Patents by Inventor Masatoshi Nakamura

Masatoshi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080261031
    Abstract: The present invention provides a vehicle antifouling element that comprises a layer comprising a p-type semiconductor and a thin film that comprises an n-type semiconductor that is laminated on the surface of the p-type semiconductor layer. The thin film comprises a photocatalytic activity and the film thickness thereof is equal to or more than 5 nm and less than 60 nm.
    Type: Application
    Filed: December 3, 2007
    Publication date: October 23, 2008
    Applicant: MURAKAMI CORPORATION
    Inventors: Norihiko Kuzuya, Masatoshi Nakamura
  • Publication number: 20080188040
    Abstract: A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.
    Type: Application
    Filed: January 29, 2008
    Publication date: August 7, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takashi Ozawa, Seiji Sato, Masao Nakazawa, Mitsuyoshi Imai, Masatoshi Nakamura, Kei Imafuji
  • Publication number: 20080142993
    Abstract: It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 19, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takashi Ozawa, Yasushi Araki, Masatoshi Nakamura, Seiji Sato
  • Publication number: 20080032888
    Abstract: A water absorbing agent and a method for producing the water absorbing agent are disclosed. Water absorbent resin particles having an internal cross-linked structure obtained by polymerizing a water-soluble unsaturated monomer, organic acid, and water-soluble multivalent metal salt are mixed, so that it is possible to provide a water absorbing agent which suppresses permeation of metal components into the water absorbent resin particles and enables the metal components to evenly adhere to an entire surface of the water absorbent resin in a dot manner.
    Type: Application
    Filed: April 28, 2005
    Publication date: February 7, 2008
    Inventors: Masatoshi Nakamura, Koji Miyake, Hirofumi Shibata
  • Publication number: 20070247713
    Abstract: A colored anti-fog mirror that emits reflected light in response to incident light, the colored anti-fog mirror comprising a substrate, a hydrophilic functional layer containing a photocatalytic substance, and a metallic reflecting film provided between the substrate and the hydrophilic functional layer, wherein a material of the metallic reflecting film and a thickness of the hydrophilic functional layer are set such that the reflected light has a spectral reflection spectrum having a maximum reflectance in the visible region over 510 nm and not more than 600 nm.
    Type: Application
    Filed: April 2, 2007
    Publication date: October 25, 2007
    Applicant: MURAKAMI CORPORATION
    Inventors: Hideyuki Kikuchi, Masatoshi Nakamura
  • Publication number: 20070145553
    Abstract: A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the outer peripheral portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 28, 2007
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yasushi Araki, Seiji Sato, Masatoshi Nakamura, Takashi Ozawa
  • Publication number: 20070108628
    Abstract: A mounting substrate for mounting a semiconductor chip in a flip chip manner, having a plurality of connection pads to which the semiconductor chip is connected, an insulating pattern formed so as to cover a part of the connection pads, and a plurality of dummy patterns for controlling a flow of an underfill infiltrated below the semiconductor chip, characterized in that the plurality of dummy patterns are arranged in staggered lattice shape.
    Type: Application
    Filed: November 15, 2006
    Publication date: May 17, 2007
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takashi Ozawa, Yasushi Araki, Masatoshi Nakamura, Seiji Sato
  • Patent number: 7183456
    Abstract: In a production process for a water-absorbent resin, comprising the steps of: blending a liquid material and a water-absorbent resin; and heating the resultant mixture in order to produce a modified water-absorbent resin, the present invention is to provide: a method for uniformly and efficiently treating a water-absorbent resin favorably in view of industry, and as a result, a good-balanced water-absorbent resin having various excellent properties, such absorption capacity without a load, absorption capacity under a load, and single-layer absorption capacity under a load in contact with an aqueous liquid. The production process comprises the step of spray-blending a water-absorbent resin (A) and a liquid material (B) with a blending apparatus equipped with a spray nozzle (C), wherein the liquid material (B) is sprayed from the spray nozzle (C) and its spray pattern is a circular and hollow cone shape or a double-convex-lens and elliptic cone shape.
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: February 27, 2007
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Takumi Hatsuda, Yoshio Irie, Masatoshi Nakamura, Katsuyuki Wada, Shinichi Fujino, Kazuki Kimura, Kunihiko Ishizaki
  • Publication number: 20060276598
    Abstract: Objects of the present invention are: to provide a water-absorbent resin which exhibits excellent balances between water absorption performances; and further to provide a process by which a water-absorbent resin having excellent absorption properties can be produced even if no hydrophilic organic solvent is used, or even if its amount is extremely reduced, when carrying out the surface-crosslinking treatment; and further to provide a water-absorbent resin optimum to absorbent articles such as diapers.
    Type: Application
    Filed: May 7, 2004
    Publication date: December 7, 2006
    Inventors: Katsuyuki Wada, Masatoshi Nakamura, Kazuki Kimura, Kunihiko Ishizaki
  • Publication number: 20060073969
    Abstract: There are disclosed a water-absorbent resin composition and its production process, wherein the water-absorbent resin composition causes little gel-blocking and is excellent in the liquid permeability and liquid diffusibility and is high also in the absorption performances and further is strong also against the physical damage; and there are further disclosed a water-absorbent resin composition and its production process, wherein the water-absorbent resin composition has the following further advantages, in addition to the above, of involving little segregation of the metal compound and further having a dust prevention effect.
    Type: Application
    Filed: February 6, 2004
    Publication date: April 6, 2006
    Inventors: Kazushi Torii, Yoshiro Mitsukami, Motohiro Imura, Taku Iwamura, Toshimasa Kitayama, Kenji Kadonaga, Hiroki Inoue, Koji Miyake, Kozo Nogi, Masatoshi Nakamura, Shigeru Sakamoto
  • Publication number: 20050288182
    Abstract: The water absorbent resin composition and the production method thereof according to the present invention are characterized by including: water absorbent resin particles having an internal cross-linked structure obtained by polymerizing a water-soluble unsaturated monomer; a nitrogenous ketone compound (A) (containing no carboxyl group) having a structure represented by formula (1); and a bivalent and/or trivalent and/or tetravalent water-soluble metal salt, wherein a total amount of the nitrogenous ketone compound (A) and the bivalent and/or trivalent and/or tetravalent water-soluble metal salt ranges from 0.01 to 100 parts by mass with respect to 100 parts by mass of the water absorbent resin particles, thereby providing a water absorbent resin composition, having an excellent absorption capacity represented by a centrifuge retention capacity (CRC), an absorbency against pressure of 4.83 kPa (AAP) etc.
    Type: Application
    Filed: June 15, 2005
    Publication date: December 29, 2005
    Inventors: Kazushi Torii, Masatoshi Nakamura, Hiroko Okochi
  • Publication number: 20040186244
    Abstract: In a production process for a water-absorbent resin, comprising the steps of: blending a liquid material and a water-absorbent resin; and heating the resultant mixture in order to produce a modified water-absorbent resin, the present invention is to provide: a method for uniformly and efficiently treating a water-absorbent resin favorably in view of industry, and as a result, a good-balanced water-absorbent resin having various excellent properties, such absorption capacity without a load, absorption capacity under a load, and single-layer absorption capacity under a load in contact with an aqueous liquid. The production process comprises the step of spray-blending a water-absorbent resin (A) and a liquid material (B) with a blending apparatus equipped with a spray nozzle (C), wherein the liquid material (B) is sprayed from the spray nozzle (C) and its spray pattern is a circular and hollow cone shape or a double-convex-lens and elliptic cone shape.
    Type: Application
    Filed: January 27, 2004
    Publication date: September 23, 2004
    Inventors: Takumi Hatsuda, Yoshio Irie, Masatoshi Nakamura, Katsuyuki Wada, Shinichi Fujino, Kazuki Kimura, Kunihiko Ishizaki
  • Patent number: 6720389
    Abstract: In a production process for a water-absorbent resin, comprising the steps of: blending a liquid material and a water-absorbent resin; and heating the resultant mixture in order to produce a modified water-absorbent resin, the present invention is to provide: a method for uniformly and efficiently treating a water-absorbent resin favorably in view of industry, and as a result, a good-balanced water-absorbent resin having various excellent properties, such absorption capacity without a load, absorption capacity under a load, and single-layer absorption capacity under a load in contact with an aqueous liquid. The production process comprises the step of spray-blending a water-absorbent resin (A) and a liquid material (B) with a blending apparatus equipped with a spray nozzle (C), wherein the liquid material (B) is sprayed from the spray nozzle (C) and its spray pattern is a circular and hollow cone shape or a double-convex-lens and elliptic cone shape.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: April 13, 2004
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Takumi Hatsuda, Yoshio Irie, Masatoshi Nakamura, Katsuyuki Wada, Shinichi Fujino, Kazuki Kimura, Kunihiko Ishizaki
  • Patent number: 6697514
    Abstract: An apparatus for inspecting the coating of a fluorescent substance on a plasma display panel includes an illumination device for irradiating UV light onto the fluorescent substance for causing the fluorescent substance to emit light, and an imaging device for picking up the emission of the fluorescent substance. A filter, that lets only light of certain wavelengths in accordance with light emission characteristics of the fluorescent substance pass, is arranged between the imaging device and the panel being inspected.
