Patents by Inventor Masataro SAITO
Masataro SAITO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230023284Abstract: In a coil component, fixing strength of an external terminal is improved. In the coil component, on the end face of the element body, the center position of the external terminal electrode in the first direction is biased toward the center position of the end face with respect to the center position of the outer end portion. Therefore, the fixing area between the external terminal electrode and the element body is increased on the center position side of the end face, and thus fixing strength between the external terminal electrode and the element body is improved.Type: ApplicationFiled: July 18, 2022Publication date: January 26, 2023Applicant: TDK CORPORATIONInventors: Hokuto EDA, Hitoshi OHKUBO, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI
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Publication number: 20230022095Abstract: In a coil component, coupling coefficient is improved. In the coil component, the coupling position between the outer end portion of the first planar coil and the first lead-out portion is biased toward the second lead-out portion with respect to the center line of the first lead-out portion, whereby the length of the second planar coil not alongside with the outermost turn of the first planar coil is shortened. By shortening the length of the second planar coil, the coupling coefficient between the first coil portion and the second coil portion is increased.Type: ApplicationFiled: July 18, 2022Publication date: January 26, 2023Applicant: TDK CORPORATIONInventors: Hokuto EDA, Hitoshi OHKUBO, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI
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Publication number: 20220415566Abstract: An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.Type: ApplicationFiled: June 21, 2022Publication date: December 29, 2022Applicant: TDK CORPORATIONInventors: Hokuto EDA, Hitoshi OHKUBO, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI, Manabu OHTA, Kenei ONUMA
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Publication number: 20220392698Abstract: A coil component improving insulation between external terminals provided on the same surface of an element body is provided. In the coil component, when a voltage is applied via the external terminal electrode, for example, a potential difference may occur between the outer end portions. In the coil component, since the insulation between the outer end portions is enhanced by the upper insulator exposed on the end face of the element body, even when a potential difference occurs between the outer end portions, a situation in which the outer end portions are short-circuited on the end face is prevented.Type: ApplicationFiled: June 1, 2022Publication date: December 8, 2022Applicant: TDK CORPORATIONInventors: Hokuto EDA, Hitoshi OHKUBO, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI
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Publication number: 20220189682Abstract: By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.Type: ApplicationFiled: December 8, 2021Publication date: June 16, 2022Applicant: TDK CORPORATIONInventors: Masataro SAITO, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI, Masazumi ARATA
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Publication number: 20220189679Abstract: In the coil component, the maximum reference surface height of the entire wall of the outermost wall and the innermost wall is the same as the reference surface height of the winding part of the coil, that is, equal to or less than the reference surface height of the winding part of the coil. In addition, in both the outermost wall and the innermost wall, the reference surface height of the second side surface is lower than the reference surface height of the winding part of the coil. In this case, in the vicinity of the upper surface of the outermost wall and the innermost wall, the magnetic flux toward the main surface side of the substrate is suppressed from being blocked by the outermost wall and the innermost wall, and the magnetic flux circulation is improved. Thus, the coil characteristics of the coil component are improved.Type: ApplicationFiled: December 8, 2021Publication date: June 16, 2022Applicant: TDK CORPORATIONInventors: Ryo FUKUOKA, Hironori KIMATA, Masataro SAITO, Masazumi ARATA, Hitoshi OHKUBO
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Publication number: 20210327641Abstract: In a coil component, a stray capacitance may occur between a conducting wires of an upper layer and a conducting wires of a lower layer arranged in the vertical direction due to the potential difference between them. In the coil component, a separation distance between the conducting wire of the upper layer and the conducting wire of the lower layer is designed to be longer than twice a thickness of an insulation coating of a portion covering a side surface of the conducting wire, and a sufficiently long distance is secured, and thus the stray capacitance is reduced.Type: ApplicationFiled: April 19, 2021Publication date: October 21, 2021Applicant: TDK CORPORATIONInventors: Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI
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Publication number: 20210327637Abstract: In an insulation layer of a coil component, a thickness of a second covering part and a third covering part located on the penetration hole side of a first covering part is thinner than that of the first covering part. A stray capacitance occurring between a flat coil pattern and external terminal electrodes is reduced by making the first covering part of the insulation layer thicker than the second covering part and the third covering part. Further, since the second covering part and the third covering part of the insulation layers are thinner than the first covering part, a magnetic volume is increased while external dimensions of the base body is maintained, and thus a high inductance is realized.Type: ApplicationFiled: April 19, 2021Publication date: October 21, 2021Applicant: TDK CORPORATIONInventors: Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI, Hitoshi OHKUBO, Masazumi ARATA
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Publication number: 20210193369Abstract: In a coil component, a non-magnetic part is bridged between a first coil and a second coil in a cross section of an element body. Therefore, a magnetic flux in a direction along a magnetic core of the first coil and a magnetic core of the second coil is hindered by the non-magnetic part between the first coil and the second coil. Accordingly, a magnetic flux of the first coil and a magnetic flux of the second coil are difficult to interfere with each other.Type: ApplicationFiled: December 18, 2020Publication date: June 24, 2021Applicant: TDK CORPORATIONInventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
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Publication number: 20210166858Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.Type: ApplicationFiled: December 1, 2020Publication date: June 3, 2021Applicant: TDK CORPORATIONInventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
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Publication number: 20210166859Abstract: In a coil component, a first planar coil and a second planar coil are wound around a common magnetic core and are magnetically coupled to each other. However, the first planar coil and the second planar coil are not electrically connected to each other and form coil structures which are separate from each other. Thus, as compared with a case in which the first planar coil and the second planar coil form one coil structure, the first planar coil and the second planar coil are less likely to affect each other's characteristics.Type: ApplicationFiled: December 2, 2020Publication date: June 3, 2021Applicant: TDK CORPORATIONInventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
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Publication number: 20210151248Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.Type: ApplicationFiled: November 10, 2020Publication date: May 20, 2021Applicant: TDK CORPORATIONInventors: Hitoshi OHKUBO, Kenei ONUMA, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI
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Publication number: 20200303116Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: ApplicationFiled: March 6, 2020Publication date: September 24, 2020Applicant: TDK CORPORATIONInventors: Takahiro KAWAHARA, Manabu OHTA, Kenei ONUMA, Yuuya KANAME, Ryo FUKUOKA, Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI