Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.

Abstract: A die component supply device includes a wafer holding section; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, which is a pickup target of the suction nozzle, together with the surrounding condition, before being picked up to obtain component image data; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data.

Abstract: A high-frequency module includes a directivity switching switch unit that switches an end portion of a first sub line, which is connected to an output terminal, and first and second resistor switching switch units that switch first and second termination resistors which are connected to the first sub line. The directivity of coupled output in the first sub line of a first directional coupler is able to be switched and detection accuracy of a high-frequency signal is able to be improved by improving isolation characteristics of the first directional coupler to improve the directivity.

Abstract: A high-frequency module includes a directivity switching switch unit that switches an end portion of a first sub line, which is connected to an output terminal, and first and second resistor switching switch units that switch first and second termination resistors which are connected to the first sub line. The directivity of coupled output in the first sub line of a first directional coupler is able to be switched and detection accuracy of a high-frequency signal is able to be improved by improving isolation characteristics of the first directional coupler to improve the directivity.

Abstract: A circuit module includes a multilayer substrate including built-in capacitors and external components mounted on the surface of the multilayer substrate. On the surface of a dielectric layer, an auxiliary electrode is provided. The auxiliary electrode is electrically connected to a capacitor electrode via a via electrode passing through the dielectric layer. On the surface of a dielectric layer, a capacitor electrode is arranged so as to face the capacitor electrode and the auxiliary electrode connected to the capacitor electrode. The auxiliary electrode is arranged in an area in which the capacitor electrodes overlap each other as viewed from a lamination direction.

Abstract: A high-frequency module includes a directivity switching switch unit that switches an end portion of a first sub line, which is connected to an output terminal, and first and second resistor switching switch units that switch first and second termination resistors which are connected to the first sub line. The directivity of coupled output in the first sub line of a first directional coupler is able to be switched and detection accuracy of a high-frequency signal is able to be improved by improving isolation characteristics of the first directional coupler to improve the directivity.

Abstract: A switch module selects one of a CA mode in which first and second frequency bands are used simultaneously and a non-CA mode in which only one of the first and second frequency bands is used. The switch module includes a first signal path propagating the first frequency band therethrough, a second signal path propagating the second frequency band therethrough, a third signal path simultaneously propagating the first and second frequency bands therethrough, a switch circuit, and a variable adjuster. The switch circuit switches the connection between an antenna device and one of the three signal paths. The variable adjuster adjusts a variable matching circuit for the third signal path when the non-CA mode is selected or adjusts a variable matching circuit for the first signal path or that for the second signal path when the CA mode is selected.

Abstract: A high-frequency module includes a directivity switching switch unit that switches an end portion of a first sub line, which is connected to an output terminal, and first and second resistor switching switch units that switch first and second termination resistors which are connected to the first sub line. The directivity of coupled output in the first sub line of a first directional coupler is able to be switched and detection accuracy of a high-frequency signal is able to be improved by improving isolation characteristics of the first directional coupler to improve the directivity.

Abstract: In a switching circuit, an inductance of an inductor of a shunt circuit is such that off capacitance of a second switching device that is in the off state when a first switching device is in the on state is used to define, in the shunt circuit, a series resonance circuit with a desired resonant frequency. Therefore, the frequency of an unnecessary signal to be attenuated is set to the resonant frequency of the series resonance circuit. Thus, the switching circuit achieves improved isolation characteristics with other circuits by attenuating the unnecessary signal.

Abstract: A component mounting device includes a heater unit which heats a range which is narrower than a movement range of a head which is a partial range of a board using a heater, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.

Abstract: A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.

Abstract: A switch module selects one of a CA mode in which first and second frequency bands are used simultaneously and a non-CA mode in which only one of the first and second frequency bands is used. The switch module includes a first signal path propagating the first frequency band therethrough, a second signal path propagating the second frequency band therethrough, a third signal path simultaneously propagating the first and second frequency bands therethrough, a switch circuit, and a variable adjuster. The switch circuit switches the connection between an antenna device and one of the three signal paths. The variable adjuster adjusts a variable matching circuit for the third signal path when the non-CA mode is selected or adjusts a variable matching circuit for the first signal path or that for the second signal path when the CA mode is selected.

