Abstract: The present invention relates to a non-human transgenic mammal which has had an HLA-A24 gene introduced and in which CTLs are induced when stimulated by an HLA-A24-binding antigen, a method of screening therapeutic or preventive agents for tumors or virus infections comprising administering a test substance to said transgenic non-human mammal and assaying and evaluating whether CTLs specific for the test substance are induced, an HLA-A24-binding tumor antigen peptide of PSA origin selected by said screening method, a chimera DNA (DNA construct) useful in the generation of said non-human transgenic mammal, a host cell transformed by said chimera gene and use thereof, and the like.

Abstract: An image obtainer, a distance detector, a computer, and an information provider are provided to a vehicle. The computer has a caution-determination function to determine whether caution is required with respect to objects existing around the vehicle by arithmetically processing image data and distance data, and an information providing function to output an instruction to provide information to the occupants of the vehicle by the information provider when it is determined that caution is required. A reference axis for obtaining image is positioned at the center of a range of obtaining the image data by the image obtainer, and a reference axis for detecting distance is positioned at the center of a range of detecting the distance data by the distance detector. The image obtainer and the distance detector are arranged such that the reference axes are coaxially aligned.

Abstract: An obstacle detecting means for detecting data related to the position of an obstacle existing on the side of a vehicle or in front thereof, a computer for computing the detected data, and an alarming means are mounted in the vehicle. The computer includes: a function of setting an alarming area having a certain distance from the side part of the vehicle and a forwardly extended line of the side part, in an outward direction lateral to the side part; a function of tracking the obstacle based on the obstacle data; a function of calculating a traveling locus of the obstacle relative to the vehicle and predicting the traveling locus thereafter; a function of determining whether the traveling locus enters into the alarming area; and a function of generating an alarm to the occupants by the alarming means when the traveling locus is determined to enter into the alarming area.

Abstract: A water treatment apparatus including a mixing bath having an open portion where a carbonic acid gas intermixed with water to be treated by the water treatment apparatus and dissolved oxygen excluded from the water to be treated are discharged. The water treatment apparatus also includes water storage tank separate from the mixing bath and in which treated water from the mixing bath is stored.

Abstract: A circuit board for mounting a part having a plurality of bumps by ultrasonic bonding. The circuit board includes a main body and a conductive layer provided on the main body. The conductive layer has a conductive pattern having at least one bonding area configured to correspond to the plurality of bumps of the part. The conductive layer has an isolated notch part located proximate the at least one bonding area.

Abstract: In the case where an electrode conductor is formed on a principal plane of an element 10, a method including a step of forming an electrode conductor section 13 composed of a conductor pattern having a photosensitive conductive paste exposed and developed on the principal plane, and a step of forming an electrode conductor section 11 of a non-photosensitive conductive paste, wherein both electrode conductor sections 11, 13 are disposed on the surface of the element 10 so as to be at least partly contacted or overlapped with each other.

Abstract: In the case where an electrode conductor is formed on a principal plane of an element 10, a method including a step of forming an electrode conductor section 13 composed of a conductor pattern having a photosensitive conductive paste exposed and developed on the principal plane, and a step of forming an electrode conductor section 11 of a non-photosensitive conductive paste, wherein both electrode conductor sections 11, 13 are disposed on the surface of the element 10 so as to be at least partly contacted or overlapped with each other.

Abstract: When connecting electrodes of a chip device CP are ultrasonic-bonded to circuit electrodes provided for a resin substrate 10 to mount the chip device CP on the resin substrate 10, a heater 5 for heating the resin substrate 10 is provided with which the temperature of the resin substrate 10 is raised to a level with which the ratio of elastic modulus &egr;h realized when heat is supplied with respect to elastic modulus &egr;r of the resin substrate 10 at room temperature satisfies 1>&egr;h/&egr;r≧0.5. The heater 5 may be provided for the substrate retaining frame 4.

Abstract: An electronic component including a dielectric block a first electrode conductor section having an exposed and developed photosensitive conductive paste on a principal surface of the dielectric block, and an inner peripheral electrode conductor section formed of a non-photosensitive conductive paste on an inner peripheral face of a through hole that is opened through the principal surface. Further, both electrode conductor sections are overlapped at least partly near an opening portion of the through hole on the principal plane to electrically conduct to make up of dielectric filter.

Abstract: A plurality of resonators 50 are formed in a dielectric porcelain block 42, wherein each of the resonators 50 is formed by coating an interior surface of a through section with an interior conductor 54, thus constituting a dielectric filter 41. On a side surface 44 of the dielectric block 42 perpendicular to an open end face 43 having the through sections formed therein, there are formed protrusions 45 having a height L lower than that of the through sections. Terminal electrodes 60a and 60b are defined with the protrusions 45 taken as a boundary between the terminal electrodes 60a and 60b, and isolated from an exterior conductor 62.

