Abstract: By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.

Abstract: In an insulation layer of a coil component, a thickness of a second covering part and a third covering part located on the penetration hole side of a first covering part is thinner than that of the first covering part. A stray capacitance occurring between a flat coil pattern and external terminal electrodes is reduced by making the first covering part of the insulation layer thicker than the second covering part and the third covering part. Further, since the second covering part and the third covering part of the insulation layers are thinner than the first covering part, a magnetic volume is increased while external dimensions of the base body is maintained, and thus a high inductance is realized.

Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.

Abstract: In a coil component, a first planar coil and a second planar coil are wound around a common magnetic core and are magnetically coupled to each other. However, the first planar coil and the second planar coil are not electrically connected to each other and form coil structures which are separate from each other. Thus, as compared with a case in which the first planar coil and the second planar coil form one coil structure, the first planar coil and the second planar coil are less likely to affect each other's characteristics.

Abstract: The coil body of the coil component includes a first coil, a second coil, and a third coil arranged in order along one direction when viewed from the facing direction of the pair of main surfaces of the element body. The first coil, the second coil, and the third coil have alternating winding directions, and the number of turns of the second coil is relatively small, thereby improving the characteristics of the coil component.

Abstract: Since the coil body of the coil component includes a plurality of coils and the first coil is one of the plurality of coils included in the coil body, the current route from the external terminal of the first to the outer peripheral turn of the second coil portion where stray capacitance occurs is significantly shorter than the route of current flowing between the pair of external terminals, and the voltage drop in the outer peripheral turn of the second coil portion is relatively small, so that stray capacitance between the second coil portion and the first external terminal is small.

Abstract: In the coil component, the thickness of the first coil portion and the thickness of the second coil portion are different from each other in the thickness direction of the substrate, thereby achieving improvement in characteristics such as self-resonance frequencies and heat dissipation.

Abstract: The coil body of the coil component includes a first coil, a second coil, and a third coil arranged in order along one direction when viewed from the facing direction of the pair of main surfaces of the element body. The first coil, the second coil, and the third coil have alternating winding directions, and the number of turns of the second coil is relatively small, thereby improving the characteristics of the coil component.

Abstract: Since the coil body of the coil component includes a plurality of coils and the first coil is one of the plurality of coils included in the coil body, the current route from the external terminal of the first to the outer peripheral turn of the second coil portion where stray capacitance occurs is significantly shorter than the route of current flowing between the pair of external terminals, and the voltage drop in the outer peripheral turn of the second coil portion is relatively small, so that stray capacitance between the second coil portion and the first external terminal is small.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In the coil component, external stress applied when the upper coil structure, the lower coil structure, and the magnetic sheet are stacked is dispersed by the undulation of both main surfaces of the magnetic sheet. By dispersing the stress in this manner, a situation in which defects such as cracks occur in the coil structure is effectively suppressed.

Abstract: In the coil component, since the contact area between the external terminal electrode and the element body is increased by the protrusion of the external terminal electrode, the external terminal electrode and the element body are more closely attached to each other. Therefore, the attachment strength between the external terminal electrode and the element body can be improved. Hence, it is possible to suppress peeling of the external terminal electrode from the element body.

Abstract: In the coil component, the coupling coefficient can be adjusted by the magnetic sheet and the insulator interposed between the pair of coils. For example, by increasing the magnetic permeability of the magnetic sheet so that the magnetic flux generated in the coil easily passes through the magnetic sheet, the coupling coefficient decreases. In the coil component, the coupling coefficient can be adjusted while the thickness of the element body is suppressed.

Abstract: Since the magnetic sheet is adopted as the coil component, magnetic saturation is likely to occur in the magnetic sheet, and it is considered that the DC superimposition characteristic of the coil component is deteriorated. However, since the inner edge of the coil structure backs down with respect to the inner edge of the magnetic sheet so that the magnetic flux generated in the coil easily circulates, the deterioration of the DC superimposition characteristics due to the adoption of the magnetic sheet is suppressed.