Patents by Inventor Masato Ushikusa

Masato Ushikusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10391511
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: August 27, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20190070625
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 7, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Patent number: 10189042
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 29, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Patent number: 10160000
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: December 25, 2018
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20180318864
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: June 22, 2018
    Publication date: November 8, 2018
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Publication number: 20170110662
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask that enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Application
    Filed: December 27, 2016
    Publication date: April 20, 2017
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
  • Patent number: 9548453
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: January 17, 2017
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Katsunari Obata, Hiroyuki Nishimura
  • Patent number: 9527098
    Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: December 27, 2016
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20160325300
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: July 20, 2016
    Publication date: November 10, 2016
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Publication number: 20160163983
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Application
    Filed: October 9, 2015
    Publication date: June 9, 2016
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Katsunari OBATA, Hiroyuki NISHIMURA
  • Patent number: 9343679
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: May 17, 2016
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Katsunari Obata, Hiroyuki Nishimura
  • Publication number: 20150251205
    Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.
    Type: Application
    Filed: May 22, 2015
    Publication date: September 10, 2015
    Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
  • Patent number: 9108216
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: August 18, 2015
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20150037928
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Application
    Filed: January 11, 2013
    Publication date: February 5, 2015
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Publication number: 20150017759
    Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.
    Type: Application
    Filed: January 11, 2013
    Publication date: January 15, 2015
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Katsunari Obata, Hiroyuki Nishimura