Abstract: A powder coating apparatus includes a specific transport device that transports an object to be coated, and a specific applying unit, a specific heating device, and a specific control device, wherein the applying unit is disposed to oppose a surface to be coated of the transported object to be coated, applies a charged thermosetting powder coating material onto a surface to be coated of the object to be coated, and includes an applying section and a supplying section, the heating device heats a powder particle layer of the powder coating material so as to be thermally cured, and the control device controls a speed ratio between a transport speed of the object to be coated and a rotation speed of an applying member.

Abstract: An electrostatic powder coating method includes spraying a charged powder coating material including powder particles which contain a thermosetting resin, a thermosetting agent, and titanium oxide particles as a white pigment to electrostatically attach the powder coating material to an object to be coated; and heating the powder coating material which is electrostatically attached to the object to be coated to thereby form a coating film, wherein a titanium oxide particle content Tic in 1 g of the powder particles of the powder coating material which is electrostatically attached to the object to be coated and a titanium oxide particle content Tio in 1 g of the powder particles of the powder coating material before being sprayed satisfy a relationship of Expression: Tio×0.90?Tic?Tio×1.10.

Abstract: An electrostatic powder coating method includes spraying a charged powder coating material including powder particles which contain a thermosetting resin and a thermosetting agent to electrostatically attach the powder coating material to an object to be coated; and heating the powder coating material which is electrostatically attached to the object to be coated, and forming a coating film, wherein a volume proportion D5c of powder particles having a particle diameter equal to or smaller than 5 ?m with respect to the powder particles of the powder coating material which is electrostatically attached to the object to be coated and a volume proportion D5o of powder particles having a particle diameter equal to or smaller than 5 ?m with respect to the powder particles of the powder coating material before being sprayed satisfy a relationship of Expression: D5o×0.80?D5c?D5o×1.20.

Abstract: An electrostatic powder coating method includes spraying a charged powder coating material including powder particles which contain a thermosetting resin and a thermosetting agent to electrostatically attach the powder coating material to an object to be coated, and heating the powder coating material which is electrostatically attached to the object to be coated to thereby form a coating film, wherein a volume average particle diameter Dc of the powder particles of the powder coating material which is electrostatically attached to the object to be coated and a volume average particle diameter Do of the powder particles of the powder coating material before being sprayed satisfy a relationship of Expression: Do×0.80?Dc?Do×1.20.

Abstract: A thermosetting powder coating material includes a powder particle containing a thermosetting resin and a thermosetting agent and has a volume particle size distribution index GSDv of less than 1.20 and an average circularity of not less than 0.96.

Abstract: A cable connection structure includes: a cable having a core and a jacket made of an insulating material to cover the core; and a substrate connected with the cable. The substrate includes: a base material made of an insulating material; an external connection electrode formed on a surface of the base material and connected with the core; and a via provided in the base material and having an end exposed from a mounting surface of the substrate on which the cable is mounted, the via being connected with the external connection electrode. The via is provided at least at one of both ends of a surface of the external connection electrode perpendicular to an axial direction of the cable, on a proximal end side of the cable.

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device, and a length of the hard portion in a direction perpendicular to a bend line of the flexible portion is equal to a thickness of a bottom surface of the electronic component in the direction.

Abstract: An imaging device includes: a group of lenses configured to collect incident light; a lens supporting member including a fitting portion into which the group of lenses is fitted; a prism configured to reflect light collected by the group of lenses; and an image sensor having a light receiving unit configured to receive the light reflected by the prism and to perform a photoelectric conversion on the received light to generate an electric signal. The lens supporting member has a cutout or an opening portion into which the prism is fitted. The lens supporting member is connected to a surface of the image sensor where the prism is mounted.

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device.

Abstract: A thermosetting powder coating material includes: powder particles containing a thermosetting resin and a thermosetting agent; and inorganic oxide particles containing a silane compound having an amino group.

Abstract: A powder coating apparatus includes: a transport device that transports an object to be coated; an applying unit disposed to be opposed to a surface to be coated of the transported object to be coated and applying a charged thermosetting powder coating material onto the surface to be coated of the object to be coated, that includes an applying section including a cylindrical or columnar applying member that is disposed to be separated from the surface to be coated of the object to be coated, and a supplying section including a cylindrical or columnar supplying member that supplies the powder coating material onto the surface of the applying member; a voltage applying device; and a heating device.

Abstract: A powder coating material includes powder particles that include a binder resin, have an average circularity of 0.97 or greater, and have a coloring pigment provided on a surface of the powder particles.

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device, and a length of the hard portion in a direction perpendicular to a bend line of the flexible portion is equal to a thickness of a bottom surface of the electronic component in the direction.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

Abstract: A powder coating apparatus includes a specific transport device that transports an object to be coated, and a specific applying unit, a specific heating device, and a specific control device, wherein the applying unit is disposed to oppose a surface to be coated of the transported object to be coated, applies a charged thermosetting powder coating material onto a surface to be coated of the object to be coated, and includes an applying section and a supplying section, the heating device heats a powder particle layer of the powder coating material so as to be thermally cured, and the control device controls a speed ratio between a transport speed of the object to be coated and a rotation speed of an applying member.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

Abstract: A powder coating material set for performing color matching by dry mixing of at least two kinds of powder coating materials having different colors is disclosed. The powder coating materials contain powder particles, and the powder particles contain a thermosetting resin and a thermosetting agent, and have a volume average particle diameter of 3 ?m to 10 ?m and a GSDv of equal to or smaller than 1.3.

Abstract: A resin composition includes a cellulose derivative represented by the following formula (1), a polycarbonate, an ABS resin, and a phosphate: wherein A1, A2, A3, A4, A5, and A6 each independently represent a hydrogen atom or an acyl group, and n represents an arbitrary integer.

Abstract: A semiconductor device includes: a semiconductor chip that has a first connection terminal for wiring connection; a substrate that has a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.