Patents by Inventor Masashi Furukawa

Masashi Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10464504
    Abstract: A circuit body for a vehicle is wired on a vehicle body of the vehicle for performing supply of electric power to an electrical component and communication of various communication signals with the electrical component. The circuit body includes: a plurality of control boxes separately disposed on the circuit body and capable of controlling input and output of at least one of the electric power and the communication signal; a trunk line harness connecting one of the plurality of control boxes and another of the plurality of control boxes; and a branch line harness connecting the control box and the electrical component. At least one of the plurality of control boxes is grounded via the electrical component connected to the branch line harness.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: November 5, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Patent number: 10458592
    Abstract: A double tube is provided, which can reliably prevent buckling and flattening of an inner tube even when bending is performed.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 29, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masashi Yagi, Hiroyuki Fukushima, Tomohiro Takagi, Makoto Furukawa
  • Publication number: 20190311924
    Abstract: Over a front surface of a silicon semiconductor wafer is deposited a high dielectric constant film with a silicon oxide film, serving as an interface layer, provided between the semiconductor wafer and the high dielectric constant film. After a chamber houses the semiconductor wafer, a chamber's pressure is reduced to be lower than atmospheric pressure. Subsequently, a gaseous mixture of ammonia and nitrogen gas is supplied into the chamber to return the pressure to ordinary pressure, and the front surface is irradiated with a flash light, thereby performing post deposition annealing (PDA) on the high dielectric constant film. Since the pressure is reduced once to be lower than atmospheric pressure and then returned to ordinary pressure, a chamber's oxygen concentration is lowered remarkably during the PDA. This restricts an increase in thickness of the silicon oxide film underlying the high dielectric constant film by oxygen taken in during the PDA.
    Type: Application
    Filed: June 25, 2019
    Publication date: October 10, 2019
    Inventors: Takayuki AOYAMA, Hikaru KAWARAZAKI, Masashi FURUKAWA, Shinichi KATO, Kazuhiko FUSE, Hideaki TANIMURA
  • Patent number: 10424483
    Abstract: A metal film is deposited on a front surface of a semiconductor wafer of silicon. After the semiconductor wafer is received in a chamber, the pressure in the chamber is reduced to a pressure lower than atmospheric pressure. Thereafter, nitrogen gas is supplied into the chamber to return the pressure in the chamber to ordinary pressure, and the front surface of the semiconductor wafer is irradiated with a flash of light, so that a silicide that is a compound of the metal film and silicon is formed. The oxygen concentration in the chamber is significantly lowered during the formation of the silicide because the pressure in the chamber is reduced once to the pressure lower than atmospheric pressure and then returned to the ordinary pressure. This suppresses the increase in resistance of the silicide resulting from the entry of oxygen in the atmosphere in the chamber into defects near the interface between the metal film and a base material.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: September 24, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Takayuki Aoyama, Hikaru Kawarazaki, Masashi Furukawa, Kazuhiko Fuse, Hideaki Tanimura, Shinichi Kato
  • Publication number: 20190275967
    Abstract: A circuit body (1) for a vehicle includes: a plurality of control boxes (10) dispersedly arranged on the circuit body; a trunk harness (20) connecting one of the control boxes to another of the control boxes; and a branch harness (30) connecting the control box the electric component. The control boxes, the trunk harness and the branch harness is configured to ground a power circuit and a signal circuit through grounding routes different from each other. The power circuit supplies the electric power from a power source (BAT) to the electric component through the control boxes. The signal circuit transmits a communication signal between the control boxes and the electric component and between one of the control boxes and another of the control boxes.
    Type: Application
    Filed: March 5, 2019
    Publication date: September 12, 2019
    Applicant: Yazaki Corporation
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Publication number: 20190275966
    Abstract: A method for manufacturing a wire harness (1) includes: disposing a trunk harness (20), a branch harness (30) and control boxes (10) on a workbench (41) and attaching the trunk harness and the branch harness to the control boxes; connecting the control boxes to an external device (60) via the branch harness; and switching operation mode of at least one of the control boxes to an information writing mode for inputting information for operating the electric component to be connected to the branch harness into the at least one of the control boxes and then inputting the information from the external device into the at least one of the control boxes via the branch harness.
