Patents by Inventor Masato Ushikusa

Masato Ushikusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210157232
    Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
    Type: Application
    Filed: February 5, 2021
    Publication date: May 27, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Chiaki HATSUTA, Hiroki OKA, Sachiyo MATSUURA, Hideyuki OKAMOTO, Masato USHIKUSA
  • Publication number: 20210069739
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: November 18, 2020
    Publication date: March 11, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Patent number: 10894267
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: January 19, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20200395545
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask that enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Application
    Filed: August 28, 2020
    Publication date: December 17, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
  • Publication number: 20200291509
    Abstract: A deposition mask includes an effective part in which a plurality of openings are provided, and an outer frame part surrounding the effective part. The effective part includes an outer peripheral area that is adjacent to the outer frame part, and a central area which is surrounded by the outer peripheral area and has a thickness larger than a thickness of the outer peripheral area.
    Type: Application
    Filed: April 22, 2020
    Publication date: September 17, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Isao MIYATANI, Daigo AOKI, Masato USHIKUSA, Yoshinori MURATA, Hideyuki OKAMOTO
  • Publication number: 20200149139
    Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 14, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki Oka, Sachiyo Matsuura, Chiaki Hatsuta, Chikao Ikenaga, Hideyuki Okamoto, Masato Ushikusa
  • Publication number: 20200152463
    Abstract: A deposition mask includes: a first mask having an opening formed therein; and a second mask superposed on the first mask and having a plurality of through-holes formed therein, the through-hole having a planar dimension smaller than a planar dimension of the opening; wherein: the deposition mask has a plurality of joints that join the second mask and the first mask to each other; the plurality of joints are arranged along an outer edge of the second mask; and a notch is formed at a position in the outer edge of the second mask, the position corresponding to a space between the adjacent two joints.
    Type: Application
    Filed: December 24, 2019
    Publication date: May 14, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Masato USHIKUSA, Yusuke Nakamura, Hideyuki Okamoto, Yoshinori Murata
  • Publication number: 20200017951
    Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Chiaki Hatsuta, Hiroki Oka, Sachiyo Matsuura, Hideyuki Okamoto, Masato Ushikusa
  • Publication number: 20200019056
    Abstract: A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Hideyuki Okamoto, Masato Ushikusa, Chiaki Hatsuta, Hiroki Oka, Sachiyo Matsuura
  • Publication number: 20200017950
    Abstract: The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.
    Type: Application
    Filed: September 21, 2019
    Publication date: January 16, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki OKA, Sachiyo Matsuura, Chiaki Hatsuta, Chikao Ikenaga, Hideyuki Okamoto, Masato Ushikusa
  • Publication number: 20190378984
    Abstract: A vapor deposition mask device includes a vapor deposition mask having an effective region in which a plurality of first through holes is disposed, and a frame attached to the vapor deposition mask. The vapor deposition mask device includes a plurality of joint portions that joins the vapor deposition mask and the frame to each other. The plurality of joint portions is arranged along the outer edge of the vapor deposition mask. A notch is formed at a position corresponding to between two adjacent joint portions in the outer edge of the vapor deposition mask.
    Type: Application
    Filed: June 12, 2019
    Publication date: December 12, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yusuke NAKAMURA, Hideyuki OKAMOTO, Masato USHIKUSA
  • Publication number: 20190329277
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 31, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Publication number: 20190296240
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask that enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Application
    Filed: April 2, 2019
    Publication date: September 26, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATASUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
  • Patent number: 10391511
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: August 27, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20190070625
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 7, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Patent number: 10189042
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 29, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Patent number: 10160000
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: December 25, 2018
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20180318864
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: June 22, 2018
    Publication date: November 8, 2018
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Publication number: 20170110662
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask that enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Application
    Filed: December 27, 2016
    Publication date: April 20, 2017
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
  • Patent number: 9548453
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: January 17, 2017
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Katsunari Obata, Hiroyuki Nishimura