Patents by Inventor Masashi Hayakawa
Masashi Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240309967Abstract: A valve device 11 comprising: a valve main body 12 having a valve chamber 13 in an interior thereof; a valve body 21 that has flow path space 22 in an interior thereof and that is rotationally driven in the valve chamber and changes a flow quantity of a fluid; a first flow path hole 14 that is formed in the valve main body and that communicates with the flow path space and allows the passage of the fluid; a second flow path hole 15 that is formed in the valve main body, whose communication state with the flow path space is changed via the rotational displacement position of the valve body, and that allows the passage of the fluid when communicating with the flow path space; and a transmission mechanism including a valve body driving shaft 31 that transmits, to the valve body, driving force for rotating the valve body. The rotation axis of the valve body and the rotation axis of the valve body driving shaft are orthogonal with each other.Type: ApplicationFiled: May 18, 2022Publication date: September 19, 2024Inventors: Takeshi KANNOO, Takao HARADA, Masashi YAMASHITA, Junya HAYAKAWA
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Patent number: 12083894Abstract: A hybrid drive device including a rotary electric machine having a stator and a rotor, a transmission coupled to the rotary electric machine, a clutch that couples an engine and the rotary electric machine and that releases a connection of the two, and a case for housing the rotary electric machine and the clutch, the hybrid drive device including: a first transmitting shaft coupled to an output shaft of the engine; a second transmitting shaft that transmits power from the rotor of the rotary electric machine to the transmission; and a rotor support member that supports the rotor of the rotary electric machine.Type: GrantFiled: January 8, 2020Date of Patent: September 10, 2024Assignees: AISIN CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takeru Morita, Yuhi Hayakawa, Akinori Ozawa, Kenji Dozono, Masashi Ikemura
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Publication number: 20240241078Abstract: An ion sensor includes an ion detection element, a reference electrode that provides a reference point of a potential, and a solution in which an ion concentration can be changed in a sensing area of the ion detection element. The sensing area of the ion detection element is disposed in the solution. A method for detecting a target substance employs an ion sensor. The target substance bound to a label having a function of changing the amount of ions detectable by the ion sensor is introduced into the solution, and a change in the amount of ions is detected using the ion sensor.Type: ApplicationFiled: March 13, 2024Publication date: July 18, 2024Inventors: Kazuhisa NAKAGAWA, Yuhei Shimizu, Daisuke Kobayashi, Masashi Suzuki, Akira Nukazuka, Teppei Sakai, Kei Hayakawa, Kazuhiko Kano, Mana Asano
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Publication number: 20240230559Abstract: An X-ray imaging apparatus according to this invention includes an X-ray irradiator, an X-ray detector and a subject holding mechanism; the subject holding mechanism includes a subject grasping mechanism including a pair of graspers and a holder, and a rotation mechanism configured to rotate the subject grasping mechanism; the holder includes a first fixed position adjuster and a second fixed position adjuster; and one of the pair of graspers is fixed to the holder at a position that is adjusted by the first fixed position adjuster, and the another of the pair of graspers is fixed to the holder at a position that is adjusted by the second fixed position adjuster.Type: ApplicationFiled: October 30, 2023Publication date: July 11, 2024Applicant: Shimadzu CorporationInventor: Masashi HAYAKAWA
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Patent number: 11956003Abstract: A radio frequency module includes a signal input terminal, a signal output terminal, a low noise amplifier configured to amplify a radio frequency reception signal input from the signal input terminal, and a first filter connected between an output terminal of the low noise amplifier and the signal output terminal and having a pass band including a frequency of the radio frequency reception signal.Type: GrantFiled: April 5, 2021Date of Patent: April 9, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Hayakawa
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Publication number: 20230401688Abstract: A defect inspection apparatus (100) includes an imager (image sensor 35) configured to image an inspection target 7, and a display (6) configured to display an image based on an image captured by the imager. The defect inspection apparatus (100) also includes a controller (4) configured or programmed to receive a setting of a marking (64) in a predetermined region of interest (S) on the image (still image 61) displayed on the display (6). The controller (4) is configured or programmed to inspect the inspection target (7) for a defect based on the image captured by the imager, and superimpose an image of the marking (64) on a position corresponding to the predetermined region of interest (S) in an image of an inspection result (overlay image 65) displayed on the display (6).Type: ApplicationFiled: September 15, 2021Publication date: December 14, 2023Inventors: Naoto MISHINA, Hirofumi OKAMOTO, Takashi TANAKA, Satoru SUGIMOTO, Masashi HAYAKAWA, Takahide HATAHORI, Hiroshi HORIKAWA
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Publication number: 20230308122Abstract: A radio-frequency module includes a mounting board, a plurality of electronic components (for example, first matching circuits, filters, and second matching circuits, and a plurality of external connection terminals. The plurality of external connection terminals include a first external connection terminal. The mounting board has a first region and a second region. A gap is formed between the first region and the second region at a second major surface. The first external connection terminal is surrounded by an edge of the mounting board and the gap when viewed in plan view in a thickness direction of the mounting board.Type: ApplicationFiled: May 19, 2023Publication date: September 28, 2023Applicant: Murata Manufacturing Co., Ltd.Inventor: Masashi HAYAKAWA
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Patent number: 11770153Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.Type: GrantFiled: October 14, 2021Date of Patent: September 26, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Hayakawa
