Abstract: An optical device mounting board with electrodes mounted on the surface of the mounting board and separated from one another by grooves dividing the surface of the mounting board includes printed circuit boards having distribution lines for connecting the divided electrodes and spanning the grooves.

Abstract: A light receiving element is comprised of a light sensitive surface on a semiconductor substrate and a positive electrode (anode), a negative electrode (cathode), a mounting precision test mask, a conductive electrode wire, and solder resist on the same substrate surface. A metal thin film, a mounting alignment mark, and a mounting precision mark window are provided on the back side of the substrate. Two or more electrode surfaces having either the anode or the cathode used as the common electrode are provided. The light sensitive surface is positioned approximately in the center between these two electrode surfaces. A highly precise mounting can therefore be achieved with the solder bump, even when mounting single light receiving elements. High precision mounting is also obtained when mounting light receiving element arrays. This type of light receiving element can be precisely positioned and bonded by solder bumps to a substrate having an optical fiber fitted in the V groove.

Abstract: A line plasma source (20) comprises a plasma chamber (30) configured so that plasma (32) is situated remotely and on-edge with respect to a polycrystalline silicon surface (20S) to be treated, thereby preventing damage to the surface, facilitating treatment of large substrates, and permitting low temperature operation. Active species exit the plasma chamber through a long narrow ("line") outlet aperture (36) in the plasma chamber to a reaction zone (W) whereat the active species react with a reaction gas on the polycrystalline silicon surface (e.g., to form a deposited thin film). The polycrystalline silicon surface is heated to a low temperature below 6000.degree. C. Hydrogen is removed from the reactive surface in the low temperature line plasma source by a chemical displacement reaction facilitated by choice of dominant active species (singlet delta state of molecular oxygen).

Abstract: The optical fibers are arranged in a V groove formed at the surface of a silicon substrate and a cover is provided thereon. An electrode for solder bump is respectively formed at the position opposed with each other to the substrate and cover. These substrate and cover are deposited with solder in order to fix the optical fibers. The substrate or cover is previously provided, at the end point part of the optical fibers, with the mark for the positioning in the longitudinal direction of the optical fibers. The optical fibers are positioned with this mark. Here, the side surface of the optical fibers is provided with the metallized area at the position located in the predetermined distance from the end point thereof. Before fixing with the cover, the optical fibers can be deposited automatically to the predetermined position without alignment due to the self-alignment effect between the mark and metallized area.

Abstract: An optical module has an optical wave-guide structure formed on a silicon substrate and a laser diode array solder bonded to first pads patterned on the silicon substrate in a self-aligned manner by virtue of surface tension of solder during a reflow stage, and the first pads are shaped into a rectangular parallelopiped configuration so as to make a ratio of a solder bump height to a pad width large without decrease of the volume of the solder bump, thereby generating large surface tension.

Abstract: A device and a method for inputting/outputting an image are disclosed. The device includes: an image display section which selectively transmits light; and an image input section having a photodetective portion for converting part of the light which has been transmitted through the image display section and reflected from an original surface to be imaged, into an electric signal. The method is performed by using the device.

Abstract: In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn sheet. The bump is directly bonded to a substrate. The punch is made up of a shank portion and a punch portion. A punch holder for guiding the shank portion and punch portion with high accuracy molded integrally with the die. The punch is connected to the solenoid with the intermediary of a damper spring. When the bump hits against the substrate, the damper spring prevents it from chipping off or cracking due to an impact. Subsequently, another solenoid is energized to move the punch further downward, thereby pressing the bump against the substrate for a sufficient period of time.

Abstract: A support sheet for a photographic printing sheet having enhanced anti-fogging and anti-yellowing properties comprises a pulp paper substrate sheet, a front coating layer formed on a front surface of the substrate sheet and comprising a cured resinous material produced from electron beam-curable unsaturated organic compound by an electron beam irradiation thereto and mixed with a white pigment, and a back coating layer formed on a back surface of the substrate sheet and comprising a film-forming synthetic resinous material, in which a magnesium compound is contained, as an anti-fogging agent, in the substrate sheet and/or the front coating layer.

Abstract: A support sheet for a photographic printing sheet having enhanced anti-fogging and anti-yellowing properties comprises a pulp paper substrate sheet, a front coating layer formed on a front surface of the substrate sheet and comprising a cured resinous material produced from electron beam-curable unsaturated organic compound by an electron beam irradiation thereto and mixed with a white pigment, and a back coating layer formed on a back surface of the substrate sheet and comprising a film-forming synthetic resinous material, in which magnesium hydroxide is contained, as an anti-fogging agent, in the substrate sheet.

Abstract: Disclosed is a method of forming bonding metal bumps on electrodes of a submount for use with an optical device array. Small bonding metal pieces are arranged on a transfer piece resting substrate so as to be aligned with the electrodes of the submount. Next, the bonding metal pieces thus arranged are transferred onto respective electrodes of the submount. In one embodiment, bonding metal pieces are preferably formed by punching a ribbon-shaped bonding metal and respectively fixed by a force of the punching operation directly onto the electrodes of the submount.

