Patents by Inventor Masashi Hayakawa

Masashi Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230308122
    Abstract: A radio-frequency module includes a mounting board, a plurality of electronic components (for example, first matching circuits, filters, and second matching circuits, and a plurality of external connection terminals. The plurality of external connection terminals include a first external connection terminal. The mounting board has a first region and a second region. A gap is formed between the first region and the second region at a second major surface. The first external connection terminal is surrounded by an edge of the mounting board and the gap when viewed in plan view in a thickness direction of the mounting board.
    Type: Application
    Filed: May 19, 2023
    Publication date: September 28, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Masashi HAYAKAWA
  • Publication number: 20230280676
    Abstract: A developing device includes a developer cartridge and a developing unit. The developer cartridge, in some instances, may include a shutter. This shutter may have a wall for closing a developer supply hole, and be movable, with respect to a developer cartridge casing, between an open position where the supply hole is opened by the wall and a closed position where the supply hole is closed by the wall. The shutter may further include a protrusion that is movable with respect to the wall of the shutter between a first position and a second position in an axial direction. The protrusion, in the first position, is engageable with a developing unit and, in the second position, would be disengaged from the developing unit.
    Type: Application
    Filed: May 11, 2023
    Publication date: September 7, 2023
    Inventors: Masahiko Hayakawa, Masashi Imai, Shougo Sato
  • Patent number: 11509344
    Abstract: A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: November 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masashi Hayakawa
  • Patent number: 11502305
    Abstract: To provide a titanium-based porous body that has high void fraction to ensure gas permeability and water permeability for practical use as an electrode and a filter, has a large specific surface area to ensure conductivity and sufficient reaction sites with a reaction solution or a reaction gas, thus showing excellent reaction efficiency, and contains less contaminants because of no organic substance used. A titanium-based porous body having a specific void fraction and a high specific surface area is obtained by filling an irregular-shaped titanium powder having an average particle size of 10 to 50 ?m in a dry system without using any binder or the like into a thickness of 4.0×10?1 to 1.6 mm, and sintering the irregular-shaped titanium powder at 800 to 1100° C.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: November 15, 2022
    Assignee: TOHO TITANIUM CO., LTD.
    Inventors: Masashi Hayakawa, Syogo Tsumagari
  • Patent number: 11456761
    Abstract: Provided is a radio-frequency module that includes a module substrate having first and second main surfaces on opposite sides of the module substrate, a resin member that covers the second main surface and includes a first groove and the second groove, a plurality of post electrodes that include a first post electrode and the second post electrode, that are arranged on the second main surface, and that penetrate through the resin member, and a semiconductor component that is arranged between the first post electrode and the second post electrode on the second main surface and that includes a surface that is not covered by the resin member. The first groove is arranged between the first post electrode and the semiconductor component. The second groove is arranged between the second post electrode and the semiconductor component.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: September 27, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masashi Hayakawa
  • Publication number: 20220274167
    Abstract: A method for producing a metallic green compact 61 relates to a method for producing the green compact 61 having at least one recess 62, including a step of subjecting a raw material powder filled in a resin mold 1 to cold isostatic pressing while placing a resin core material 11 having a shape corresponding to the recess 62 at a position corresponding to the recess 62 in the resin mold 1.
