Patents by Inventor Masato Ando

Masato Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020083584
    Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.
    Type: Application
    Filed: December 21, 2001
    Publication date: July 4, 2002
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Takeyoshi Isogai, Hiroshi Katsumi, Hisashi Kojima, Masato Ando, Tetsuo Hayashi
  • Patent number: 6321600
    Abstract: An acceleration detecting device capable of permitting a weight, a diaphragm and a base to be precisely positioned on a casing of a measuring equipment or the like. The weight, diaphragm and base are integrally formed of a metal material into a single unit. An insulating casing is integrally formed while incorporating the single unit as an insert therein. The insulating casing has a recess defined by a side wall thereof, which is formed with a window for exposing a part of the base therethrough. The recess of the casing is closed with a metal cover member, which is mounted on the casing. The cover member is integrally provided with a contactor which is elastically forced against the base through the window. The base is electrically connected to ground terminals of terminal fitments.
    Type: Grant
    Filed: July 26, 1999
    Date of Patent: November 27, 2001
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Shigeru Hirose, Masato Ando, Yoshiyuki Nakamizo, Takeshi Arikura, Tsutomu Sawai
  • Publication number: 20010008326
    Abstract: A chuck for holding an object, including one or more linear motors which include one or more linear stators, two or more moving members which are movable along the linear stator or stators, independent of each other, and one or more guide members which guide each of the two or more moving members along the linear stator or stators, and two or more holding members which are supported by the two or more moving members, respectively, and which cooperate with each other to hold the object.
    Type: Application
    Filed: December 26, 2000
    Publication date: July 19, 2001
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Takeyoshi Isogai, Hiroshi Katsumi, Masato Ando
  • Patent number: 4351266
    Abstract: An apparatus for dipping plating objects such as IC lead frame of a rectangular shape obtained by press forming and etching thin metal pieces, wherein a plural number of said rectangular sheets aligned and supported on the freely descending and returning rack base of the support carriage of the objects to be plated are concurrently subjected to dipping plating by determining the position of the said plural number of rectangular sheets to be plated for lowering into the plating tanks, and abutting the upper surface of the objects to be plated with the holding means thereby subjecting a plural number of objects to be plated.
    Type: Grant
    Filed: April 17, 1980
    Date of Patent: September 28, 1982
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Masato Ando, Kenji Yamamoto, Kazuhiro Taniguchi
  • Patent number: 4318793
    Abstract: In an automatic apparatus for plating, the plating assembly line is incorporated into a circuit assuming a rectangle in a plan view, and on said assembly line a plurality of support carriages carrying objects to be plated are successively conveyed to effectively carry out the desired processings of plating in different plating tanks, the objects being a plurality of strips and aligned and carried by said support carriage.
    Type: Grant
    Filed: April 21, 1980
    Date of Patent: March 9, 1982
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Masato Ando, Kenji Yamamoto, Kazuhiro Taniguchi
  • Patent number: 4298446
    Abstract: An apparatus optimum for partially plating such rectangular objects as an IC lead frame obtained by subjecting thin metal pieces to press working and etching. The apparatus is characterized in that a support carriage aligns and supports the plurality of objects to be plated in advance, positioning means align the objects as regards the plating tank the lead wire as a cathode is contacted at the same time with the upper side of each object to be plated and the whole of the plural number of objects to be plated is masked, thereby performing plating by jetting the plating liquid onto respective portions to be plated.
    Type: Grant
    Filed: April 18, 1980
    Date of Patent: November 3, 1981
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Masato Ando, Kenji Yamamoto, Kazuhiro Taniguchi