Abstract: Disclosed is a flame-retardant resin composition which comprises inorganic particles, preferably a fly ash, containing a complex of silicon dioxide and aluminum oxide and having D50 of 1 to 10 ?m.

Abstract: Disclosed are a polysiloxane-modified polylactic acid resin, composition using same, molded article, and production method, whereby it is possible to produce a molded article via a simple method, and where said article may be used in applications demanding a high level of impact resistance as an alternative to ABS resin or the like, has a similar level of impact resistance as said substances, has superior flexibility with respect to rupture bending strain and tensile breaking strain, and has bleed resistance. The polysiloxane-modified polylactic acid resin has a segment which is a polylactic acid compound, and a segment which is an amino polysiloxane compound which has an amine group. With respect to the amino poly-siloxane compound, amine groups are on average contained in the range of 0.01 to 2.5% inclusive by mass, and with respect to the polylactic acid compound, are on average contained in the range of 3 to 300 ppm inclusive by mass.

Abstract: In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.

Abstract: Disclosed is a polylactic acid resin composition having excellent bleed resistance and molecular weight retention ratio. A polylactic acid resin molded body is also disclosed. The polylactic acid resin composition contains a polylactic acid resin (a), a metal hydrate (b) having an alkali metal-containing substance content of not more than 0.2% by mass, and a phosphazene derivative (c). The polylactic acid resin molded body is obtained by molding the polylactic acid resin composition. Specifically, a polylactic acid molded body can be produced by filling a melt of the polylactic acid resin composition into a mold at a temperature in the range from glass transition temperature of said polylactic acid resin (a) to 110° C. and molding the melt therein.

Abstract: A metal oxide-based fine particle includes a metal oxide-based core region; an intermediate region formed on the outer periphery of the core region, the intermediate region having an alkoxyorganosiloxane condensate structure; and a surface region including an organic molecular chain or an organic silicon molecular chain or a reactive functional group.

Abstract: An organic silicon compound includes a specific alkoxyorganopolysiloxane portion, a portion including an alkoxysilane group, the portion being bonded to the polysiloxane portion, and a portion including a resin-compatible chain or a reactive functional group, the portion being bonded to the polysiloxane portion.

Abstract: The present invention provides a polylactic acid resin composition, containing a polylactic acid resin and a metal hydrate surface-treated with at least one silane coupling agent selected from an amino-silane coupling agent, a mercapto-silane coupling agent and an isocyanate-silane coupling agent, wherein the content of an alkali metal component in the metal hydrate is not more than 0.2% by mass and a polylactic acid resin molded article produced by molding the polylactic acid resin composition.

Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: There are provided: a shape-memory resin, which is formed from a polylactic acid derivative thereby enabling reduction of an environmental load, has an excellent shape-memory property, high strength, and high toughness, and with which a molded product with high durability, for example, an electronic equipments, particularly a wearable electronic equipments capable of freely changing the shape thereof or the like, can be shaped; and a molded product thereof. The shape-memory resin of the present invention has a three-dimensional structure, in which a polylactic acid derivative having two or more functional groups capable of forming a cross-linking site is cross-linked using a flexible polymer having a glass transition temperature (Tg) lower than 30° C. and having two or more functional groups capable of forming a cross-linking site, and a linker.

Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: It is possible to provide a shape-memory molded product having excellent shape-memory properties and recycling efficiency by using a shape-memory resin having a glass transition temperature (Tg) within the range of 40° C. to 200° C. and a dissociation temperature (Td) of a thermo-reversible reaction within the range of 50° C. to 300° C. and satisfying the relationship: Tg+10° C.?Td, wherein the resin is deformed at a temperature of Tg to less than Td, and cross-linked through a thermo-reversible reaction in which a covalent bond is formed by cooling and dissociated by heating.

Abstract: The present invention relates to an aliphatic polyester resin composition having excellent hydrolysis resistance, added to an aliphatic polyester resin (A), a reactive monomer (B) (e.g. a monocarbodiimide compound) and a reactive polymer (C) (e.g. a polycarbodiimide compound).

Abstract: The thermally conductive resin material of the present invention has an excellent thermal conductive property without impairing the intrinsic practical properties such as the forming processability, lightness in weight and mechanical strength possessed by resins and has an anisotropic thermal conductive property capable of controlling the directionality and the transfer amount of the thermal conduction. The thermally conductive resin material of the present invention is a thermally conductive resin material including a base material of a thermoplastic resin (A) and a fibrous filler (C), wherein an organic compound (B) incompatible with the resin component is present as dispersed particles in the resin component, and two or more elements of the fibrous filler (C) are in contact with the surface of each of the dispersed particles or are located in each of the dispersed particles.

Abstract: Provided is a plant-derived resin composite material which has a sufficiently fast crystallization rate and excellent moldability and heat resistance by using a thermoplastic resin composition containing a plant-derived thermoplastic resin and an organic crystal nucleating agent which is composed of one or more low molecular weight compounds comprising at least two polar groups in the molecule, a spacing between any two of the polar groups being 34±4 angstroms.

Abstract: The present invention relates to a polylactic acid-modified polycarbodiimide compound which imparts hydrolysis resistance by formulation with a polylactic acid resin and also thereby improves mechanical property. The present invention also relates to a polylactic acid resin composition and a molded article comprising the same.

Abstract: Provided is a polylactic acid resin composition obtained by adding a carboxylic acid amide and a carboxylic acid ester each of which has at least one polar group in a molecule to a polylactic acid resin reacted with a (meth)acrylate compound. Also provided is a polylactic acid resin molded article which is a molded article obtained by molding the polylactic acid resin composition, manufactured by setting a mold temperature to a glass transition temperature of a polylactic acid resin plus 20° C. or higher and a melting point thereof minus 20° C. or lower, at the time of injection molding the polylactic acid resin composition. Thus, a resin composition in which a moldability is improved at a temperature at which a polylactic acid resin is crystallized, and a molded article therefrom are provided.

Abstract: Provided are a resin composition in which a moldability is improved at a temperature at which a polylactic acid resin is crystallized by adding both a carboxylic acid amide or a carboxylic acid ester which has at least one polar group in a molecule and a layered silicate to the polylactic acid resin, and a molded article.

Abstract: An object of the present invention is to provide a fiber-reinforced resin composition suitable for producing molded articles for products such as electrical and electronic equipment. The object has been achieved by a biodegradable resin composition containing a kenaf fiber, which contains a kenaf fiber in an amount of 10 to 50% by mass. In this case, the biodegradable resin is preferably a crystalline thermoplastic resin, particularly polylactic acid. The average fiber length (number average fiber length of the fibers excluding fragments) of the kenaf fiber is preferably 100 ?m to 20 mm, and the kenaf fiber preferably contains a kenaf fiber having a fiber length of 300 ?m to 20 mm. As the kenaf fiber, a fiber prepared from bast of kenaf is preferred.

Abstract: Disclosed is a flame-retardant resin composition which comprises inorganic particles, preferably a fly ash, containing a complex of silicon dioxide and aluminum oxide and having D50 of 1 to 10 ?m.