Abstract: A semiconductor integrated circuit device comprising a logical circuit including a MIS transistor formed on a semiconductor substrate, a control circuit for controlling a threshold voltage of the MIS transistor forming the logical circuit, an oscillation circuit including a MIS transistor formed on the semiconductor substrate, the oscillation circuit being constructed so that the frequency of an oscillation output thereof can be made variable, and a buffer circuit, in which the control circuit is supplied with a clock signal having a predetermined frequency and the oscillation output of the oscillation circuit so that the control circuit compares the frequency of the oscillation output and the frequency of the clock signal to output a first control signal, the oscillation circuit is controlled by the first control signal so that the frequency of the oscillation output corresponds to the frequency of the clock signal, the control of the frequency of the oscillation output being performed in such a manner that

Abstract: A semiconductor device has a well region formed in the surface of a substrate, and has functional portions such as MOSFET and bipolar transistor formed in the well region. The carrier concentration profile of the well region assumes the shape of a valley in the direction of depth thereof, and a minimum point thereof has a concentration of smaller than 5.times.10.sup.15 cm.sup.-3 and is located at a position within 1.6 .mu.m from the surface of the substrate. Preferably, the minimum point should have a concentration of greater than 5.times.10.sup.14 cm.sup.-3 but smaller than 5.times.10.sup.15 cm.sup.-3, and more preferably a concentration of greater than 1.times.10.sup.15 cm.sup.-3 but smaller than 5.times.10.sup.15 cm.sup.-3.

Abstract: The semiconductor IC device has a circuit arrangement constituted by a first CMOS logic gate having input and output terminals, and a second CMOS logic gate which performs the same logic operation as that of the first CMOS logic gate and which has an input terminal connected to the input terminal of the first CMOS logic gate. The arrangement also requires a differentiator circuit which has an input terminal thereof connected to an output terminal of the second CMOS logic gate and has an output terminal connected to the output terminal of the first CMOS logic gate. With such an arrangement, the dependency of the effective gate propagation delay time on an output load is lowered. As a result, therefore, the arrangement can be effected using a low power supply voltage while securing a high operation speed as well as a low power consumption. The CMOS logic gates can also be facilitated in combination with NPN bipolar transistors which are connected therewith in an emitter follower circuit form.

Abstract: The semiconductor IC device has a circuit arrangement in which one or more of the circuits, such as on a single substrate, include a totem-pole series connection of bipolar transistors which are driven by arrangements of complementary MOS circuits in a manner such that high-speed logic/switching operation is effected. Arrangements of circuits can also be effected in which the totem-pole series connection is constituted by a PNP transistor, on the power source terminal side, and an NPN or NMOS transistor on the ground or pull-down side thereof. With such configurations, the output signal swing at low operating voltages can be maximized while achieving the same with reduced propagation delay time and low power consumption. The device can also be implemented by circuitry employing capacitance bootstrapping effect as well as IIL (I.sup.2 L) design schemes.

Abstract: The device has, on a single substrate, plural internal circuits, plural input circuits for receiving external input signals and outputting the same to the internal circuit, and plural output circuits for receiving signals outputted from the internal circuits and externally outputting the same, in which at least one of the circuits includes a totem-pole output stage of a first NPN bipolar transistor, on the power supply terminal side, and a second NPN bipolar transistor, on the ground side; a first differentiator circuit for providing pulsing action to the base of the first NPN transistor; a pair of series-connected PMOS transistors for controllably driving the second NPN transistor; and feedback MOS transistors for quickening turn-off of the output stage transistors. The circuit can be effected with a second differentiator circuit in place of the series-connected pair of PMOS transistors.

Abstract: A novel gate circuit is disclosed. A first semiconductor switch includes a couple of main terminals connected between a first potential level and an output node, in which a high impedance state is held in response to an input signal having a first logic level and a second logic level, and the impedance state changes from high to low only during a transient period when the input signal changes substantially from the first to second logic level. A second semiconductor switch includes a couple of main terminals inserted between a second potential level different from the first potential level and the output node, in which a high impedance state is held in response to the input signal, and the impedance state changes from high to low only during a transient period when the input signal changes from the second to first logic level.

Abstract: The structure of a MOSFET and a method for fabricating the same is disclosed, with which it is possible to increase the driving capacity. Heretofore there was a problem that no measures were taken against the decrease in the channel width due to bird's beaks produced at the formation of a field oxide film and that the channel width at the completion of the manufacturing process was smaller than that foreseen during the design of the device. To overcome this problem, a MOSFET is provided in which the junction of the source or the drain is extended up to the end portions in the channel direction so that the effective channel width is determined by the width of the junction on the sides, where the junction is not extended up to the end portions in the channel direction.

Abstract: In a MOSFET of an LDD structure, a side wall is made conductive and connected to a gate through a resistance thereby to cause hot carriers taken into the side wall to be discharged to a gate through the resistance, whereby a channel resistance is prevented from being increased by an effect of carriers accumulated in the side wall. As a result, a reliable MOSFET with a short channel can be provided which is not degraded even if it is used for a long time.

Abstract: A semiconductor memory device has memory cells each including first and second inverters cross-coupled to each other through first and second interconnecting conductors for forming a bistable circuit and first and second transfer gates connected between the first inverter and address signal conductors and between the second inverter and the address signal conductors, respectively. The first and second interconnecting conductors are arranged substantially point-symmetrically and have at least portions substantially parallel with each other on a surface of a substrate, and IG FETs constituting the first and second inverters have their gate electrodes arranged substantially parallel with one another and extending in a direction substantially perpendicular to the parallel portions of the first and second interconnecting conductors for the cross-coupling on the surface of the substrate.

Abstract: A semicondcutor device and a manufacturing method thereof are disclosed in which higher integration can be achieved without increasing the total manufacturing steps. The semiconductor device includes at least two MOS transistors having the same channel types, the gate electrodes of which are constructed of polycrystal silicon layers which contain an impurity, and a bipolar transistor, the base electrode of which is constructed of a polycrystal silicon layer which contains and impurity. In particular, the respective gate electrodes of the two MOS transistors contain impurities of different conductivity types from one another.

Abstract: A semiconductor device has a well region formed in the surface of a substrate, and has semiconductor elements such as MOSFETs and bipolar transistors formed in the well region. The carrier concentration profile of the well region assumes the shape of a valley in the direction of depth thereof, and a minimum point thereof has a concentration of smaller than 5.times.10.sup.15 cm.sup.-3 and is located at a position within 1.6 .mu.m from the surface of the substrate. Preferably, the minimum point should have a concentration of greater than 5.times.10.sup.14 cm.sup.-3 but smaller than 5.times.10.sup.15 cm.sup.-3, and more preferably a concentration of greater than 1.times.10.sup.15 cm.sup.-3 but smaller than 5.times.10.sup.15 cm.sup.-3.

Abstract: The present invention relates to a semiconductor device comprising a semiconductor substrate of a first conductivity type or an insulator, a source comprising an impurity layer of a second conductivity type disposed on said semiconductor substrate or said insulator, a drain comprising an impurity layer of the second conductivity type disposed on said semiconductor substrate or said insulator, an impurity layer of the first conductivity type formed between said source and said drain, a gate formed on said impurity layer of the first conductivity type via an insulation film, and an impurity layer of the second conductivity type having an impurity concentration lower than that of said source and said drain, said impurity layer of the second conductivity type being disposed between said source, said drain and said impurity layer of the first conductivity type, and said semiconductor substrate of the first conductivity type or said insulator.