    Type: Application
    Filed: March 6, 2019
    Publication date: September 12, 2019
    Applicant: Yazaki Corporation
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Patent number: 10408160
    Abstract: A manufacturing method of a cylinder block (10) includes: a step of forming a slit (14) to flow refrigerant therein, between adjacent cylinder bores (CB) among a plurality of cylinder bores provided in a cylinder portion (11); a step of placing a first cover (20a) in the slit and welding the first cover to the cylinder portion by laser beam welding; and a step of placing a second cover (20b) on the first cover and joining the second cover to the cylinder portion by friction stir welding.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: September 10, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Minoru Kawasaki, Tomoya Okazaki, Masashi Furukawa
  • Publication number: 20190267270
    Abstract: A transportation preparation operation for transporting a semiconductor wafer from a treatment chamber is started before a temperature of the semiconductor wafer decreases to a transportable temperature. A gate valve is closed after a treatment on the semiconductor wafer is started, and an operation of transporting the semiconductor wafer into the treatment chamber is completed. A period of time for treating the semiconductor wafer and a period of time for transporting the semiconductor wafer in and out are overlapped with each other, thus a time required for transporting the semiconductor wafer W into and out of the treatment chamber can be reduced.
    Type: Application
    Filed: December 6, 2018
    Publication date: August 29, 2019
    Inventors: Masashi Furukawa, Yoshio ITO, Hiroki YOSHII
  • Publication number: 20190252205
    Abstract: The temperature of a susceptor made of quartz is increased by heat transfer and heat radiation from a heated semiconductor wafer. When the treated semiconductor wafer is transported outwardly, the susceptor has a non-uniform temperature distribution in which a central portion thereof is higher in temperature than an edge portion thereof. In an early stage of preheating in which a new semiconductor wafer is held by the susceptor and starts being irradiated with light emanating from halogen lamps, an intensity ratio that is the ratio of the intensity of light emanating from a central portion of a light irradiator including an array of the halogen lamps to the intensity of light emanating from an edge portion thereof is less than 100%. Thereafter, the ratio of the intensity of light emanating from the central portion of the light irradiator to the intensity of light emanating from the edge portion thereof is increased.
    Type: Application
    Filed: December 6, 2018
    Publication date: August 15, 2019
    Inventor: Masashi Furukawa
  • Publication number: 20190181058
    Abstract: A substrate in a chamber is preheated through light irradiation by a halogen lamp and then heated through irradiation with flash light from a flash lamp. Ammonia is supplied to the chamber from an ammonia supply mechanism to form ammonia atmosphere. The temperature of the substrate at heating processing is measured by a radiation thermometer. When the measurement wavelength band of the radiation thermometer overlaps with the absorption wavelength band of ammonia, the set emissivity of the radiation thermometer is changed and set to be lower than the actual emissivity of the substrate. When radiation light emitted from the substrate is absorbed by the ammonia atmosphere, the radiation thermometer can accurately output the temperature of the substrate as a measured value by reducing the set emissivity of the radiation thermometer.
    Type: Application
    Filed: February 20, 2019
    Publication date: June 13, 2019
    Inventors: Masashi FURUKAWA, Hikaru KAWARAZAKI, Kazuhiko FUSE
  • Publication number: 20190168692
    Abstract: A circuit body for a vehicle is wired on a vehicle body of the vehicle for performing supply of electric power to an electrical component and communication of various communication signals with the electrical component. The circuit body includes: a plurality of control boxes separately disposed on the circuit body and capable of controlling input and output of at least one of the electric power and the communication signal; a trunk line harness connecting one of the plurality of control boxes and another of the plurality of control boxes; and a branch line harness connecting the control box and the electrical component. At least one of the plurality of control boxes is grounded via the electrical component connected to the branch line harness.