Abstract: When connecting electrodes of a chip device CP are ultrasonic-bonded to circuit electrodes provided for a resin substrate 10 to mount the chip device CP on the resin substrate 10, a heater 5 for heating the resin substrate 10 is provided with which the temperature of the resin substrate 10 is raised to a level with which the ratio of elastic modulus &egr;h realized when heat is supplied with respect to elastic modulus &egr;r of the resin substrate 10 at room temperature satisfies 1>&egr;h/&egr;r≧0.5. The heater 5 may be provided for the substrate retaining frame 4.

Abstract: A production method of an electronic part comprising a step o working a substrate having formed thereon a metal thin-film conductor using water, wherein said water satisfies the relations 3.5≦pH≦6.5 and DO≦0.5 pH2−6.5 pH+22 [wherein DO represents a dissolved oxygen amount (unit ppm)].

Abstract: A production method of an electronic part comprising a step o working a substrate having formed thereon a metal thin-film conductor using water, wherein said water satisfies the relations 3.5≦pH≦6.5 and DO≦0.5 pH2−6.5 pH+22 [wherein DO represents a dissolved oxygen amount (unit ppm)]. By using the water in the case of working substrates in the production steps of electronic parts, the generations of the static electricity and the oxidation caused by water used for working are restrained. The present invention is particularly effective in working of an electronic part wherein a metal thin-film conductor containing at least two kinds of metals including Al on a substrate having a pyroelectric property.

Abstract: When connecting electrodes of a chip device CP are ultrasonic-bonded to circuit electrodes provided for a resin substrate 10 to mount the chip device CP on the resin substrate 10, a heater 5 for heating the resin substrate 10 is provided with which the temperature of the resin substrate 10 is raised to a level with which the ratio of elastic modulus &egr;h realized when heat is supplied with respect to elastic modulus &egr;r of the resin substrate 10 at room temperature satisfies 1>&egr;h/&egr;r≧0.5. The heater 5 may be provided for the substrate retaining frame 4.

Abstract: In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to be put on at least a part of the main mounting surface 21a so as to remain edge portions which do not cover at least a part of the electrode pattern 25, and a protection layer 32 for protecting the main mounting surface is further provided at a distance from the main mounting surface 21a so as to be put on the electrically insulating layer 31, so that the bump electrodes 22 are connected to the electrode pattern 25 while being in contact with the edge portions of the electrically insulating layer 31 and the protection layer 32.

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.

Abstract: An electronic part in which a chip 2 having bump electrodes is sealed in a cavity 14 of a resin container 10, wherein the resin container having: a mounting board 1 having a conductor pattern 4 for bump-mounting the chip 2; an intermediate board 5 overlaid on the mounting board 1 and having a window for forming an inner wall apart from the chip 2 for predetermined distances; a cover board overlaid on the intermediate board 5 to cover the window; a first adhesive layer 8 which is interposed between overlaid portions of the mounting board 1 and the intermediate board 5; and a second adhesive layer 9 which is interposed between overlaid portion of the intermediate board 5 and the cover board 7, wherein the first and second adhesive layers 8 and 9 between which the intermediate board 5 is interposed are heated and pressed at a time in a direction of the thickness of each of the mounting board 1 and the cover board 7, and the mounting board 1, the intermediate board 5 and the cover board 7 are brought into intimat

Abstract: A plurality of resonators 50 are formed in a dielectric porcelain block 42, wherein each of the resonators 50 is formed by coating an interior surface of a through section with an interior conductor 54, thus constituting a dielectric filter 41. On a side surface 44 of the dielectric block 42 perpendicular to an open end face 43 having the through sections formed therein, there are formed protrusions 45 having a height L lower than that of the through sections. Terminal electrodes 60a and 60b are defined with the protrusions 45 taken as a boundary between the terminal electrodes 60a and 60b, and isolated. from an exterior' conductor 62.

Abstract: An electronic part in which a chip 2 having bump electrodes is sealed in a cavity 14 of a resin container 10, wherein the resin container having: a mounting board 1 having a conductor pattern 4 for bump-mounting the chip 2; an intermediate board 5 overlaid on the mounting board 1 and having a window for forming an inner wall apart from the chip 2 for predetermined distances; a cover board overlaid on the intermediate board 5 to cover the window; a first adhesive layer 8 which is interposed between overlaid portions of the mounting board 1 and the intermediate board 5; and a second adhesive layer 9 which is interposed between overlaid portion of the intermediate board 5 and the cover board 7, wherein the first and second adhesive layers 8 and 9 between which the intermediate board 5 is interposed are heated and pressed at a time in a direction of the thickness of each of the mounting board 1 and the cover board 7, and the mounting board 1, the intermediate board 5 and the cover board 7 are brought into intimat

Abstract: In the case where an electrode conductor is formed on a principal plane of an element 10, a method including a step of forming an electrode conductor section 13 composed of a conductor pattern having a photosensitive conductive paste exposed and developed on the principal plane, and a step of forming an electrode conductor section 11 of a non-photosensitive conductive paste, wherein both electrode conductor sections 11, 13 are disposed on the surface of the element 10 so as to be at least partly contacted or overlapped with each other.