Patents by Inventor Masato Hamada

Masato Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170167029
    Abstract: A substrate processing apparatus can allow palladium atoms to be coupled to a surface of a substrate without performing a silane coupling processing with a silane coupling agent on the substrate. In a substrate processing apparatus 1, a plating unit 4 includes a catalyst solution supply unit 43a and a plating liquid supply unit 45. The catalyst solution supply unit 43a forms a catalyst layer 91 on a surface of a substrate W1 by supplying, onto the substrate W1, a catalyst solution L1 containing a complex of a palladium ion and a monocyclic 5- or 6-membered aromatic or aliphatic heterocyclic compound having one or two nitrogen atoms as a heteroatom. After the catalyst solution L1 is supplied, the plating liquid supply unit 45 forms an electroless plating layer 92 on the catalyst layer 91 formed on a substrate W2 by supplying a plating liquid M1 onto the substrate W2.
    Type: Application
    Filed: December 8, 2016
    Publication date: June 15, 2017
    Inventors: Tomohisa Hoshino, Keiichi Fujita, Masato Hamada
  • Publication number: 20170170021
    Abstract: In a substrate processing apparatus 1, a plating unit 4 includes a catalyst solution supply unit 43a and a plating liquid supply unit 45. By supplying, from the catalyst solution supply unit 43a onto a substrate W1 having an impurity-doped polysilicon film 90 containing a high concentration of impurities on a surface thereof, an alkaline catalyst solution L1 containing a complex of a palladium ion and a monocyclic 5- or 6-membered aromatic or aliphatic heterocyclic compound having one or two nitrogen atoms as a heteroatom, a catalyst layer 91 is formed on a surface of the impurity-doped polysilicon film 90 of the substrate W1. After the catalyst solution L1 is supplied, an electroless plating layer 92 is formed on the catalyst layer 91 formed on a substrate W2 by supplying a plating liquid M1 from the plating liquid supply unit 45 onto the substrate W2.
    Type: Application
    Filed: December 9, 2016
    Publication date: June 15, 2017
    Inventors: Tomohisa Hoshino, Keiichi Fujita, Masato Hamada
  • Publication number: 20170159202
    Abstract: An electrolytic treatment apparatus of the present disclosure includes a common electrode and a counter electrode that are disposed such that the treatment liquid is interposed therebetween. A first wiring and a second wiring are connected to the common electrode, a capacitor is provided in the first wiring. Copper ions are moved to the counter electrode side by forming an electric field in the treatment liquid when the capacitor is charged without connecting the first wiring and the second wiring to each other, and the copper ions moved to the counter electrode side are reduced by applying a voltage between the common electrode and the counter electrode when the capacitor is discharged by connecting the first wiring and the second wiring to each other.
    Type: Application
    Filed: November 28, 2016
    Publication date: June 8, 2017
    Inventors: Tomohisa HOSHINO, Masato HAMADA
  • Publication number: 20160284592
    Abstract: An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2. The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.
    Type: Application
    Filed: March 23, 2016
    Publication date: September 29, 2016
    Inventors: Tomohisa Hoshino, Masato Hamada, Takashi Tanaka, Yuichiro Inatomi, Yusuke Saito
  • Patent number: 7107458
    Abstract: In an authentication communicating semiconductor device to enhance protection against illegal copying, a logic analyzer probe or the like is connected to a CPU bus to suppress possibility in which the authentication process is intercepted and is analyzed to break the mechanism of illegal copy protection and the electronic device is modified to set a tampered encryption key to the CPU bus. The authentication communicating semiconductor device includes a semiconductor chip, a main processing unit formed on the chip for generating a key code according to a predetermined algorithm, for determining approval/non-approval of communication of data with an external device, and for controlling the communication; an encryption unit formed on the chip for encrypting and decoding communication data using the key code generated by the main processing unit, and an interface unit formed on the chip for conducting communication with an upper-layer or a lower-layer according to a predetermined protocol.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: September 12, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Toshihisa Oishi, Jun Tozawa, Tetsuya Shibayama, Masato Hamada
  • Publication number: 20010052070
    Abstract: In an authentication communicating semiconductor device to enhance protection against illegal copying, a logic analyzer probe or the like is connected to a CPU bus to suppress possibility in which the authentication process is intercepted and is analyzed to break the mechanism of illegal copy protection and the electronic device is modified to set a tampered encryption key to the CPU bus. The authentication communicating semiconductor device includes a semiconductor chip, a main processing unit formed on the chip for generating a key code according to a predetermined algorithm, for determining approval/non-approval of communication of data with an external device, and for controlling the communication; an encryption unit formed on the chip for encrypting and decoding communication data using the key code generated by the main processing unit, and an interface unit formed on the chip for conducting communication with an upper-layer or a lower-layer according to a predetermined protocol.