    Type: Application
    Filed: September 24, 2020
    Publication date: September 1, 2022
    Inventors: Masahiro Morita, Masashi Hayakawa, Yosuke Inoue, Hideki Fujii
  • Patent number: 11336278
    Abstract: In a switching circuit, an inductance of an inductor of a shunt circuit is such that off capacitance of a second switching device that is in the off state when a first switching device is in the on state is used to define, in the shunt circuit, a series resonance circuit with a desired resonant frequency. Therefore, the frequency of an unnecessary signal to be attenuated is set to the resonant frequency of the series resonance circuit. Thus, the switching circuit achieves improved isolation characteristics with other circuits by attenuating the unnecessary signal.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: May 17, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masashi Hayakawa
  • Patent number: 11330749
    Abstract: A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 10, 2022
    Assignee: FUJI CORPORATION
    Inventor: Masashi Hayakawa
  • Publication number: 20220038131
    Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
    Type: Application
    Filed: October 14, 2021
    Publication date: February 3, 2022
    Inventor: Masashi HAYAKAWA
  • Publication number: 20210384927
    Abstract: Provided is a radio-frequency module that includes a module substrate having first and second main surfaces on opposite sides of the module substrate, a resin member that covers the second main surface and includes a first groove and the second groove, a plurality of post electrodes that include a first post electrode and the second post electrode, that are arranged on the second main surface, and that penetrate through the resin member, and a semiconductor component that is arranged between the first post electrode and the second post electrode on the second main surface and that includes a surface that is not covered by the resin member. The first groove is arranged between the first post electrode and the semiconductor component. The second groove is arranged between the second post electrode and the semiconductor component.
    Type: Application
    Filed: April 28, 2021
    Publication date: December 9, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Masashi HAYAKAWA
  • Publication number: 20210376873
    Abstract: A radio frequency module includes a signal input terminal, a signal output terminal, a low noise amplifier configured to amplify a radio frequency reception signal input from the signal input terminal, and a first filter connected between an output terminal of the low noise amplifier and the signal output terminal and having a pass band including a frequency of the radio frequency reception signal.
    Type: Application
    Filed: April 5, 2021
    Publication date: December 2, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Masashi HAYAKAWA
  • Patent number: 11177850
    Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: November 16, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masashi Hayakawa
  • Publication number: 20210306024
    Abstract: A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 30, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Masashi HAYAKAWA
  • Patent number: 10966358
    Abstract: A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: March 30, 2021
    Assignee: FUJI CORPORATION
    Inventors: Shigeto Oyama, Toshiya Ito, Toshinori Shimizu, Masaki Murai, Masashi Hayakawa, Satoshi Shioya, Toshihiko Yamasaki
  • Publication number: 20210066723
    Abstract: To provide a titanium-based porous body that has high void fraction to ensure gas permeability and water permeability for practical use as an electrode and a filter, has a large specific surface area to ensure conductivity and sufficient reaction sites with a reaction solution or a reaction gas, thus showing excellent reaction efficiency, and contains less contaminants because of no organic substance used. A titanium-based porous body having a specific void fraction and a high specific surface area is obtained by filling an irregular-shaped titanium powder having an average particle size of 10 to 50 ?m in a dry system without using any binder or the like into a thickness of 4.0×10?1 to 1.6 mm, and sintering the irregular-shaped titanium powder at 800 to 1100° C.
    Type: Application
    Filed: March 19, 2018
    Publication date: March 4, 2021
    Applicant: TOHO TITANIUM CO., LTD.
    Inventors: Masashi HAYAKAWA, Syogo TSUMAGARI
  • Publication number: 20210007255
    Abstract: A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.
    Type: Application
    Filed: March 23, 2018
    Publication date: January 7, 2021
    Applicant: FUJI CORPORATION
    Inventor: Masashi HAYAKAWA
  • Patent number: 10879096
    Abstract: A die component supply device includes a wafer holding section; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, which is a pickup target of the suction nozzle, together with the surrounding condition, before being picked up to obtain component image data; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: December 29, 2020
    Assignee: FUJI CORPORATION
    Inventor: Masashi Hayakawa
  • Publication number: 20200235773
    Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
    Type: Application
    Filed: April 2, 2020
    Publication date: July 23, 2020
    Inventor: Masashi Hayakawa
  • Patent number: 10651884
    Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: May 12, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masashi Hayakawa
  • Publication number: 20190355602
    Abstract: A die component supply device includes a wafer holding section; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, which is a pickup target of the suction nozzle, together with the surrounding condition, before being picked up to obtain component image data; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data.
    Type: Application
    Filed: December 6, 2016
    Publication date: November 21, 2019
    Applicant: FUJI CORPORATION
    Inventor: Masashi HAYAKAWA