Abstract: An image sensor includes: (1) a substrate having first and second surfaces opposing each other in a first direction and a plurality of unit pixels, (2) first and second photodiodes disposed in the substrate in each of the plurality of unit pixels and isolated from each other in a second direction perpendicular to the first direction, (3) a first device isolation film disposed between the plurality of unit pixels, and (4) a pixel internal isolation film disposed in at least one of the plurality of unit pixels. A second device isolation film overlaps at least one of the first and second photodiodes in the first direction. A pair of third device isolation films: (a) extend from the first device isolation film into the unit pixel in a third direction perpendicular to the first direction and the second direction and (b) oppose each other.

Abstract: An image sensor includes a substrate including a first side on which light is incident, and a second side opposite to the first side, a pixel isolation pattern formed inside the substrate which defines a plurality of unit pixels, a first photoelectric conversion region and a second photoelectric conversion region arranged along a first direction, inside each of the unit pixels, and a region isolation pattern which protrudes from the pixel isolation pattern in a second direction intersecting the first direction, and defines an isolation region between the first photoelectric conversion region and the second photoelectric conversion region. A first width of the isolation region in the second direction on the first side is more than about 1.1 times a second width of the isolation region in the second direction on the second side.

Abstract: An image sensor includes a substrate having a sensing area, a floating diffusion region arranged in the sensing area, a plurality of photodiodes arranged around the floating diffusion region in the sensing area, and an inter-pixel overflow (IPO) barrier in contact with each of the plurality of photodiodes, the IPO barrier overlapping the floating diffusion region in a vertical direction at a position vertically spaced apart from the floating diffusion region within the sensing area.

Abstract: An image sensor is provided. The image sensor includes a first pixel region and a second pixel region located within a semiconductor substrate, a first isolation layer surrounding the first pixel region and the second pixel region, a second isolation layer located between the first pixel region and the second pixel region, and a microlens arranged on the first pixel region and the second pixel region. Each of the first pixel region and the second pixel region include a photoelectric conversion device. The second isolation layer includes at least one first open region that exposes a portion of an area located between the first pixel region and the second pixel region.

Abstract: A pressure-sensitive adhesive layer attached optical film is disclosed, including a one-side-protected polarizing film including a thin polarizer and a transparent protective film (excluding a retardation film) on one surface of the polarizer, and the pressure-sensitive adhesive layer is provided on a side of the one-side-protected polarizing film on which the transparent protective film is not provided, and the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition including a (meth)acrylic polymer (A) containing 80 mass % or more of a prescribed monomer (a) as a monofunctional monomer unit and 20 mass % or more of n-butyl acrylate or 70 mass % or more of an alkoxyalkyl (meth)acrylate are contained as the prescribed monomer (a), and a silane coupling agent (B), not containing polyether compound having a polyether skeleton and a reactive silyl group.

Abstract: An image display panel is disclosed with a bezel including an image display unit and a polarizing film provided on a viewing side of the image display unit via a pressure-sensitive adhesive layer; and a narrow-frame external bezel provided via an elastic intermediate layer, wherein a distance from the viewing-side outermost surface of the image display panel to the pressure-sensitive adhesive layer is 75 ?m or more, and the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition including a (meth)acrylic polymer (A) containing 80 mass % or more of a prescribed monomer (a) as a monofunctional monomer unit and 20 mass % or more of n-butyl acrylate or 70 mass % or more of an alkoxyalkyl (meth)acrylate are contained as the prescribed monomer (a), and a silane coupling agent (B), not containing polyether compound having a polyether skeleton and a reactive silyl group.

Abstract: An image sensor includes a pixel array and a logic circuit. The pixel array includes a pixel isolation layer between a plurality of pixels. Each of the plurality of pixels include a pixel circuit below at least one photodiode. The logic circuit acquires a pixel signal from the plurality of pixels. The pixel array includes at least one autofocusing pixel, which includes a first photodiode, a second photodiode, a pixel internal isolation layer between the first and second photodiodes, and a microlens on the first and second photodiodes. The pixel internal isolation layer includes a first pixel internal isolation layer and a second pixel internal isolation layer, separated from each other in a first direction, perpendicular to the upper surface of the substrate, and the first pixel internal isolation layer and the second pixel internal isolation layer include different materials.

Abstract: The present invention provides an image display panel including an image display unit and an optical film including a polarizing film provided on a viewing side of the image display unit via a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a degree of swelling with oleic acid of more than 130% and 190% or less, and the image display panel has a flat edge face. The image display panel with a bezel can preventing peeling-off of the pressure-sensitive adhesive layer even when placed in a humidified environment in a state where fat and oil or cream components are in contact with the elastic intermediate layer. The image display panel of the present invention can prevent peeling-off of the pressure-sensitive adhesive layer even when placed in a humidified environment in a state where fat and oil or cream components are in contact with the elastic intermediate layer.

Abstract: A fluorinated imide salt compound of the present invention is a compound represented by General Formula (1). In General Formula (1), m represents 1 or 2, n represents an integer from 1 to 4, ? represents 1 or 2, and X?+ represents an ?-valent metal ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, a quaternary ammonium ion, or NH4+.

Abstract: An image sensor includes a first photodiode group, a second photodiode group, a first transfer transistor group, a second transfer transistor group, a floating diffusion region of a substrate in which electric charges generated in the first photodiode group are stored, and a power supply node for applying a power supply voltage to the second photodiode group. A barrier voltage is applied to at least one transfer transistor of the second transfer transistor group. The power supply voltage allows electric charges, generated in the second photodiode group, to migrate to the power supply node, and the barrier voltage forms a potential barrier between the second photodiode group and the floating diffusion region.