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Patent number: 11509344Abstract: A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.Type: GrantFiled: March 23, 2021Date of Patent: November 22, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Hayakawa
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Patent number: 11502305Abstract: To provide a titanium-based porous body that has high void fraction to ensure gas permeability and water permeability for practical use as an electrode and a filter, has a large specific surface area to ensure conductivity and sufficient reaction sites with a reaction solution or a reaction gas, thus showing excellent reaction efficiency, and contains less contaminants because of no organic substance used. A titanium-based porous body having a specific void fraction and a high specific surface area is obtained by filling an irregular-shaped titanium powder having an average particle size of 10 to 50 ?m in a dry system without using any binder or the like into a thickness of 4.0×10?1 to 1.6 mm, and sintering the irregular-shaped titanium powder at 800 to 1100° C.Type: GrantFiled: March 19, 2018Date of Patent: November 15, 2022Assignee: TOHO TITANIUM CO., LTD.Inventors: Masashi Hayakawa, Syogo Tsumagari
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Patent number: 11456761Abstract: Provided is a radio-frequency module that includes a module substrate having first and second main surfaces on opposite sides of the module substrate, a resin member that covers the second main surface and includes a first groove and the second groove, a plurality of post electrodes that include a first post electrode and the second post electrode, that are arranged on the second main surface, and that penetrate through the resin member, and a semiconductor component that is arranged between the first post electrode and the second post electrode on the second main surface and that includes a surface that is not covered by the resin member. The first groove is arranged between the first post electrode and the semiconductor component. The second groove is arranged between the second post electrode and the semiconductor component.Type: GrantFiled: April 28, 2021Date of Patent: September 27, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Hayakawa
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Publication number: 20220274167Abstract: A method for producing a metallic green compact 61 relates to a method for producing the green compact 61 having at least one recess 62, including a step of subjecting a raw material powder filled in a resin mold 1 to cold isostatic pressing while placing a resin core material 11 having a shape corresponding to the recess 62 at a position corresponding to the recess 62 in the resin mold 1.Type: ApplicationFiled: September 24, 2020Publication date: September 1, 2022Inventors: Masahiro Morita, Masashi Hayakawa, Yosuke Inoue, Hideki Fujii
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Patent number: 11336278Abstract: In a switching circuit, an inductance of an inductor of a shunt circuit is such that off capacitance of a second switching device that is in the off state when a first switching device is in the on state is used to define, in the shunt circuit, a series resonance circuit with a desired resonant frequency. Therefore, the frequency of an unnecessary signal to be attenuated is set to the resonant frequency of the series resonance circuit. Thus, the switching circuit achieves improved isolation characteristics with other circuits by attenuating the unnecessary signal.Type: GrantFiled: July 13, 2017Date of Patent: May 17, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Hayakawa
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Patent number: 11330749Abstract: A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.Type: GrantFiled: March 23, 2018Date of Patent: May 10, 2022Assignee: FUJI CORPORATIONInventor: Masashi Hayakawa
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Publication number: 20220038131Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.Type: ApplicationFiled: October 14, 2021Publication date: February 3, 2022Inventor: Masashi HAYAKAWA
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Publication number: 20210384927Abstract: Provided is a radio-frequency module that includes a module substrate having first and second main surfaces on opposite sides of the module substrate, a resin member that covers the second main surface and includes a first groove and the second groove, a plurality of post electrodes that include a first post electrode and the second post electrode, that are arranged on the second main surface, and that penetrate through the resin member, and a semiconductor component that is arranged between the first post electrode and the second post electrode on the second main surface and that includes a surface that is not covered by the resin member. The first groove is arranged between the first post electrode and the semiconductor component. The second groove is arranged between the second post electrode and the semiconductor component.Type: ApplicationFiled: April 28, 2021Publication date: December 9, 2021Applicant: Murata Manufacturing Co., Ltd.Inventor: Masashi HAYAKAWA
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Publication number: 20210376873Abstract: A radio frequency module includes a signal input terminal, a signal output terminal, a low noise amplifier configured to amplify a radio frequency reception signal input from the signal input terminal, and a first filter connected between an output terminal of the low noise amplifier and the signal output terminal and having a pass band including a frequency of the radio frequency reception signal.Type: ApplicationFiled: April 5, 2021Publication date: December 2, 2021Applicant: Murata Manufacturing Co., Ltd.Inventor: Masashi HAYAKAWA
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Patent number: 11177850Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.Type: GrantFiled: April 2, 2020Date of Patent: November 16, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Hayakawa
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Publication number: 20210306024Abstract: A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.Type: ApplicationFiled: March 23, 2021Publication date: September 30, 2021Applicant: Murata Manufacturing Co., Ltd.Inventor: Masashi HAYAKAWA
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Patent number: 10966358Abstract: A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.Type: GrantFiled: July 18, 2014Date of Patent: March 30, 2021Assignee: FUJI CORPORATIONInventors: Shigeto Oyama, Toshiya Ito, Toshinori Shimizu, Masaki Murai, Masashi Hayakawa, Satoshi Shioya, Toshihiko Yamasaki