Abstract: A radio frequency module includes a signal input terminal, a signal output terminal, a low noise amplifier configured to amplify a radio frequency reception signal input from the signal input terminal, and a first filter connected between an output terminal of the low noise amplifier and the signal output terminal and having a pass band including a frequency of the radio frequency reception signal.

Abstract: A defect inspection apparatus (100) includes an imager (image sensor 35) configured to image an inspection target 7, and a display (6) configured to display an image based on an image captured by the imager. The defect inspection apparatus (100) also includes a controller (4) configured or programmed to receive a setting of a marking (64) in a predetermined region of interest (S) on the image (still image 61) displayed on the display (6). The controller (4) is configured or programmed to inspect the inspection target (7) for a defect based on the image captured by the imager, and superimpose an image of the marking (64) on a position corresponding to the predetermined region of interest (S) in an image of an inspection result (overlay image 65) displayed on the display (6).

Abstract: A radio-frequency module includes a mounting board, a plurality of electronic components (for example, first matching circuits, filters, and second matching circuits, and a plurality of external connection terminals. The plurality of external connection terminals include a first external connection terminal. The mounting board has a first region and a second region. A gap is formed between the first region and the second region at a second major surface. The first external connection terminal is surrounded by an edge of the mounting board and the gap when viewed in plan view in a thickness direction of the mounting board.

Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.

Abstract: A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.

Abstract: To provide a titanium-based porous body that has high void fraction to ensure gas permeability and water permeability for practical use as an electrode and a filter, has a large specific surface area to ensure conductivity and sufficient reaction sites with a reaction solution or a reaction gas, thus showing excellent reaction efficiency, and contains less contaminants because of no organic substance used. A titanium-based porous body having a specific void fraction and a high specific surface area is obtained by filling an irregular-shaped titanium powder having an average particle size of 10 to 50 ?m in a dry system without using any binder or the like into a thickness of 4.0×10?1 to 1.6 mm, and sintering the irregular-shaped titanium powder at 800 to 1100° C.

Abstract: Provided is a radio-frequency module that includes a module substrate having first and second main surfaces on opposite sides of the module substrate, a resin member that covers the second main surface and includes a first groove and the second groove, a plurality of post electrodes that include a first post electrode and the second post electrode, that are arranged on the second main surface, and that penetrate through the resin member, and a semiconductor component that is arranged between the first post electrode and the second post electrode on the second main surface and that includes a surface that is not covered by the resin member. The first groove is arranged between the first post electrode and the semiconductor component. The second groove is arranged between the second post electrode and the semiconductor component.

Abstract: A method for producing a metallic green compact 61 relates to a method for producing the green compact 61 having at least one recess 62, including a step of subjecting a raw material powder filled in a resin mold 1 to cold isostatic pressing while placing a resin core material 11 having a shape corresponding to the recess 62 at a position corresponding to the recess 62 in the resin mold 1.

Abstract: In a switching circuit, an inductance of an inductor of a shunt circuit is such that off capacitance of a second switching device that is in the off state when a first switching device is in the on state is used to define, in the shunt circuit, a series resonance circuit with a desired resonant frequency. Therefore, the frequency of an unnecessary signal to be attenuated is set to the resonant frequency of the series resonance circuit. Thus, the switching circuit achieves improved isolation characteristics with other circuits by attenuating the unnecessary signal.

Abstract: A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.

Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.

Abstract: Provided is a radio-frequency module that includes a module substrate having first and second main surfaces on opposite sides of the module substrate, a resin member that covers the second main surface and includes a first groove and the second groove, a plurality of post electrodes that include a first post electrode and the second post electrode, that are arranged on the second main surface, and that penetrate through the resin member, and a semiconductor component that is arranged between the first post electrode and the second post electrode on the second main surface and that includes a surface that is not covered by the resin member. The first groove is arranged between the first post electrode and the semiconductor component. The second groove is arranged between the second post electrode and the semiconductor component.

Abstract: A radio frequency module includes a signal input terminal, a signal output terminal, a low noise amplifier configured to amplify a radio frequency reception signal input from the signal input terminal, and a first filter connected between an output terminal of the low noise amplifier and the signal output terminal and having a pass band including a frequency of the radio frequency reception signal.

Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.

Abstract: A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.

Abstract: A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.

Abstract: To provide a titanium-based porous body that has high void fraction to ensure gas permeability and water permeability for practical use as an electrode and a filter, has a large specific surface area to ensure conductivity and sufficient reaction sites with a reaction solution or a reaction gas, thus showing excellent reaction efficiency, and contains less contaminants because of no organic substance used. A titanium-based porous body having a specific void fraction and a high specific surface area is obtained by filling an irregular-shaped titanium powder having an average particle size of 10 to 50 ?m in a dry system without using any binder or the like into a thickness of 4.0×10?1 to 1.6 mm, and sintering the irregular-shaped titanium powder at 800 to 1100° C.

Abstract: A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.

Abstract: A die component supply device includes a wafer holding section; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, which is a pickup target of the suction nozzle, together with the surrounding condition, before being picked up to obtain component image data; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data.

Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.