Patents by Inventor Masataro SAITO

Masataro SAITO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210327637
    Abstract: In an insulation layer of a coil component, a thickness of a second covering part and a third covering part located on the penetration hole side of a first covering part is thinner than that of the first covering part. A stray capacitance occurring between a flat coil pattern and external terminal electrodes is reduced by making the first covering part of the insulation layer thicker than the second covering part and the third covering part. Further, since the second covering part and the third covering part of the insulation layers are thinner than the first covering part, a magnetic volume is increased while external dimensions of the base body is maintained, and thus a high inductance is realized.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 21, 2021
    Applicant: TDK CORPORATION
    Inventors: Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI, Hitoshi OHKUBO, Masazumi ARATA
  • Publication number: 20210327641
    Abstract: In a coil component, a stray capacitance may occur between a conducting wires of an upper layer and a conducting wires of a lower layer arranged in the vertical direction due to the potential difference between them. In the coil component, a separation distance between the conducting wire of the upper layer and the conducting wire of the lower layer is designed to be longer than twice a thickness of an insulation coating of a portion covering a side surface of the conducting wire, and a sufficiently long distance is secured, and thus the stray capacitance is reduced.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 21, 2021
    Applicant: TDK CORPORATION
    Inventors: Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI
  • Publication number: 20210193369
    Abstract: In a coil component, a non-magnetic part is bridged between a first coil and a second coil in a cross section of an element body. Therefore, a magnetic flux in a direction along a magnetic core of the first coil and a magnetic core of the second coil is hindered by the non-magnetic part between the first coil and the second coil. Accordingly, a magnetic flux of the first coil and a magnetic flux of the second coil are difficult to interfere with each other.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 24, 2021
    Applicant: TDK CORPORATION
    Inventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
  • Publication number: 20210166858
    Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 3, 2021
    Applicant: TDK CORPORATION
    Inventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
  • Publication number: 20210166859
    Abstract: In a coil component, a first planar coil and a second planar coil are wound around a common magnetic core and are magnetically coupled to each other. However, the first planar coil and the second planar coil are not electrically connected to each other and form coil structures which are separate from each other. Thus, as compared with a case in which the first planar coil and the second planar coil form one coil structure, the first planar coil and the second planar coil are less likely to affect each other's characteristics.
    Type: Application
    Filed: December 2, 2020
    Publication date: June 3, 2021
    Applicant: TDK CORPORATION
    Inventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
  • Publication number: 20210151248
    Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.
    Type: Application
    Filed: November 10, 2020
    Publication date: May 20, 2021
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Kenei ONUMA, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI
  • Publication number: 20200303116
    Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 24, 2020
    Applicant: TDK CORPORATION
    Inventors: Takahiro KAWAHARA, Manabu OHTA, Kenei ONUMA, Yuuya KANAME, Ryo FUKUOKA, Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI