Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.

Abstract: It is possible to provide a shape-memory molded product having excellent shape-memory properties and recycling efficiency by using a shape-memory resin having a glass transition temperature (Tg) within the range of 40° C. to 200° C. and a dissociation temperature (Td) of a thermo-reversible reaction within the range of 50° C. to 300° C. and satisfying the relationship: Tg+10° C.?Td, wherein the resin is deformed at a temperature of Tg to less than Td, and cross-linked through a thermo-reversible reaction in which a covalent bond is formed by cooling and dissociated by heating.

Abstract: An epoxy resin composition which comprises an epoxy resin (A) and a curing agent (B) for epoxy resins, wherein the curing agent (B) for epoxy resins comprises a phenol-based resin (F) which contains at least either of a structural unit (X) represented by a given general formula obtained by reacting a biphenyl isomer or a mixture of biphenyl isomers with a phenol-based compound and a structural unit (Y) represented by a given general formula obtained by reacting a benzene isomer or a mixture of benzene isomers with a phenol-based compound, the sum of the number of repetitions of the structural unit (X) and that of the structural unit (Y) (n or m+m?) being larger than 10 and smaller than 75.

Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Abstract: An object of the present invention is to provide a fiber-reinforced resin composition suitable for producing molded articles for products such as electrical and electronic equipment. The object has been achieved by a biodegradable resin composition containing a kenaf fiber, which contains a kenaf fiber in an amount of 10 to 50% by mass. In this case, the biodegradable resin is preferably a crystalline thermoplastic resin, particularly polylactic acid. The average fiber length (number average fiber length of the fibers excluding fragments) of the kenaf fiber is preferably 100 ?m to 20 mm, and the kenaf fiber preferably contains a kenaf fiber having a fiber length of 300 ?m to 20 mm. As the kenaf fiber, a fiber prepared from bast of kenaf is preferred.

Abstract: A biodegradable resin having sufficient heat resistance, molding property and recycling property can be obtained, without losing biodegradability, by introducing a covalently bonded and thermo-reversible cross-linked structure into a biodegradable resin. Heat resistance, molding property, recycling property and biodegradability can be further improved, if necessary, by setting the cleaving temperature of a cross-linked structure in a given range, selecting the kind of a cross-linked structure, and making a three-dimensional cross-linked structure.

Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: A flame-retardant epoxy resin composition comprising an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent is a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin (D) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: This invention is a flame resistant polycarbonate resin composition characterized by blending 0.01-2 weight parts of a silicone compound (B)) wherein a main chain has a branch structure and having an aromatic group in an organic substituent, 0.01-2 weight parts of an alkali metal salt of an aromatic sulfonic acid (C) represented by the following general formula 1 (hereafter, referred to as general formula 1), and 0.05-5 weight parts of a fiber-forming fluorine-containing polymer (D), relative to 100 parts of a polycarbonate resin (A): General formula 1: Am—R—(SO3M)n (wherein, R is a phenyl group, naphthyl group, or a phenyl group or naphthyl group substituted by A, where A is at least one type of substituent chosen from a group comprising a halogen atom, alkyl group, aryl group, vinyl group, alkoxy group, amino group, methyl ester group and ethyl ester group, and M is an alkali metal.

Abstract: The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D), and also provides a flame retardant epoxy resin material which includes an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D).

Abstract: A flame-retardant polycarbonate resin composition comprising 100 parts by weight of a polycarbonate resin (A), about 0.01 to about 8 parts by weight of a silicone compound (B) and 0.03 to 5 parts by weight of a metal salt of an aromatic sulfur compound (C) or about 0.01 to about 5 parts by weight of a metal salt of a perfluoroalkanesulfonic acid (D), or further containing about 0.05 to about 5 parts by weight of a fiber-forming fluoropolymer (E), wherein the backbone structure of said silicone compound (B) is branched and said silicone compound (B) comprises organic groups that contain aromatic groups. The flame-retardant polycarbonate resin compositions according to the present invention attain great flame retardance while retaining good impact resistance and moldability unimpaired.

Abstract: There are provided: (I) a thermoplastic resin (X-1) obtained by a process comprising the step of reacting: (1) a polyphenylene ether resin (A) with (2) a specific polyorganosiloxane (B), (II) a thermoplastic resin (X-2) obtained by a process comprising the step of reacting: (1) a polyphenylene ether resin (A), with (2) a specific polyorganosiloxane (B) and (3) a coupling agent (C), (III) a process for producing the thermoplastic resin (X-1), which comprises the step of reacting: (1) a polyphenylene ether resin (A) with (2) a specific polyorganosiloxane (B), (IV) a process for producing the thermoplastic resin (X-2), which comprises the step of reacting: (1) a polyphenylene ether resin (A) with (2) a specific polyorganosiloxane (B) and (3) a coupling agent (C), and (V) a thermoplastic resin composition (Z-1) comprising: (i) the above-mentioned thermoplastic resin (X-1) or (X-2) and (ii) a thermoplastic resin (D).

Abstract: The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D), and also provides a flame retardant epoxy resin material which includes an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D).

Abstract: The present invention provides a polysiloxane-containing copolymer obtained by copolymerization of a silicone compound having a basic backbone shown by the general formula (I):

Abstract: In an electrostatic separating apparatus which separates supplied substances containing sheet-like substances into conductive substances and insulating substances by using electrostatic force and corona discharge together, a ground electrode unit has a carrier belt tensioned for a plurality of rotation rollers. An opposite electrode unit is provided with a first electrostatic electrode, a corona electrode, and a second electrostatic electrode in this order from a supply side of the supplied substances. A removing unit separates and removes the insulating substances attached to the ground electrode unit.

Abstract: A polycarbonate composition comprising an aromatic polycarbonate resin and an organopolysiloxane having a specific structure is flame retardant, evolves no harmful gases upon combustion, and is molded into parts with optical transparency.

Abstract: There are provided:

Abstract: The present invention provides an epoxy resin composition for encapsulating a semiconductor, which has excellent flame retardancy without containing any flame retardant such as halogen type, antimony trioxide or the like. The present invention lies in an epoxy resin composition for encapsulating a semiconductor, comprising as essential components: (A) a phenolic resin containing, in the total phenolic resin amount, 30 to 100% by weight of a phenolic resin of novolac structure containing, in the molecule, a biphenyl derivative and/or a naphthalene derivative, (B) an epoxy resin containing, in the total epoxy resin amount, 30 to 100% by weight of an epoxy resin of novolac structure containing, in the molecule, a biphenyl derivative and/or a naphthalene derivative, (C) an inorganic filler, and (D) a curing accelerator.