal, an amplification circuit coupled to the first terminal, and an output buffer whose output terminal is coupled to the first terminal. The output buffer has first and second transistors of a first conduction type coupled in series via a first node between a first power supply line and an output terminal, and the conduction states of the first and second transistors of the first conduction state are controlled in response to a first control signal which is applied commonly to the gate of each of the first and second transistors.

Abstract: In combining an analog terminal of an A/D converter with a digital terminal, the effect of the noise from the digital terminal is reduced. A semiconductor integrated circuit includes a high-speed external terminal, a low-speed external terminal, a high-speed analog switch, a low-speed analog switch, and an A/D converter. The high-speed external terminal is coupled to an input of the A/D converter via the high-speed analog switch, and the low-speed external terminal is coupled to the input of the A/D converter via the low-speed analog switch. A plurality of inputs of a plurality of low-speed digital input buffer circuits and a plurality of outputs of a plurality of low-speed digital output buffer circuits are coupled to a plurality of low-speed external terminals.