Patents by Inventor Masaru Takeshita

Masaru Takeshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060257784
    Abstract: A copolymer for semiconductor lithography, comprising at least a recurring unit (A) having a carboxylic acid ester structure whose solubility in alkali increases by the action of an acid and a carboxyl group-containing recurring unit (B), which copolymer is obtained via a step (P) of (co)polymerizing at least a monomer giving a recurring unit (A) and a step (Q) of forming a recurring unit (B) in the co-presence of a recurring unit (A)-containing (co)polymer and/or a monomer giving a recurring unit (A), and an acid. The copolymer is used in production of semiconductor as a resist polymer which is small in roughness, little in development defect and superior in lithography properties such as DOF and the like.
    Type: Application
    Filed: May 9, 2006
    Publication date: November 16, 2006
    Inventors: Takanori Yamagishi, Tomo Oikawa, Masaaki Muroi, Kota Atsuchi, Takahiro Nakamura, Masakazu Yamada, Kensuke Saisyo, Masaru Takeshita
  • Publication number: 20060141384
    Abstract: A process is provided for effectively removing by-products such as oligomers contained within a crude resin for an electronic material, thus producing a resin for an electronic material. In this process, a crude resin for an electronic material containing (a1) structural units derived from a (meth)acrylate ester with a hydrophilic site is washed using (b1) an organic solvent which is capable of dissolving said crude resin for an electronic material and which separates into two layers when combined with water, and (b2) water.
    Type: Application
    Filed: January 28, 2004
    Publication date: June 29, 2006
    Inventors: Hideo Hada, Takeshi Iwai, Masaru Takeshita, Ryotaro Hayashi, Masaaki Muroi, Kota Atsuchi, Hiroaki Tomida, Kazuyuki Shiotani
  • Publication number: 20060141382
    Abstract: There are provided a resist composition that produces a resist pattern of good shape, and a method of forming a resist pattern that uses such a resist composition. The resist composition comprises a resin component (A) that undergoes a change in alkali solubility under the action of acid, an acid generator component (B) that generates acid on exposure, and an organic solvent (C), wherein the component (B) comprises a compound represented by a general formula (I) shown below [wherein, R1 to R3 each represent, independently, a methyl group or an ethyl group; and X? represents an anion].
    Type: Application
    Filed: December 18, 2003
    Publication date: June 29, 2006
    Inventors: Masaru Takeshita, Miwa Miyairi, Hideo Hada, Takeshi Iwai
  • Publication number: 20060127801
    Abstract: The resist polymer of the present invention comprises a specific constitutional unit having a cyano group, a constitutional unit having an acid-dissociable group, and a specific constitutional unit having a lactone skeleton. When the above polymer is used as a resist resin in DUV excimer laser lithography or electron beam lithography, it exhibits high sensitivity and high resolution, and provides a good resist pattern shape, having a small degree of occurrence of line edge roughness or generation of microgels.
    Type: Application
    Filed: January 29, 2004
    Publication date: June 15, 2006
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Hikaru Momose, Atsushi Ootake, Akifumi Ueda, Tadayuki Fujiwara, Masaru Takeshita, Ryotaro Kayashi, Takeshi Iwai
  • Patent number: 6161752
    Abstract: An object of the present invention is to provide plate width center alignment method and apparatus for a welding machine, which can dispense with a detection driving device, which is simple in construction but can perform the detection from a position closest to a cutting-welding position, and which is high in plate width center alignment accuracy. Plate side edge detectors which are included in a plate width center alignment means for detecting plate widths of two cut plates and aligning plate width centers with each other, and which detect widthwise plate side edges of the two cut plates, are disposed on a movable frame provided with a cutting means and a welding means, elongated in the width direction of a web and movable in that direction.
    Type: Grant
    Filed: May 17, 1999
    Date of Patent: December 19, 2000
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Co., Ltd.
    Inventors: Junji Miyata, Keiji Sodeno, Masayuki Nakamura, Seiji Kodama, Nobuyoshi Nakatani, Masaru Takeshita
  • Patent number: 5220088
    Abstract: A process for the dimerization of n-butene wherein a Ziegler catalyst system composed of a nickel compound and an organoalkylaluminum is added, as a third component, with an amine and/or a quaternary ammonium chloride. The amine can be a primary, secondary or tertiary amine. This process makes it possible to selectively prepare isooctene having a low degree of branching while maintaining high catalytic activity.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: June 15, 1993
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Kenji Fujiwara, Toshiyuki Fukushima, Masaru Takeshita, Nobukiyo Okawa, Noboru Takada, Akira Othu
  • Patent number: 4994586
    Abstract: A novel method for preparing an epoxy compound is disclosed which comprises the step of reacting an olefin compound having 4 to 16 carbon atoms with an organic hydroperoxide in an inactive solvent in the presence of a molybdenum compound and at least one metal halide selected from the group consisting of halides of alkali metals and alkaline earth metals, in order to form the corresponding epoxy compound. Typical examples of the aforesaid metal halide include sodium chloride, potassium iodide, sodium bromide and barium chloride. According to the present invention, the epoxy compound having 4 to 16 carbon atoms can be prepared in an extremely high yield.
    Type: Grant
    Filed: May 25, 1989
    Date of Patent: February 19, 1991
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Nobumasa Arashiba, Takashi Shimizu, Masaru Takeshita, Akira Otsu
  • Patent number: 4516451
    Abstract: For cutting an elongate rubbery strip, there is disclosed an apparatus which largely comprises transmitting means operative to transmit the elongate rubbery strip to a predetermined position, an anvil located underneath the predetermined position and formed with an elongated groove extending at angle with respect to the transverse direction of the rubbery strip, the angle between the longitudinal direction of the elongated groove and the transverse direction of the rubbery strip being variable by means of adjusting means. The apparatus for cutting the elongate rubbery strip further comprises a cutting mechanism operative to cut the elongate rubbery strip on bias throughout the width thereof in cooperation with the anvil.
    Type: Grant
    Filed: April 21, 1983
    Date of Patent: May 14, 1985
    Assignee: Bridgestone Tire Company Limited
    Inventors: Masaru Takeshita, Toshio Tokunaga, Yuichiro Ogawa