    Type: Application
    Filed: November 21, 2018
    Publication date: June 6, 2019
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Publication number: 20190168695
    Abstract: A circuit body for a vehicle is wired on a vehicle body of the vehicle for performing supply of electric power to an electrical component and communication of various communication signals with the electrical component. The circuit body includes: a plurality of control boxes separately disposed on the circuit body and capable of controlling input and output of at least one of the electric power and the communication signal; a trunk line harness connecting one of the plurality of control boxes and another of the plurality of control boxes; and a branch line harness connecting the control box and the electrical component. The trunk line harness includes a power line for transmitting electric power and a communication line for transmitting communication signals in a separated state. An end portion of the power line and an end portion of the communication line are connected to the control box.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 6, 2019
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Publication number: 20190168693
    Abstract: A circuit body for a vehicle includes: a plurality of control boxes capable of controlling input and output of at least one of electric power and a communication signal; a trunk line harness connecting one of the plurality of control boxes and another of the plurality of control boxes; and a branch line harness connecting the control box and the electrical component. The control box includes: a trunk line connecting portion to which the trunk line harness is connected; and a branch line connecting portion to which the branch line harness is connected. At least one of the trunk line connecting portion and the branch line connecting portion includes a plurality of connectors which are classified into a plurality of groups according to an allowable current amount and in which a plurality of the connectors classified into the same group have connection compatibility.
    Type: Application
    Filed: November 21, 2018
    Publication date: June 6, 2019
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Publication number: 20190168698
    Abstract: A circuit body for a vehicle is wired on a vehicle body of the vehicle for performing supply of electric power to an electrical component and communication of various communication signals with the electrical component. The circuit body includes: a plurality of control boxes separately disposed on the circuit body and capable of controlling input and output of at least one of the electric power and the communication signal; a trunk line harness connecting one of the plurality of control boxes and another of the plurality of control boxes; and a branch line harness connecting the control box and the electrical component. The circuit body has a loop structure in which at least part of the plurality of control boxes are annularly connected via the trunk line harness.
    Type: Application
    Filed: November 21, 2018
    Publication date: June 6, 2019
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Publication number: 20190173240
    Abstract: An in-vehicle control system includes a power distribution box which supplies electric power to a downstream side, an in-vehicle device having one or more loads, and a connection cable which connects the power distribution box to the in-vehicle device disposed in the downstream side of the power distribution box. The power distribution box includes a host controller. At least one connector attached to the connection cable includes a connector control unit. The host controller acquires via the connection cable and holds connector identification information previously assigned to the connector control unit.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 6, 2019
    Inventors: Masashi Nakamura, Masahiro Furukawa, Satoshi Enomoto, Akiyoshi Kanazawa
  • Publication number: 20190164789
    Abstract: A semiconductor wafer to be treated is heated at a first preheating temperature ranging from 100 to 200° C. while a pressure in a chamber housing the semiconductor wafer is reduced to a pressure lower than an atmospheric pressure. After the semiconductor wafer is preheated to increase the temperature into a second preheating temperature ranging from 500 to 700° C. while the pressure in the chamber is restored to a pressure higher than the reduced pressure, a flash lamp emits a flashlight to a surface of the semiconductor wafer. Heating the semiconductor wafer at the first preheating temperature that is a relatively low temperature enables, for example, the moisture absorbed on the surface of the semiconductor wafer in trace amounts to be desorbed from the surface, and also enables the flash heating treatment to be performed with oxygen derived from such absorption removed as much as possible.
