Patents by Inventor Masaru Yamazaki
Masaru Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11954546Abstract: Provided is a structure for individual authentication in which a pillar pattern region including a plurality of nanopillars formed of synthetic quartz glass is formed on at least a part of a surface portion of a synthetic quartz glass substrate. In the pillar pattern region, the nanopillars have an indentation elastic modulus of 35 to 100 GPa as measured by a nanoindentation method, and the nanopillars are plastically deformed.Type: GrantFiled: May 25, 2021Date of Patent: April 9, 2024Assignees: SHIN-ETSU CHEMICAL CO., LTD., TOHOKU UNIVERSITYInventors: Masao Ando, Hiroyuki Yamazaki, Masaki Takeuchi, Masaru Nakagawa, Shunya Ito
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Patent number: 10023941Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.Type: GrantFiled: December 27, 2012Date of Patent: July 17, 2018Assignee: KITZ CORPORATIONInventors: Hidenobu Tameda, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
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Patent number: 8910934Abstract: Disclosed is a sheet ejecting device. The sheet ejecting device includes a sheet stacking section; a bumping section; a sheet ejecting section; a mode selecting section; and a control section. The sheet ejecting section includes a pair of sheet clamping members which clamps one sheet or a plurality of overlapped sheets at a sheet clamping position and moves the one sheet or the plurality of overlapped sheets to a sheet stacking position in the sheet stacking section. The mode selecting section allows selection of an operation mode of the pair of sheet clamping members between a normal mode in which speed of the pair of sheet clamping members is a normal speed and a low speed mode in which a speed is lower than the normal speed.Type: GrantFiled: January 18, 2013Date of Patent: December 16, 2014Assignee: Konica Minolta Business Technologies, Inc.Inventor: Masaru Yamazaki
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Publication number: 20130187328Abstract: Disclosed is a sheet ejecting device. The sheet ejecting device includes a sheet stacking section; a bumping section; a sheet ejecting section; a mode selecting section; and a control section. The sheet ejecting section includes a pair of sheet clamping members which clamps one sheet or a plurality of overlapped sheets at a sheet clamping position and moves the one sheet or the plurality of overlapped sheets to a sheet stacking position in the sheet stacking section. The mode selecting section allows selection of an operation mode of the pair of sheet clamping members between a normal mode in which speed of the pair of sheet clamping members is a normal speed and a low speed mode in which a speed is lower than the normal speed.Type: ApplicationFiled: January 18, 2013Publication date: July 25, 2013Inventor: Masaru YAMAZAKI
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Patent number: 8366840Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.Type: GrantFiled: December 28, 2007Date of Patent: February 5, 2013Assignee: Kitz CorporationInventors: Hidenobu Tameda, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
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Patent number: 8114434Abstract: The invention provides an analgesic anti-inflammatory patch of a hydrophobic type for topical application containing, in a Pressure Sensitive Adhesive(PSA), diclofenac sodium, pyrrolidone or a derivative thereof, a polyhydric alcohol fatty acid ester, and an organic acid. The patch exerts the following effects: (1) diclofenac sodium is effectively and continuously released from a Pressure Sensitive Adhesive(PSA) and percutaneously absorbed, thereby attaining sustained, excellent pharmaceutical and pharmacological effects; (2) the patch per se has high tackiness and safety; and (3) diclofenac sodium remains stable in the Pressure Sensitive Adhesive(PSA).Type: GrantFiled: November 9, 2009Date of Patent: February 14, 2012Assignees: Tokuhon Corporation, SSP Co., Ltd., Dojin Iyaku Kako Co., Ltd.Inventors: Yasuhiko Sasaki, Yukihiro Matsumura, Masaru Yamazaki, Hiroshi Arai, Shogo Kawabata, Masaaki Saito, Hirohisa Okuyama, Makoto Suzuki
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Patent number: 7807560Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.Type: GrantFiled: July 16, 2008Date of Patent: October 5, 2010Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kei Imafuji, Masao Nakazawa, Masaki Sanada, Sachiko Oda, Tadashi Kodaira, Kinji Nagata, Masaru Yamazaki, Kenjiro Enoki
