Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Abstract: A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

Abstract: A barrier metal layer is provided on at least one of electrodes, one formed on a substrate and other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Bi, contacting the solder material with the barrier metal layer while the solder material is in a molten state; and solidifying the solder material. Thereby, in the case where the electronic component is soldered to the substrate with the solder material such as an Sn—Bi based material or an Sb—Ag based material containing Bi, the degradation of a soldering part is avoided, and thus a sufficient thermal fatigue strength of the soldering part is obtained.

Abstract: There is provided a controlling method of a storage apparatus connected to an external device constructed by including a cache memory, a data controller controlling the cache memory, a plurality of storage devices, and a device controller controlling the storage devices, where the storage apparatus receives, from the external device, data and a request of writing the data in the storage devices; the data controller directly writes the data in a plurality of regions in the cache memory; and then the device controller writes the data in the storage devices corresponding to the respective regions.

Abstract: There is provided an improved lead-free solder material which is preferably used as a connecting material in a mounting process of an electronic component.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material, wherein the molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and thereafter the board is cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: In a method and a device for mounting an electronic component, a solder paste is printed on lands of a substrate with the use of a mask having a projecting part at a portion facing the substrate and positioned to between neighboring lands, and the projecting part prevents the solder paste on of the neighboring lands from flowing so as to come in contact with a other of the neighboring land to cause a shortcircuit between the neighboring lands.

Abstract: A method for mounting on integrated circuit having many leads with narrow pitches on the printed circuit board. In a method, a resist layer is formed between lands on the board, and solder paste is applied with a stencil to the lands so that the positions of the solder paste on the lands are staggered. Then, leads of the integrated circuit are positioned on the lands. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. In a different embodiment, each land includes a first portion and a second portion having a width narrower than the first portion, and the second portions are arranged staggeredly among the lands. Then, solder paste is applied to the first portions having the wider width. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. If solder including bismuth is used, reflow soldering can be performed in ambient environment.

Abstract: Disclosed is a silver halide photographic material comprising:at least one silver halide emulsion layer;a hydrazine derivative; andat least one hydroquinone derivative represented by general formula (LI) or (LII): ##STR1## wherein G represents hydrogen atom or an alkyl group having 1 to 17 carbon atoms;n represents an integer of 1 to 5; andR.sub.1 to R.sub.10 each represent a hydrogen atom, an alkyl group, an aryl group, a hydroxyl group, an alkoxy group, an aryloxy group, a halogen atom, a primary, secondary or tertiary amino group, a carbonamido group, a sulfonamido group, a carbamoyl group, a sulfamoyl group, an alkylthio group, an arylthio group, an alkylsulfonyl group, an arylsulfonyl group, a carboxyl group or a sulfo group.

Abstract: A method of producing an image comprising processing an imagewise exposed silver halide photosensitive material comprising a support having thereon a silver halide emulsion layer containing a silver halide sensitized with a selenium sensitizer in a black-and-white developer which contains a chelate complex salt of a transition metal. In a preferred embodiment, an electric current is passed through the developer to remove halide ions therefrom and to regenerate (reduce) the metal complex. A protective layer may be provided on the silver halide emulsion layer having a thickness of 0.6 .mu.m or less.

Abstract: A process for development-processing a black-and-white silver halide light-sensitive material is disclosed, which comprises using a developer containing at least one compound represented by formulae (I) and (II): ##STR1## wherein R.sub.1 and R.sub.2 each represents hydrogen atom, an alkyl group or an aryl group;M represents hydrogen atom, an alkali metal atom, an alkaline earth metal atom, a quaternary ammonium salt, a quaternary phosphonium salt, an amidino group or a group capable of being converted to hydrogen or an alkali metal atom under alkaline conditions;n represents an integer of 1 or more; andZ.sup..crclbar. represents an anion.

Abstract: A method for forming a high contrast negative image comprising the steps of:(a) imagewise exposing a silver halide photographic material comprising a support having thereon at least one light-sensitive silver halide emulsion layer, said emulsion layer or other hydrophilic colloid layer containing at least one hydrazine derivative; and(b) developing said exposed silver halide photographic material in an developer solution containing:(1) a dihydroxybenzene developing agent;(2) at least one auxiliary developing agent selected from a 1-phenyl-3-pyrazolidone auxiliary developing agent and a p-aminophenol auxiliary developing agent;(3) at least 0.3 mol per liter of a sulfite; and(4) at least one compound represented by formula (I): ##STR1## wherein Y represents a group capable of adsorbing to silver halide; A represents a divalent linking group; B represents an amino group, an ammonium group or a nitrogen containing heterocyclic group; m is 1, 2 or 3; and n is 0 or 1; to form a high contrast negative image.

Abstract: Disclosed is a method for processing a silver halide photographic material having at least one silver halide emulsion layer on a support and containing at least one hydrazine derivative in said silver halide emulsion layer or in another hydrophilic colloid layer with a roller-conveying type automatic developing machine using a dihydroxybenzene developer containing a sulfite preservative in an amount of 0.15 mol/liter or more at pH of 10.5 to 12.3, which method is characterized in that at least the roller which is in contact with both the developer and air, among the rollers of the said developing machine, is continuously rotated at a determined speed during conveyance or processing of the material during a processing phase, and intermittently rotated during a stand-by phase. By the method, the photographic material may be processed stably and rapidly for a long period of time to give an image having a high contrast and a high blackened density.

Abstract: An image-forming process for silver halide photographic material is disclosed, in which the photosensitive material have at least one silver halide emulsion layer on a support and contains a hydrzaine compound in the emulsion layer or other constitutional layers. The image-forming process comprises developing the photographic material containing the hydrozine compound of formula (I) with the developing agent of formula (II).