    Type: Application
    Filed: May 25, 2001
    Publication date: December 13, 2001
    Inventors: Toshihisa Oishi, Jun Tozawa, Tetsuya Shibayama, Masato Hamada
  • Patent number: 4734474
    Abstract: A novel fluorine-containing crosslinkable copolymer comprising fluorine-containing monomer units each having a sulfonyl chloride group and monomer units of at least one ethylenically unsaturated compound is disclosed. The present fluorine-containing crosslinkable copolymer has a specific range of a sulfonyl chloride group content and can be easily crosslinked to give a fluorine-containing elastomer which is excellent in heat resistance and chemicals resistance.
    Type: Grant
    Filed: February 21, 1986
    Date of Patent: March 29, 1988
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Masato Hamada, Tetsuro Ohta
  • Patent number: 4466881
    Abstract: A novel process is disclosed for preparing (.omega.-fluorosulfonyl)haloaliphatic carboxylic acid fluorides by electrolytic fluorination, simply and efficiently.
    Type: Grant
    Filed: May 12, 1983
    Date of Patent: August 21, 1984
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Masato Hamada, Jukichi Ohmura, Fumio Muranaka
  • Patent number: 4425199
    Abstract: A novel process is disclosed for preparing (.omega.-fluorosulfonyl)haloaliphatic carboxylic acid fluorides by electrolytic fluorination, simply and efficiently.
    Type: Grant
    Filed: March 22, 1982
    Date of Patent: January 10, 1984
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Masato Hamada, Jukichi Ohmura, Fumio Muranaka
  • Patent number: 4126589
    Abstract: A fluorocarbon polymer membrane having pendant sulfonamide groups is first treated with anion radicals and then hydrolyzed for conversion into a cation exchange membrane having carboxylic groups and sulfonic acid groups.
    Type: Grant
    Filed: November 14, 1977
    Date of Patent: November 21, 1978
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Masato Hamada, Maomi Seko, Yasumichi Yamakoshi, Hirotsugu Miyauchi, Fumihiko Yamamoto
  • Patent number: 3981906
    Abstract: Alkyl 4,4'-(ethylenedioxy)bis-benzoates having improved properties such as anti-oxidation and anti-coloration are prepared in high yield and selectivity by, at the first step, reacting an excess alkyl p-hydroxybenzoate with a recycling alkyl p-(2-chloro-ethoxy)benzoate with heating in the presence of an alkali carbonate and an inert organic solvent until almost said alkyl p-(2-chloroethoxy)benzoate is consumed to produce an alkyl 4,4'-(ethylenedioxy)bis-benzoate and at the second step adding ethylene dichloride to the reaction system and continuing the heating to produce an alkyl p-(2-chloroethoxy)benzoate which is recycled, and separating the alkyl 4,4'-(ethylenedioxy)bis-benzoate produced.
    Type: Grant
    Filed: May 7, 1975
    Date of Patent: September 21, 1976
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Yohei Fukuoka, Toshio Kato, Norio Imai, Joji Nishikido, Masato Hamada, Hiroshi Mikami, Hirohumi Iwasaki, Toshihisa Koike