Abstract: An image sensor according to an example embodiment include a plurality of image pixel groups, a plurality of auto focusing (AF) pixel groups, a first transmission control signal line connected to a first pixel of each of the plurality of image pixel groups, a second transmission control signal line connected to a second pixel of each of the plurality of image pixel groups, a third transmission control signal line connected to a first pixel of each of the plurality of AF pixel groups, and a fourth transmission control signal line connected to a second pixel of each of the plurality of AF pixel groups, wherein the fourth transmission control signal line is electrically separated from the first to the third transmission control signal line, and the each of the plurality of image pixel group and the plurality of AF pixel groups are disposed below a single microlens.

Abstract: A manufacturing method includes a first process for forming a first gate electrode for a first MOS transistor and a second gate electrode for a second MOS transistor on a substrate including a semiconductor region defined by an insulator region for element isolation, a second process for masking a portion located above the semiconductor region of the first gate electrode to introduce an impurity to a source-drain region of the first MOS transistor, and a third process for forming a first conductor member being in contact with the portion of the first gate electrode through a first hole disposed on an insulator member covering the substrate and a second conductor member being in contact with the second gate electrode through a second hole disposed on the insulator member.

Abstract: An image sensor includes a photodiode generating a charge in response to light, a transfer transistor connecting the photodiode and a floating diffusion, a reset transistor connected between the floating diffusion and a power node, a boosting capacitor connected to the floating diffusion, and adjusting a capacity of the floating diffusion in response to a boosting control signal, and a bias circuit having first and second current circuits for supplying different bias currents to an output node to which a voltage signal corresponding to a charge accumulated in the floating diffusion is output. The boosting control signal decreases from a high level to a low level after the transfer transistor is turned off, and the reset transistor is switched from a turned on state to a turned off state when the bias currents of the first and second current circuits are simultaneously provided to the output node.

Abstract: A pixel array included in an auto-focus image sensor includes a substrate, a plurality of pixels, a deep device isolation region and a plurality of first ground regions. The substrate includes a first surface on which a gate electrode is disposed and a second surface opposite to the first surface. The plurality of pixels are disposed in the substrate, and include a plurality of first pixels configured to detect a phase difference and a plurality of second pixels configured to detect an image. The deep device isolation region is disposed in the substrate, extends substantially vertically from the second surface of the substrate to isolate the plurality of pixels from each other. The plurality of first ground regions are disposed adjacent to the first surface in the substrate and adjacent to only at least some of the plurality of first pixels.

Abstract: An image sensor includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a transfer gate electrode provided on the first surface of the semiconductor substrate, readout circuit transistors spaced apart from the transfer gate electrode and provided on the first surface of the semiconductor substrate, and a photoelectric conversion layer provided in the semiconductor substrate at a side of the transfer gate electrode and including dopants of a first conductivity type. The photoelectric conversion layer includes a first region having a first thickness and a second region having a second thickness that is less than the first thickness. The second region overlaps with at least a portion of the readout circuit transistors in a direction perpendicular to the first surface of the semiconductor substrate.

Abstract: A thermoplastic modacrylic resin composition includes a modacrylic resin and a plasticizer. The modacrylic resin includes 15 to 85 wt % of acrylonitrile, 15 to 85 wt % of vinyl chloride and/or vinylidene chloride, and 0 to 20 wt % of another vinyl monomer, and the plasticizer is an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. A method for manufacturing a thermoplastic modacrylic resin composition includes melt-kneading a powder mixture obtained by mixing a modacrylic resin powder and an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. Acrylic fibers are composed of a thermoplastic modacrylic resin composition.

Abstract: A thermoplastic modacrylic resin composition includes a modacrylic resin and a plasticizer. The modacrylic resin includes 15 to 85 wt % of acrylonitrile, 15 to 85 wt % of vinyl chloride and/or vinylidene chloride, and 0 to 20 wt % of another vinyl monomer, and the plasticizer is an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. A method for manufacturing a thermoplastic modacrylic resin composition includes melt-kneading a powder mixture obtained by mixing a modacrylic resin powder and an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. Acrylic fibers are composed of a thermoplastic modacrylic resin composition.

Abstract: Protein fibers for artificial hair include a polycation, wherein the protein fibers for artificial hair are crosslinked with an organic compound and/or a metal salt, and the protein fibers for artificial hair have curls. A method for producing the protein fibers for artificial hair includes treating artificial protein fibers that are crosslinked with an organic compound and/or a metal salt with a treatment solution containing a polycation, and curling the artificial protein fibers, or curling artificial protein fibers that are crosslinked with an organic compound and/or a metal salt, and treating the curled artificial protein fibers with a treatment solution containing a polycation.

Abstract: An acrylic fiber for artificial hair includes an acrylic polymer and an organic solvent that can dissolve the acrylic polymer, wherein the acrylic polymer includes 29.5 to 79.5% by weight of acrylonitrile, 20 to 70% by weight of vinyl chloride and/or vinylidene chloride, and 0.5 to 5% by weight of a sulfonic acid-containing vinyl monomer with respect to a total weight of the acrylic polymer, and wherein a content of the organic solvent in the acrylic fiber is 0.1 to 3% by weight.

Abstract: A thermoplastic modacrylic resin composition includes a modacrylic resin and a plasticizer The modacrylic resin includes 15 to 85 wt % of acrylonitrile, 15 to 85 wt % of vinyl chloride and/or vinylidene chloride, and 0 to 20 wt % of another vinyl monomer, and the plasticizer is an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. A method for manufacturing a thermoplastic modacrylic resin composition includes melt-kneading a powder mixture obtained by mixing a modacrylic resin powder and an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. Acrylic fibers are composed of a thermoplastic modacrylic resin composition.