Patents by Inventor Masato Ando

Masato Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180229310
    Abstract: A chuck device includes a chuck main body, an exchange member, an axial direction regulating mechanism, and a circumferential direction regulating mechanism. The axial direction regulating mechanism has a circumferential groove section, which extends in the circumferential direction, that is recessed into one of the chuck main body and the exchange member and a radially protruding section, which is able to protrude in the radial direction, that is disposed in the other of the chuck main body and the exchange member. The circumferential direction regulating mechanism has an axially recessed section, which is recessed in the axial direction, that is disposed in one of the chuck main body and the exchange member and an axially protruding section, which is able to protrude in the axial direction, that is disposed in the other of the chuck main body and the exchange member.
    Type: Application
    Filed: August 6, 2015
    Publication date: August 16, 2018
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Takuya MIURA, Toshitaka KIMURA, Takenobu IMAMICHI, Masato ANDO
  • Publication number: 20180208764
    Abstract: The present invention aims to provide a polycarbonate resin composition having impact resistance at high levels in good balance, a production method thereof, and a molded body of the polycarbonate resin composition. The present invention relates to a polycarbonate resin composition containing a polycarbonate resin (A) having a constitution unit derived from a compound represented by formula (1) and polyrotaxane (B), a production method thereof, and a molded body of the resin composition.
    Type: Application
    Filed: March 26, 2018
    Publication date: July 26, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Masato ANDO, Tomohiko TANAKA
  • Publication number: 20110006741
    Abstract: A building includes: a plurality of secondary battery housing portions provided dispersed in a plurality of locations inside or inside and outside; and a plurality of secondary batteries, a respective one of the secondary batteries housed in a respective one of the plurality of secondary battery housing portions.
    Type: Application
    Filed: July 1, 2010
    Publication date: January 13, 2011
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, TOYOTA HOUSING CORPORATION
    Inventor: Masato ANDO
  • Patent number: 7674506
    Abstract: There is provided a direct backlight type liquid crystal display device having high light diffusability, keeping excellent color and having high brightness.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: March 9, 2010
    Assignee: Teijin Chemicals, Ltd.
    Inventors: Isao Sogo, Masato Ando, Mitsuhiro Takeo, Koji Maeda, Masanao Jinno
  • Patent number: 7640807
    Abstract: A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrate 7 is joined onto a wall surface of the casing 9 that defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surface 7a of the semiconductor integrated circuit substrate 7.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: January 5, 2010
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Masahide Tamura, Masato Ando, Yuichi Ishikuro
  • Patent number: 7360440
    Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: April 22, 2008
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
  • Patent number: 7317067
    Abstract: An object of the present invention is to provide a polycarbonate copolymer having excellent heat resistance and dimensional stability and heat resistant parts comprising the copolymer and suitable for use in various applications. The present invention is a polycarbonate copolymer comprising 5 to 95 mol % of recurring unit (component a) represented by the following general formula (I): and 95 to 5 mol % of recurring unit (component b) represented by the following general formula (II): (wherein Ra to Rd are each independently a hydrogen atom, a hydrocarbon group which may contain an aromatic group having 1 to 9 carbon atoms or a halogen atom, and W is a single bond, a hydrocarbon group which may contain an aromatic group having 1 to 20 carbon atoms or an O, SO, SO2, CO or COO group), and various heat resistant parts comprising the copolymer.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: January 8, 2008
    Assignee: Teijin Chemicals
    Inventors: Koki Ikeda, Toshimasa Tokuda, Yoshimasa Okamoto, Masato Ando
  • Publication number: 20070234804
    Abstract: A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrate 7 is joined onto a wall surface of the casing 9 that defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surface 7a of the semiconductor integrated circuit substrate 7.
    Type: Application
    Filed: July 7, 2005
    Publication date: October 11, 2007
    Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.
    Inventors: Masahide Tamura, Masato Ando, Yuichi Ishikuro
  • Publication number: 20070234827
    Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.
    Type: Application
    Filed: June 15, 2007
    Publication date: October 11, 2007
    Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.
    Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
  • Patent number: 7278204
    Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: October 9, 2007
    Assignee: Fuji Machine Mfg, Co., Ltd.
    Inventors: Takeyoshi Isogai, Hiroshi Katsumi, Hisashi Kojima, Masato Ando, Tetsuo Hayashi
  • Patent number: 7234359
    Abstract: A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: June 26, 2007
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
  • Patent number: 7122396
    Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: October 17, 2006
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Yoshiyuki Nakamizo, Tsutomu Sawai, Masato Ando
  • Publication number: 20060146228
    Abstract: There is provided a direct backlight type liquid crystal display device having high light diffusability, keeping excellent color and having high brightness.
    Type: Application
    Filed: June 16, 2004
    Publication date: July 6, 2006
    Inventors: Isao Sogo, Masato Ando, Mitsuhiro Takeo, Koji Maeda, Masanao Jinno
  • Publication number: 20060094148
    Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.
    Type: Application
    Filed: October 3, 2003
    Publication date: May 4, 2006
    Applicant: Hokuriku Electric Industry Co., Ltd
    Inventors: Yoshiyuki Nakamizo, Tsutomu Sawai, Masato Ando
  • Publication number: 20050246890
    Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.
    Type: Application
    Filed: July 14, 2005
    Publication date: November 10, 2005
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Takeyoshi Isogai, Hiroshi Katsumi, Hisashi Kojima, Masato Ando, Tetsuo Hayashi
  • Publication number: 20050217386
    Abstract: A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).
    Type: Application
    Filed: April 14, 2003
    Publication date: October 6, 2005
    Applicant: Hokuriku Electric Industry Co.,
    Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
  • Patent number: 6931718
    Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: August 23, 2005
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Takeyoshi Isogai, Hiroshi Katsumi, Hisashi Kojima, Masato Ando, Tetsuo Hayashi
  • Publication number: 20050119441
    Abstract: An object of the present invention is to provide a polycarbonate copolymer having excellent heat resistance and dimensional stability and heat resistant parts comprising the copolymer and suitable for use in various applications. The present invention is a polycarbonate copolymer comprising 5 to 95 mol % of recurring unit (component a) represented by the following general formula (I): and 95 to 5 mol % of recurring unit (component b) represented by the following general formula (II): (wherein Ra to Rd are each independently a hydrogen atom, a hydrocarbon group which may contain an aromatic group having 1 to 9 carbon atoms or a halogen atom, and W is a single bond, a hydrocarbon group which may contain an aromatic group having 1 to 20 carbon atoms or an O, SO, SO2, CO or COO group), and various heat resistant parts comprising the copolymer.
    Type: Application
    Filed: March 24, 2003
    Publication date: June 2, 2005
    Inventors: Koki Ikeda, Toshimasa Tokuda, Yoshimasa Okamoto, Masato Ando
  • Patent number: 6493927
    Abstract: A chuck for holding an object, including one or more linear motors which include one or more linear stators, two or more moving members which are movable along the linear stator or stators, independent of each other, and one or more guide members which guide each of the two or more moving members along the linear stator or stators, and two or more holding members which are supported by the two or more moving members, respectively, and which cooperate with each other to hold the object.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: December 17, 2002
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Takeyoshi Isogai, Hiroshi Katsumi, Masato Ando
  • Patent number: D629320
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: December 21, 2010
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Hiroyuki Sawamura, Masato Ando, Satoshi Tsubata