Abstract: There is provided an information processing device, an information processing method, and a program that further improve skills. A load weight control unit controls generation of a load weight that becomes a load with respect to motion when a keyboard is depressed by a pianist, and a keystroke recognition unit recognizes motion of the keyboard. Then, the load weight control unit performs control of starting generation of a predetermined load weight at a timing when the keystroke recognition unit recognizes that the keyboard started to be depressed, and ending generation of the load weight at a timing when the keystroke recognition unit recognizes that the keyboard ended to be depressed and started to return. The present technology can be applied to, for example, a performance skill improvement system that evaluates and trains pianists' force sense.

Abstract: For example, the accuracy of voice recognition is improved. A signal processing device includes: a single speech detection unit that detects whether one channel of an input voice signal is a speech of a single speaker; a cluster information updating unit that updates cluster information based on a voice feature quantity when the input voice signal is a speech of a single speaker; a voice segment detection unit that detects a speech segment of a target speaker based on the cluster information; and a voice extraction unit that extracts only the voice signal of the target speaker from a mixed voice signal containing the voice of the target speaker.

Abstract: Provided is an information processing device including an acquisition unit that acquires subjective evaluation information from a second user about each performance performed by at least part of a body of a first user moving, a learning unit that performs machine learning on a relationship between the each performance and the corresponding subjective evaluation information and generates relationship information between the each performance and the corresponding subjective evaluation information, and a presentation unit that presents feedback information to the second user based on the relationship information.

Abstract: There is provided an information processing device, an information processing method, and a program that further improve skills. A load weight control unit controls generation of a load weight that becomes a load with respect to motion when a keyboard is depressed by a pianist, and a keystroke recognition unit recognizes motion of the keyboard. Then, the load weight control unit performs control of starting generation of a predetermined load weight at a timing when the keystroke recognition unit recognizes that the keyboard started to be depressed, and ending generation of the load weight at a timing when the keystroke recognition unit recognizes that the keyboard ended to be depressed and started to return. The present technology can be applied to, for example, a performance skill improvement system that evaluates and trains pianists' force sense.

Abstract: A drum unit includes a photosensitive drum and a cleaning member. A scratch remaining depth measured by a scratch test of the photosensitive drum under a following Test Condition 1 is 110 nm or less. Test Condition 1 is; test environment temperature=25° C.; test environment humidity=50%; test indenter=pre-mount type Berkovich indenter; scratch direction=horizontal direction; scratch speed=20 ?m/sec; initial load=0 mN; maximum reaching load=4 mN; and load at the time of measuring the scratch remaining depth=1.9 mN.

Abstract: A drum unit includes a photosensitive drum and a cleaning member. A scratch remaining depth measured by a scratch test of the photosensitive drum under a following Test Condition 1 is 110 nm or less. Test Condition 1 is; test environment temperature=25° C.; test environment humidity=50%; test indenter=pre-mount type Berkovich indenter; scratch direction=horizontal direction; scratch speed=20 ?m/sec; initial load=0 mN; maximum reaching load=4 mN; and load at the time of measuring the scratch remaining depth=1.9 mN.

Abstract: A circuit board includes a substrate including electrode patterns formed thereon, first chip components mounted on the substrate and a second chip component mounted on a side of electrodes of the first chip components opposite from the substrate. The second chip component is bonded at one electrode to an electrode of the first chip component and is also bonded at the other electrode to an electrode of the first chip component. By stacking chip components in plural stages, it is possible to mount chip components with a high density on the substrate, thereby enabling reduction of the size of the circuit board.

Abstract: A recycling method of wastes of an electrical appliance containing an article having a circuit soldered with parts soldered with a lead free solder. The method includes discriminating a first article having a circuit soldered with lead free parts from a second article having a circuit soldered with lead containing parts; recovering, grinding and melting each of the first and second articles to separate materials of the first article and materials of the second article; recycling reusable valuables contained in the materials of the first article and second article; and shredding a portion of the first and second article not containing the reusable valuables and burying/treating the portion at a stabilizing dumping ground or a controlled dumping ground for disposal.

Abstract: It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.

Abstract: A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

Abstract: The disclosure provides an article having a circuit mounted with parts characterized by comprising an electronic part soldered with a lead free solder and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a circuit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not.

Abstract: A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

Abstract: An electronic component mounting method comprising: supplying an unhardened reinforcing resin on a circuit substrate; supplying a solder paste on bond areas of the circuit substrate on which electrodes of the electronic components are to be bonded; placing the electronic components on the circuit substrate; and heating and then cooling the circuit substrate with the reinforcing resin, the solder paste, and the electronic components carried thereon. The mounting method enables mounting of components with high joint reliability, while incorporating the conventional surface mount process steps. The method may also be applied to the mounting of smaller electronic components with narrower pitch without deteriorating productivity or mounting quality.

Abstract: An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.

Abstract: A barrier metal layer is provided on at least one of two electrodes, with one formed on a substrate and the other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Bi, contacting the solder material with the barrier metal layer while the solder material is in a molten state; and solidifying the solder material. Thereby, when the electronic component is soldered to the substrate with the solder material such as an Sn—Bi based material or an Sb—Ag based material containing Bi, the degradation of a soldering part is avoided, and thus a sufficient thermal fatigue strength of the soldering part is obtained.

Abstract: Deterioration of a joining portion caused by a Cu—Zn compound layer is prevented by forming compound or alloy of Cu and Sn at the joining interface including a Cu surface to be a joining portion of a circuit board and an electronic component and then carrying out soldering by use of a soldering material containing Sn and Zn in composition.

Abstract: It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.

Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Abstract: An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.