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: February 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akira Kobayashi, Masatoshi Nakamura, Ryoichi Inoue, Tsuyoshi Nomura
  • Patent number: 6692794
    Abstract: This invention provides a composite having a hydrophilic film made of amorphous titanium oxide. A film is deposited on a substrate made of, for example, glass or synthetic resin. The film is composed of amorphous titanium oxide partially having structures in which a network of Ti—O—Ti bond is broken to give Ti—OH bond terminals.
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: February 17, 2004
    Assignee: Murakami Corporation
    Inventors: Masatoshi Nakamura, Yoshinori Hatanaka
  • Publication number: 20020192395
    Abstract: This invention provides a composite having a hydrophilic film made of amorphous titanium oxide. A film is deposited on a substrate made of, for example, glass or synthetic resin. The film is composed of amorphous titanium oxide partially having structures in which a network of Ti—O—Ti bond is broken to give Ti—OH bond terminals.
    Type: Application
    Filed: August 12, 2002
    Publication date: December 19, 2002
    Inventors: Masatoshi Nakamura, Yoshinori Hatanaka
  • Patent number: 6476155
    Abstract: A hydrophilic polymer is denatured with a gaseous denaturant or a powdery denaturant substance made from a liquid denaturant substance. The liquid denaturant substance is made into powders by, for example, a method of mixing the liquid denaturant substance with a water-insoluble compound, a method of cooling the liquid denaturant substance to or below its melting point to turn the same into a solid state. Consequently, the hydrophilic polymer can be denatured uniformly. In case that the hydrophilic polymer is denatured with a gaseous denaturant, the hydrophilic polymer and denaturant react with each other efficiently in a safe manner regardless of the size or shape of the hydrophilic polymer. In case that the hydrophilic polymer is denatured with the powdery denaturant substance, not only the liquid denaturant substance which is substantially in the solid state can be mixed with the hydrophilic polymer, but also the denaturation timing can be readily controlled.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: November 5, 2002
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Katsuyuki Wada, Masatoshi Nakamura, Kinya Nagasuna, Yoshihiko Masuda
  • Patent number: 6472088
    Abstract: This invention provides a composite having a hydrophilic film made of amorphous titanium oxide. A film is deposited on a substrate made of, for example, glass or synthetic resin. The film is composed of amorphous titanium oxide partially having structures in which a network of Ti—O—Ti bond is broken to give Ti—OH bond terminals.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: October 29, 2002
    Assignee: Murakami Corporation
    Inventors: Masatoshi Nakamura, Yoshinori Hatanaka
  • Patent number: 6469080
    Abstract: The present invention provides a water-absorbent resin composition which contains an aminoacetic chelating agent and is excellent in the urine resistance, wherein the water-absorbent resin composition is excellent further in the light resistance and becomes little colored and might have deodorizability. A water-absorbent resin composition, which comprises a water-absorbent resin and an aminoacetic chelating agent, wherein the mixing ratio of the aminoacetic chelating agent in the water-absorbent resin composition is not less than 10 ppm of the water-absorbent resin, and wherein the total content of nitrilotriacetic acid and its salt in the water-absorbent resin composition is not more than 1 ppm of the water-absorbent resin composition.
    Type: Grant
    Filed: December 12, 2000
    Date of Patent: October 22, 2002
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Koji Miyake, Shinichi Fujino, Masatoshi Nakamura, Katsuyuki Wada
  • Patent number: D520912
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: May 16, 2006
    Assignee: Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Mark Adam Knight, Ryo Nishizawa, Masatoshi Nakamura, Seiichi Ino