Abstract: A high-frequency module includes a first switch element and a second switch element that are mounted on a multilayer body. The first switch element includes a common terminal and individual terminals. The second switch element includes a common terminal and individual terminals. The individual terminals are connected to any of SAW filters mounted on the multilayer body or low loss filters provided inside the multilayer body. The individual terminals are grounded by being connected to an inner layer ground electrode inside the multilayer body by conductive via holes.

Abstract: A DLC film mass-producing apparatus 10 includes a chamber 12 connected to ground. In the chamber 12, a plurality of plate-shaped substrates 60 are disposed in parallel at regular intervals, without disposing a counter electrode that faces each of the plate-shaped substrates 60. Sputtering cleaning is then conducted by plasma discharge and an underlying contact layer is formed on each of the plate-shaped substrates 60. Subsequently, a DLC film is produced on each of the plate-shaped substrates 60 by injecting a carbon source gas into the chamber 12 such that the internal pressure of the chamber 12 reaches 0.1 to 10 Pa and applying a negative DC pulse voltage having a pulse half width of 0.1 to 3 ?sec to each of the plate-shaped substrates 60 to generate plasma.

Abstract: A high-frequency module includes a first switch element and a second switch element that are mounted on a multilayer body. The first switch element includes a common terminal and individual terminals. The second switch element includes a common terminal and individual terminals. The individual terminals are connected to any of SAW filters mounted on the multilayer body or low loss filters provided inside the multilayer body. The individual terminals are grounded by being connected to an inner layer ground electrode inside the multilayer body by conductive via holes.

Abstract: A high-frequency module has a configuration in which a diplexer is capable of separating the frequency bands of first and second communication systems from the frequency band of a third communication system, a first high-frequency switch is capable of separating a transmission signal of the first or second communication system from a reception signal thereof, a second high-frequency switch is capable of separating a transmission signal of the third communication system from a reception signal thereof, and a third high-frequency switch is capable of separating the reception signal of the first communication system from the reception signal of the second communication system. A reception-signal output port for the second communication system of the high-frequency module is terminated with a chip capacitor to configure the double-band high-frequency module supporting the first and third communication systems.

Abstract: A circuit module includes a multilayer substrate including built-in capacitors and external components mounted on the surface of the multilayer substrate. On the surface of a dielectric layer, an auxiliary electrode is provided. The auxiliary electrode is electrically connected to a capacitor electrode via a via electrode passing through the dielectric layer. On the surface of a dielectric layer, a capacitor electrode is arranged so as to face the capacitor electrode and the auxiliary electrode connected to the capacitor electrode. The auxiliary electrode is arranged in an area in which the capacitor electrodes overlap each other as viewed from a lamination direction.

Abstract: A DLC film mass-producing apparatus 10 includes a chamber 12 connected to ground. In the chamber 12, a plurality of plate-shaped substrates 60 are disposed in parallel at regular intervals, without disposing a counter electrode that faces each of the plate-shaped substrates 60. Sputtering cleaning is then conducted by plasma discharge and an underlying contact layer is formed on each of the plate-shaped substrates 60. Subsequently, a DLC film is produced on each of the plate-shaped substrates 60 by injecting a carbon source gas into the chamber 12 such that the internal pressure of the chamber 12 reaches 0.1 to 10 Pa and applying a negative DC pulse voltage having a pulse half width of 0.1 to 3 ?sec to each of the plate-shaped substrates 60 to generate plasma.

Abstract: A high-frequency module has a configuration in which a diplexer is capable of separating the frequency bands of first and second communication systems from the frequency band of a third communication system, a first high-frequency switch is capable of separating a transmission signal of the first or second communication system from a reception signal thereof, a second high-frequency switch is capable of separating a transmission signal of the third communication system from a reception signal thereof, and a third high-frequency switch is capable of separating the reception signal of the first communication system from the reception signal of the second communication system. A reception-signal output port for the second communication system of the high-frequency module is terminated with a chip capacitor to configure the double-band high-frequency module supporting the first and third communication systems.