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Publication number: 20100055160Abstract: The invention provides an analgesic anti-inflammatory patch of a hydrophobic type for topical application containing, in a Pressure Sensitive Adhesive(PSA), diclofenac sodium, pyrrolidone or a derivative thereof, a polyhydric alcohol fatty acid ester, and an organic acid. The patch exerts the following effects: (1) diclofenac sodium is effectively and continuously released from a Pressure Sensitive Adhesive(PSA) and percutaneously absorbed, thereby attaining sustained, excellent pharmaceutical and pharmacological effects; (2) the patch per se has high tackiness and safety; and (3) diclofenac sodium remains stable in the Pressure Sensitive Adhesive(PSA).Type: ApplicationFiled: November 9, 2009Publication date: March 4, 2010Applicants: TOKUHON CORPORATION, SSP CO., LTD.Inventors: Yasuhiko Sasaki, Yukihiro Matsumura, Masaru Yamazaki, Hiroshi Arai, Shogo Kawabata, Masaaki Saito, Hirohisa Okuyama, Makoto Suzuki
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Publication number: 20100047325Abstract: The invention provides an analgesic anti-inflammatory patch of a hydrophobic type for topical application containing, in a Pressure Sensitive Adhesive(PSA), diclofenac sodium, pyrrolidone or a derivative thereof, a polyhydric alcohol fatty acid ester, and an organic acid. The patch exerts the following effects: (1) diclofenac sodium is effectively and continuously released from a Pressure Sensitive Adhesive(PSA) and percutaneously absorbed, thereby attaining sustained, excellent pharmaceutical and pharmacological effects; (2) the patch per se has high tackiness and safety; and (3) diclofenac sodium remains stable in the Pressure Sensitive Adhesive(PSA).Type: ApplicationFiled: November 9, 2009Publication date: February 25, 2010Applicants: TOKUHON CORPORATION, SSP CO., LTD.Inventors: Yasuhiko SASAKI, Yukihiro Matsumura, Masaru Yamazaki, Hiroshi Arai, Shogo Kawabata, Masaaki Saito, Hirohisa Okuyama, Makoto Suzuki
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Patent number: 7651700Abstract: The invention provides an analgesic anti-inflammatory patch of a hydrophobic type for topical application containing, in a Pressure Sensitive Adhesive (PSA), diclofenac sodium, pyrrolidone or a derivative thereof, a polyhydric alcohol fatty acid ester, and an organic acid. The patch exerts the following effects: (1) diclofenac sodium is effectively and continuously released from a Pressure Sensitive Adhesive (PSA) and percutaneously absorbed, thereby attaining sustained, excellent pharmaceutical and pharmacological effects; (2) the patch per se has high tackiness and safety; and (3) diclofenac sodium remains stable in the Pressure Sensitive Adhesive (PSA).Type: GrantFiled: May 22, 2002Date of Patent: January 26, 2010Assignees: Tokuhon Corporation, SSP Co., Ltd., Dojin Iyaku-Kako Co., Ltd.Inventors: Yasuhiko Sasaki, Yukihiro Matsumura, Masaru Yamazaki, Hiroshi Arai, Shogo Kawabata, Masaaki Saito, Hirohisa Okuyama, Makoto Suzuki
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Publication number: 20090297390Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.Type: ApplicationFiled: December 28, 2007Publication date: December 3, 2009Inventors: Tameda Hidenobu, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
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Publication number: 20090023281Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.Type: ApplicationFiled: July 16, 2008Publication date: January 22, 2009Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kei Imafuji, Masao Nakazawa, Masaki Sanada, Sachiko Oda, Tadashi Kodaira, Kinji Nagata, Masaru Yamazaki, Kenjiro Enoki
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Patent number: 7251021Abstract: A substrate transfer apparatus has pluralities of pairs of substrate support mechanisms. The substrate support mechanism includes a first roller provided on a first rotary shaft and a second roller provided on a second rotary shaft, the substrate support mechanism transfers a substrate in a transfer direction while supporting the substrate between the first and second rollers in a thickness direction of the substrate. The pair of the substrate support mechanisms are disposed so as to oppose to each other in a width direction of the substrate and the pairs of the substrate support mechanisms are arranged along with the transfer direction. Further, a substrate position regulating member that regulates a position of the substrate by contacting with a side surface which is parallel to the transfer direction is provided on either of the first and second rotary shafts.Type: GrantFiled: September 26, 2006Date of Patent: July 31, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Toshiaki Suyama, Makoto Kawahara, Masaru Yamazaki, Takahiro Rokugawa
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Publication number: 20070070325Abstract: A substrate transfer apparatus has pluralities of pairs of substrate support mechanisms. The substrate support mechanism includes a first roller provided on a first rotary shaft and a second roller provided on a second rotary shaft, the substrate support mechanism transfers a substrate in a transfer direction while supporting the substrate between the first and second rollers in a thickness direction of the substrate. The pair of the substrate support mechanisms are disposed so as to oppose to each other in a width direction of the substrate and the pairs of the substrate support mechanisms are arranged along with the transfer direction. Further, a substrate position regulating member that regulates a position of the substrate by contacting with a side surface which is parallel to the transfer direction is provided on either of the first and second rotary shafts.Type: ApplicationFiled: September 26, 2006Publication date: March 29, 2007Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Toshiaki Suyama, Makoto Kawahara, Masaru Yamazaki, Takahiro Rokugawa