Abstract: A light-emitting diode print head having a narrow LED array chip wherein the constituent LEDs of the array are arranged in a zigzag formation and driven using a differential timing arrangement that compensates for the offset of alternate LEDs in the printing line. The LED array comprises a plurality of light-emitting elements arrayed in a staggered configuration of odd and even numbered elements in parallel rows extending in a first, print line direction and a plurality of electrodes connected to the corresponding light-emitting elements and arranged in a mutually alternating orientation extending between the parallel rows at right-angles to the first direction and forming parallel rows of odd and even numbered electrode terminals interleaved between the even and odd numbered light-emitting elements, respectively.

Abstract: A contact type image sensor comprising a light-detecting element array formed on a substrate, a light source for irradiating an original to be read, and an optical fiber array disposed between said light-detecting element array and said original to be read, said optical fiber array being formed by laminating an optical fiber array member that is composed of optical fibers not coated with an absorber on an optical fiber array member that is composed of optical fibers coated with an absorber, said optical fibers being disposed between said light-detecting element array and said original to be read, and said light source being disposed at the light emission side of said optical fiber array, thereby attaining a precise irradiation of an original with light from a light source and reliably shuts off the leakage to maintain excellent resolution characteristics of the sensor.

Abstract: A contact-type image sensor comprising a light source that illuminates the manuscript to be read; photodetectors that convert the light reflected by the manuscript into an electrical signal; a substrate that is disposed between the photodetectors and the manuscript; an optical fiber array that is constituted by a bundle of optical fibers that are buried in the substrate, the optical fiber array introducing the reflected light from the manuscript into the light-receiving surfaces of the photodetectors; and a light-absorbing substance that is disposed on the outer surface of each of the optical fibers, wherein the light-absorbing substance is disposed on the outer surface of each of the optical fibers, except for the region with a given length from the end of the optical fiber array that faces the manuscript.

Abstract: A contact-type image sensor comprising a light source that illuminates the manuscript to be read; photodetectors that convert the light reflected by the manuscript into an electrical signal; a substrate that is disposed between the photodetectors and the manuscript, a bundle of optical fibers being buried in the substrate; and wiring electrodes that are disposed on the top surface of the substrate corresponding to the light-emitting face of the bundle of optical fibers and that are disposed on the light-receiving surfaces of the photodetectors, wherein the photodetectors are disposed in such a manner that the light-receiving surfaces of the photodetectors face the light-emitting face of the bundle of optical fibers, the wiring electrodes disposed on the photodetectors being electrically bonded to the wiring electrodes disposed on the substrate.

Abstract: An improved optical head comprises such a means as a prism for separating a plurality of light beams deflected from the light path between a plurality of light sources and record medium to pass at least one of the plurality of light beams through one of reflecting planes of the means and to reflect the remaining light beams of the plurality of light beams thereon for the reason why each light axis of the plurality of light beams has a slight slant to others, and the reflecting plane is shaped to have an angle such that the incidence angle of the at least oen of the plurality of light beams is smaller than the critical angle of the means, while the remaining light beams of the plurality of light beams are larger in the incidence angles than the critical angle of the means. The at least one of the plurality of light beams is detected to crrect focusing and tracking errors.

Abstract: A process for producing a photoelectric conversion film comprising heat-treating a coating (A) of a photoconductive material composed chiefly of at least one of CdSe, CdS, CdTe, CdS.sub.x Se.sub.1-x and CdS.sub.x Te.sub.1-x wherein x is a real number of less than 1, opposite from a coating (B) in proximity thereto, the coating (B) being made of a material composed chiefly of CdS and a Cd halide.

Abstract: In a magneto-optical reproducing head including first and second beam splitters (21, 22) and a Faraday effect member (25) between the splitters to suppress return to a laser beam source (11) of a reversed laser beam reversedly sent from a magneto-optical recording medium (12) on which a forward laser beam is incident, the second beam splitter is made to have a transmissivity of at least 0.5 for a p-polarized component. For an s-polarized component, the second beam splitter has a reflectivity which is substantially equal to unity as usual. In order to produce a servo control signal, a signal producing circuit (17) is made to receive an s-polarized component which is substantially totally reflected in the first beam splitter and into which the Faraday effect member converts the p-polarized component having reversedly passed through the second beam splitter. The transmissivity of the second beam splitter should preferably be at least 0.75 and not greater than 0.8.

Abstract: A two-dimensional image reading unit includes a semiconductor layer made of a photoelectric material having a pin structure, a plurality of transparent electrodes aligned parallel to each other and provided on one face of the semiconductor layer, and a plurality of opaque electrodes aligned parallel to each other and provided on the other face of the semiconductor layer such that the opaque electrodes intercept with the transparent electrodes. A photoelectric cell is defined at each crossing point of the transparent and opaque electrodes.