Abstract: Anodic bonding of an insulator containing no movable ion and a conductor through the medium of a conductive film and an insulator layer containing a movable ion affords a bonded member of the insulator containing no movable ion and the conductor without use of any adhesive agent. A method for effecting the anodic bonding is also provided.

Abstract: An anode bonding method for bonding a first substrate and a second substrate, both of which have a recessed portion, includes the steps of heating the first and second substrates in a stacked state; and bonding the substrates by applying a voltage between the substrates.

Abstract: A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1).The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure.The microstructure can have application as electrostatic actuator etc., depending on choice of shape and composition.

Abstract: A metal oxide is provided which is represented by the compositional formula :(Bi.sub.1-x A.sup.I.sub.x).sub.2 (Sr.sub.y Ca.sub.1-y-z A.sup.II.sub.z).sub.p (Cu.sub.1-r A.sup.III.sub.r).sub.q O.sub..delta.wherein 0.ltoreq.x.ltoreq.0.5, 0.3.ltoreq.y.ltoreq.0.7, 0.ltoreq.z.ltoreq.0.5, 0.ltoreq.r.ltoreq.0.1, 1>y+z, 2>p>11, 1.ltoreq.q.ltoreq.10 and 5.4.ltoreq..delta..ltoreq.24 with the exclusion of x=z=r=0, A.sup.I is at least one element selected from In, Sb, Pb and Sn; A.sup.II is at least one element selected from Na, K, Mg, Ba, and Sn and A.sup.III is at least one element selected from Ti, V, Cu, Ni, Zr, Nb, Ta, Fe and Ru. The metal oxide may further comprise an element selected from lanthanoids and yttrium. The metal oxide material shows superconductivity at a temperature not lower than the boiling point of liquid helium.

Abstract: A solid phase junction method using a simpler process for accurately bonding solid phases without operating in an ultra-high vacuum. This method for bonding at least two solid members includes a step (A) of forming at least one of i) a monomolecular film; and ii) a monomolecular built-up film on at least one of the two junction surfaces, a step (B) of adhering the members through the junction surfaces, a step (C) of applying an electric field to the junction surfaces, and, if necessary, a step (D) of heating the junction surfaces or a step (E) of irradiating the junction surfaces with laser light.

Abstract: A purification apparatus for superconductor fine particles is provided which comprises a device for forming a flow of powder containing the superconductor fine particles, and device for applying a magnetic field to the flow of the powder.