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Patent number: 6974509Abstract: Brass consists essentially of Cu, Sn, Bi, Fe, Ni and P in weight ratios respectively of 58.0-63.2%, 0.3-2.0%, 0.7-2.5%, 0.05-0.3%, 0.10-0.50% and 0.05-0.15% plus the balance of Zn and unavoidable impurities to exhibit excellent tolerance for dezincification, hot forgeability and machinability.Type: GrantFiled: June 2, 2003Date of Patent: December 13, 2005Assignee: Kitz CorporationInventors: Koichi Hagiwara, Masaru Yamazaki, Yoshihiro Hirata, Mitsuhide Hirabayashi, Kozo Ito
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Patent number: 6767616Abstract: A metal core substrate comprises a core layer (10) consisting of first and second metal plates (11, 12) layered with a third insulating layer (13) interposed therebetween; first and second insulating layers (20, 21) formed on the first and metal plates, respectively; first and second wiring patterns (45, 46) formed on the first and second insulating layers, respectively. A conductive layer (40) formed in a through-hole (22) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate (11) is electrically connected with the first wiring pattern (45) and the second wiring pattern (46), respectively, by means of a via (44) and by means a via (43).Type: GrantFiled: May 13, 2003Date of Patent: July 27, 2004Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazuhiko Ooi, Masaru Yamazaki, Yukiji Watanabe, Takaaki Yazawa
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Publication number: 20030215619Abstract: A metal core substrate comprises a core layer (10) consisting of first and second metal plates (11, 12) layered with a third insulating layer (13) interposed therebetween; first and second insulating layers (20, 21) formed on the first and metal plates, respectively; first and second wiring patterns (45, 46) formed on the first and second insulating layers, respectively. A conductive layer (40) formed in a through-hole (22) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate (11) is electrically connected with the first wiring pattern (45) and the second wiring pattern (46), respectively, by means of a via (44) and by means a via (43).Type: ApplicationFiled: May 13, 2003Publication date: November 20, 2003Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kazuhiko Ooi, Masaru Yamazaki, Yukiji Watanabe, Takaaki Yazawa
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Publication number: 20030205301Abstract: Brass consists essentially of Cu, Sn, Bi, Fe, Ni and P in weight ratios respectively of 58.0-63.2%, 0.3-2.0%, 0.7-2.5%, 0.05-0.3%, 0.10-0.50% and 0.05-0.15% plus the balance of Zn and unavoidable impurities to exhibit excellent tolerance for dezincification, hot forgeability and machinability.Type: ApplicationFiled: June 2, 2003Publication date: November 6, 2003Inventors: Koichi Hagiwara, Masaru Yamazaki, Yoshihiro Hirata, Mitsuhide Hirabayashi, Kozo Ito
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Publication number: 20030175331Abstract: The invention provides an analgesic anti-inflammatory patch of a hydrophobic type for topical application containing, in a Pressure Sensitive Adhesive (PSA), diclofenac sodium, pyrrolidone or a derivative thereof, a polyhydric alcohol fatty acid ester, and an organic acid.Type: ApplicationFiled: January 23, 2003Publication date: September 18, 2003Inventors: Yasuhiko Sasaki, Yukihiro Matsumura, Masaru Yamazaki, Hiroshi Arai, Shogo Kawabata, Masaaki Saito, Hirohisa Okuyama, Makoto Suzuki
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Patent number: 6599378Abstract: A copper-based alloy includes one base phase selected from the group consisting of &agr; phase, &agr;+&bgr; phase, and &agr;+&bgr;+&ggr; phase, a component having a lower melting point than the base phase, and a component for dispersing the base phase and the low melting component to uniformly disperse the low melting component and improve the copper-based alloy in machinability. A method for producing the copper alloy in the form of a bar or plate includes the steps of compounding raw materials in predetermined ratios thereby obtaining a mixture, fusing the mixture thereby obtaining a melt, continuously casting the melt into a cast billet, or rolling the cast billet thereby obtaining a shaped mass, heat-treating the shaped mass, drawing or rolling the heat-treated shaped mass thereby obtaining a plastic mass, and subjecting the plastic mass to a heat-treatment of air cooling or furnace cooling.Type: GrantFiled: September 7, 2000Date of Patent: July 29, 2003Assignee: Kitz CorporationInventors: Koichi Hagiwara, Masaru Yamazaki, Yukihiro Hirata, Mitsuhide Hirabayashi, Kozo Ito