Abstract: An object of the present invention is to provide a novel method for forming a carbonaceous structure comprising minute carbon bodies such as CNTs. A method for forming a carbonaceous structure on the surface of a substrate, comprising a step of forming a layered structure by at least partially filling a gap between a porous membrane which can hold a dispersion medium and a substrate with a minute-carbon-body dispersion liquid comprising the minute carbon bodies and the dispersion medium, and a step of removing the dispersion medium by at least partially taking the dispersion medium out of the layered structure through the porous membrane and/or the substrate.

Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

Abstract: A production method for a composite material, which includes a porous substrate and a silicon carbide film formed on a surface of a material forming the porous substrate, includes causing a silicon source containing a silicon atom, a chlorine source containing a chlorine atom, and a carbon source containing a carbon atom to react with each other to form the silicon carbide film on the surface of the material forming the porous substrate.

Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

Abstract: This disclosure is to make it possible to easily stabilize a chlorosilane polymer while preventing a solid chlorosilane polymer from being generated. Disclosed is a method for stabilizing a chlorosilane polymer generated secondarily in a step of a chemical vapor deposition method using chlorosilane-based gas, the method including: a step of bringing alcohol into contact with the chlorosilane polymer, degrading the chlorosilane polymer to alkoxide, hydrogen chloride and hydrogen, and diluting the degraded alkoxide with the alcohol; and a step of performing hydrolysis for the alkoxide.

Abstract: A connection structure for a wiring substrate and a flexible substrate including a wiring substrate and a flexible substrate, in which the wiring substrate includes an insulating member, conductor layer, and ground layer, the flexible substrate includes an insulating sheet and metal film, and the metal film includes a signal line pad joined to the conductor layer via a joining material when viewed from the back surface of the flexible substrate. When viewed from behind the flexible substrate, there is an overlap region where the signal line pad and conductor layer overlap. In a cross-section when the overlap region is cut in a direction perpendicular to a signal transmission direction, in a case where a width of the signal line pad including the overlap region is W, and a width of the conductor layer including the overlap region is W0, the connection structure satisfies W0<W.

Abstract: A ceramic matrix composite of the present disclosure includes a fiber substrate including a silicon carbide fiber bundle, and a silicon carbide film formed on a surface of each silicon carbide fiber of the silicon carbide fiber bundle, in which a ratio of an average film thickness D2 to an average film thickness Di is 1.0 to 1.3, the average film thickness Di being an average film thickness of the silicon carbide film formed on a surface of the silicon carbide fiber in an outer layer of the silicon carbide fiber bundle, and the average film thickness D2 being an average film thickness of the silicon carbide film formed on a surface of the silicon carbide fiber in an inner layer, which is positioned inside the outer layer, of the silicon carbide fiber bundle.

Abstract: A production method for a composite material, which includes a porous substrate and a silicon carbide film formed on a surface of a material forming the porous substrate, includes causing a silicon source containing a silicon atom, a chlorine source containing a chlorine atom, and a carbon source containing a carbon atom to react with each other to form the silicon carbide film on the surface of the material forming the porous substrate.

Abstract: A connection structure for a wiring substrate and a flexible substrate including a wiring substrate and a flexible substrate, in which the wiring substrate includes an insulating member, conductor layer, and ground layer, the flexible substrate includes an insulating sheet and metal film, and the metal film includes a signal line pad joined to the conductor layer via a joining material when viewed from the back surface of the flexible substrate. When viewed from behind the flexible substrate, there is an overlap region where the signal line pad and conductor layer overlap. In a cross-section when the overlap region is cut in a direction perpendicular to a signal transmission direction, in a case where a width of the signal line pad including the overlap region is W, and a width of the conductor layer including the overlap region is W0, the connection structure satisfies W0<W.

Abstract: A reheating collection device for a gas phase process is provided with a container elongated in an axial direction along an axis to define a chamber, an inflow path and an exhaust path respectively in communication with the chamber and apart in the axial direction from each other, and a heater heating the chamber between the inflow path and the exhaust path.

Abstract: This disclosure is to make it possible to easily stabilize a chlorosilane polymer while preventing a solid chlorosilane polymer from being generated. Disclosed is a method for stabilizing a chlorosilane polymer generated secondarily in a step of a chemical vapor deposition method using chlorosilane-based gas, the method including: a step of bringing alcohol into contact with the chlorosilane polymer, degrading the chlorosilane polymer to alkoxide, hydrogen chloride and hydrogen, and diluting the degraded alkoxide with the alcohol; and a step of performing hydrolysis for the alkoxide.

Abstract: A reheating collection device for a gas phase process is provided with a container elongated in an axial direction along an axis to define a chamber, an inflow path and an exhaust path respectively in communication with the chamber and apart in the axial direction from each other, and a heater heating the chamber between the inflow path and the exhaust path.

Abstract: A mixed gas containing a precursor gas, an additive gas and a carrier gas is supplied to a preform stored in an electric furnace, and silicon carbide is deposited by chemical vapor deposition or chemical vapor phase impregnation to form a film. The preform includes multiple fiber bundles, and the fiber bundles include multiple fibers. This heat-resistant composite material includes a ceramic fiber preform impregnated with silicon carbide, and producing the composite material involves a step in which silicon carbide is deposited between the fibers to integrate the fibers which configure the fiber bundles, and a step in which silicon carbide is deposited between the fiber bundles to integrate the fiber bundles. Hereby, uniformity of embedding and growth rate of the silicon carbide film are both attained.

Abstract: A fiber reinforced composite member molding apparatus comprises a pair of mold parts which are brought nearer to and away from each other, and in a mold clamping state, clamp laminated sheets of prepreg formed of woven fiber fabric impregnated with resin, and heat sources for heating the resin in the prepreg through the pair of mold parts, wherein the two mold parts each comprise a base mold and a design mold which is detachably attached to the base mold and brought into contact with the prepreg, wherein the design molds of the mold parts are made of a metal lower in thermal expansion rate than the base molds. The mold parts having such split structure can reduce the burden on operators handling replacement of the mold parts, and also can suppress, during heating for molding, the influence of thermal expansion of the mold parts upon a to-be-molded fiber reinforced composite member.

Abstract: In a fiber reinforced composite member molding apparatus comprising a lower mold having a cavity, an upper mold having a core which, in a mold clamping state, engages with the cavity in the lower mold and thereby clamps layered prepreg, and heat sources for heating the layered prepreg through the lower mold and the upper mold, and adapted to mold a fiber reinforced composite member from the layered prepreg by applying pressure while heating resin in the layered prepreg between the lower mold and the upper mold by the heat sources, the lower mold is equipped with a cavity heat-escape prevention portion and the upper mold is equipped with a core heat-escape prevention portion. During heating for molding, escape of heat from the periphery of the cavity of the upper mold and the periphery of the core of the lower mold can be prevented, which allows a fiber reinforced composite member to be molded with almost no defects such as wrinkles.

Abstract: By using chemical vapor deposition or chemical vapor infiltration, silicon carbide is deposited on a preform 100 accommodated in a reaction furnace 11 for film formation, and the amount of additive gas added to raw material gas and carrier gas to be supplied to the reactive furnace 11 is used to control the growth rate and filling uniformity at film formation of silicon carbide. When the film formation of silicon carbide follows a first-order reaction, the amount of added additive gas is used to control the sticking probability of the film-forming species. When the film formation of silicon carbide follows a Langmuir-Hinshelwood rate formula, the amount of added additive gas is used to make a control so that a zero-order reaction region of the Langmuir-Hinshelwood rate formula is used.