    Type: Application
    Filed: April 4, 2017
    Publication date: May 30, 2019
    Inventors: Takayuki AOYAMA, Shinichi KATO, Kazuhiko FUSE, Hikaru KAWARAZAKI, Masashi FURUKAWA, Hideaki TANIMURA, Akitsugu UEDA
  • Publication number: 20190109007
    Abstract: A metal film is deposited on a front surface of a semiconductor wafer of silicon. After the semiconductor wafer is received in a chamber, the pressure in the chamber is reduced to a pressure lower than atmospheric pressure. Thereafter, nitrogen gas is supplied into the chamber to return the pressure in the chamber to ordinary pressure, and the front surface of the semiconductor wafer is irradiated with a flash of light, so that a silicide that is a compound of the metal film and silicon is formed. The oxygen concentration in the chamber is significantly lowered during the formation of the silicide because the pressure in the chamber is reduced once to the pressure lower than atmospheric pressure and then returned to the ordinary pressure. This suppresses the increase in resistance of the silicide resulting from the entry of oxygen in the atmosphere in the chamber into defects near the interface between the metal film and a base material.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 11, 2019
    Inventors: Takayuki AOYAMA, Hikaru KAWARAZAKI, Masashi FURUKAWA, Kazuhiko FUSE, Hideaki TANIMURA, Shinichi KATO
  • Publication number: 20190084014
    Abstract: When a chamber of a heat treatment apparatus is opened for a purpose such as maintenance of the heat treatment apparatus, particles flow in large quantities into the chamber together with an outside atmosphere. After maintenance work is finished, an enclosed space is formed in the chamber and gas in the chamber is exhausted to place the interior of the chamber in a reduced-pressure atmosphere. While the interior of the chamber is in the reduced-pressure atmosphere, the interior of the chamber is irradiated with a flash of light emitted multiple times from a flash lamp to cause momentary gas expansion and subsequent gas shrinkage repeatedly, thereby causing particles adhering in the chamber to fly. The flying particles are discharged from the chamber to remove the particles.
    Type: Application
    Filed: July 20, 2018
    Publication date: March 21, 2019
    Inventor: Masashi FURUKAWA
  • Publication number: 20190088513
    Abstract: A semiconductor wafer held by a susceptor in a chamber is irradiated with halogen light radiated from a plurality of halogen lamps to be heated. A stainless steel block having an opening in a cylindrical shape is provided between the chamber and the halogen lamps. This reduces a distance from a light emitting portion in a light source region in which the plurality of halogen lamps is arranged, throughout the entire circumference of the opening in a cylindrical shape, so that the amount of reflected light from the inner wall surface of the opening toward the peripheral portion of the semiconductor wafer becomes uniform. This causes a uniform increase in illuminance of the peripheral portion of the semiconductor wafer, where temperature tends to decrease, at the time of light irradiation from the halogen lamps, so that in-plane temperature distribution of the semiconductor wafer can be made uniform.
    Type: Application
    Filed: August 6, 2018
    Publication date: March 21, 2019
    Inventors: Masashi FURUKAWA, Yoshio ITO
  • Publication number: 20190027385
    Abstract: Over a front surface of a silicon semiconductor wafer is deposited a high dielectric constant film with a silicon oxide film, serving as an interface layer, provided between the semiconductor wafer and the high dielectric constant film. After a chamber houses the semiconductor wafer, a chamber's pressure is reduced to be lower than atmospheric pressure. Subsequently, a gaseous mixture of ammonia and nitrogen gas is supplied into the chamber to return the pressure to ordinary pressure, and the front surface is irradiated with a flash light, thereby performing post deposition annealing (PDA) on the high dielectric constant film. Since the pressure is reduced once to be lower than atmospheric pressure and then returned to ordinary pressure, a chamber's oxygen concentration is lowered remarkably during the PDA. This restricts an increase in thickness of the silicon oxide film underlying the high dielectric constant film by oxygen taken in during the PDA.
    Type: Application
    Filed: September 27, 2018
    Publication date: January 24, 2019
    Inventors: Takayuki AOYAMA, Hikaru KAWARAZAKI, Masashi FURUKAWA, Shinichi KATO, Kazuhiko FUSE, Hideaki TANIMURA